摘要:
An imaging assembly, which is particularly useful for a video camera unit, comprising a set of lenses, some of which have a non-refractive surface, and an image sensor. A holder is provided for holding both the set of lenses and the image sensor to be aligned with one another. Circuitry is also provided so that the sensitivity of the image sensor can be electrically varied.
摘要:
A video camera unit is separated into a holder for receiving lenses and a base on which a solid-state image pickup chip is mounted. The holder and the base are assembled together with the distance between them made variable so that it is possible to adjust the back focus of the lens. Further, a video camera unit has a holder which is separated into a first holder for receiving lenses and a second holder for receiving a solid-state image pickup device so that both holders can be assembled together with the distance between them made variable. Therefore, it is also possible to adjust the back focus of the lens.
摘要:
A packaging structure is provided which is especially useful for solid-state imaging devices and other semiconductor devices. An Al film is selectively formed on inner lead portions and portions of positioning reference plates located within a ceramic packaging body. On the other hand, the outer lead portions that are exposed outside the packaging body are coated with Sn plating layer. Particular care is taken not to locate the Sn plating layer over the Al film. Contamination faults due to Sn swelling and stripping are prevented, while bonding strength of the Al clad inner lead portions with Al internal fine wires and with fit glass joining the ceramic packaging body together is kept high.