公开(公告)号：US5223746A

公开(公告)日：1993-06-29

申请号：US847269

申请日：1992-03-10

申请人： Hironobu Abe ,  Masahiko Kadowaki ,  Toshio Nakano ,  Hideaki Abe ,  Akiya Izumi ,  Tunehisa Horiuchi ,  Yoshinori Niwata

发明人： Hironobu Abe ,  Masahiko Kadowaki ,  Toshio Nakano ,  Hideaki Abe ,  Akiya Izumi ,  Tunehisa Horiuchi ,  Yoshinori Niwata

IPC分类号： H01L23/057 ,  H01L23/495 ,  H01L23/544 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L23/057 ,  H01L23/49582 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181

摘要： A packaging structure is provided which is especially useful for solid-state imaging devices and other semiconductor devices. An Al film is selectively formed on inner lead portions and portions of positioning reference plates located within a ceramic packaging body. On the other hand, the outer lead portions that are exposed outside the packaging body are coated with Sn plating layer. Particular care is taken not to locate the Sn plating layer over the Al film. Contamination faults due to Sn swelling and stripping are prevented, while bonding strength of the Al clad inner lead portions with Al internal fine wires and with fit glass joining the ceramic packaging body together is kept high.

摘要翻译： 提供了对于固态成像装置和其它半导体装置特别有用的封装结构。 在内部引线部分和位于陶瓷封装体内的定位基准板的部分选择性地形成Al膜。 另一方面，暴露在包装体外部的外引线部分涂覆有Sn镀层。 特别注意不要在Al膜上定位Sn镀层。 防止由于Sn溶胀和剥离引起的污染缺陷，而Al包覆内引线部分与Al内部细线和将陶瓷封装体接合的合适玻璃的粘合强度保持较高。

公开(公告)号：US5673083A

公开(公告)日：1997-09-30

申请号：US381283

申请日：1995-01-31

申请人： Akiya Izumi ,  Iwao Takemoto ,  Hiroichi Sokei ,  Masahiko Kadowaki ,  Takamasa Naito ,  Hiroyoshi Kojima ,  Atsumu Iguchi ,  Masaaki Yokoyama ,  Junichirou Nakajima ,  Masayuki Takahashi ,  Kunio Niwa

发明人： Akiya Izumi ,  Iwao Takemoto ,  Hiroichi Sokei ,  Masahiko Kadowaki ,  Takamasa Naito ,  Hiroyoshi Kojima ,  Atsumu Iguchi ,  Masaaki Yokoyama ,  Junichirou Nakajima ,  Masayuki Takahashi ,  Kunio Niwa

IPC分类号： G02B7/02 ,  G02B9/12 ,  G02B9/34 ,  H04N5/225

CPC分类号： G02B9/12 ,  G02B9/34 ,  H04N5/2253 ,  G02B7/021

摘要： A video camera unit is separated into a holder for receiving lenses and a base on which a solid-state image pickup chip is mounted. The holder and the base are assembled together with the distance between them made variable so that it is possible to adjust the back focus of the lens. Further, a video camera unit has a holder which is separated into a first holder for receiving lenses and a second holder for receiving a solid-state image pickup device so that both holders can be assembled together with the distance between them made variable. Therefore, it is also possible to adjust the back focus of the lens.

摘要翻译： 摄像机单元被分离成用于接收透镜的保持器和安装有固态图像拾取芯片的基座。 保持器和基座组装在一起，它们之间的距离变化，使得可以调节透镜的后焦距。 此外，摄像机单元具有分离成用于接收透镜的第一保持器和用于接收固态图像拾取装置的第二保持器的保持器，使得两个保持器可以组装在一起，并且它们之间的距离变化。 因此，也可以调整透镜的后焦点。

公开(公告)号：US5274456A

公开(公告)日：1993-12-28

申请号：US823617

申请日：1992-01-21

申请人： Akiya Izumi ,  Iwao Takemoto ,  Hiroichi Sokei ,  Masahiko Kadowaki ,  Atsumu Iguchi ,  Junichiro Nakajima ,  Masayuki Takahashi ,  Kunio Niwa

发明人： Akiya Izumi ,  Iwao Takemoto ,  Hiroichi Sokei ,  Masahiko Kadowaki ,  Atsumu Iguchi ,  Junichiro Nakajima ,  Masayuki Takahashi ,  Kunio Niwa

IPC分类号： H04N5/225 ,  H04N5/369 ,  H04N5/30

CPC分类号： H04N5/2254 ,  H04N3/1512 ,  H04N5/353

摘要： An imaging assembly, which is particularly useful for a video camera unit, comprising a set of lenses, some of which have a non-refractive surface, and an image sensor. A holder is provided for holding both the set of lenses and the image sensor to be aligned with one another. Circuitry is also provided so that the sensitivity of the image sensor can be electrically varied.

摘要翻译： 一种对于摄像机单元特别有用的成像组件，包括一组透镜，其中一些具有非折射表面和图像传感器。 提供保持器以保持所述一组透镜和图像传感器彼此对准。 还提供了电路，使得图像传感器的灵敏度可以电气变化。