BAW resonators with antisymmetric thick electrodes

    公开(公告)号:US11695390B2

    公开(公告)日:2023-07-04

    申请号:US17130915

    申请日:2020-12-22

    Applicant: Akoustis, Inc.

    Abstract: A resonator circuit device. This device can include a piezoelectric layer having a front-side electrode and a back-side electrode spatially configured on opposite sides of the piezoelectric layer. Each electrode has a connection region and a resonator region. Each electrode also includes a partial mass-loaded structure configured within a vicinity of its connection region. The front-side electrode and the back-side electrode are spatially configured in an anti-symmetrical manner with the resonator regions of both electrodes at least partially overlapping and the first and second connection regions on opposing sides. This configuration provides a symmetric acoustic impedance profile for improved Q factor and can reduce the issues of misalignment or unbalanced boundary conditions associated with conventional single mass-loaded perimeter configurations.

    BAW RESONATORS WITH ANTISYMMETRIC THICK ELECTRODES

    公开(公告)号:US20230336151A1

    公开(公告)日:2023-10-19

    申请号:US18339939

    申请日:2023-06-22

    Applicant: Akoustis, Inc.

    Abstract: A resonator circuit device. This device can include a piezoelectric layer having a front-side electrode and a back-side electrode spatially configured on opposite sides of the piezoelectric layer. Each electrode has a connection region and a resonator region. Each electrode also includes a partial mass-loaded structure configured within a vicinity of its connection region. The front-side electrode and the back-side electrode are spatially configured in an anti-symmetrical manner with the resonator regions of both electrodes at least partially overlapping and the first and second connection regions on opposing sides. This configuration provides a symmetric acoustic impedance profile for improved Q factor and can reduce the issues of misalignment or unbalanced boundary conditions associated with conventional single mass-loaded perimeter configurations.

    BULK ACOUSTIC WAVE RESONATOR FILTERS WITH INTEGRATED CAPACITORS

    公开(公告)号:US20220182039A1

    公开(公告)日:2022-06-09

    申请号:US17110675

    申请日:2020-12-03

    Applicant: Akoustis,Inc.

    Abstract: A device includes a piezoelectric layer on a substrate and including a portion included in an acoustic resonator, a first conductive layer on the piezoelectric layer and including a first electrode of the acoustic resonator on a first side of resonator portion of the piezoelectric layer, and a second conductive layer on the piezoelectric layer and including a second electrode of the acoustic resonator on a second side of the resonator portion of the piezoelectric layer. An insulating layer is disposed on the second conductive layer and an interconnection metal layer is electrically connected to the second conductive layer or the first conductive layer and has a portion extending onto the insulating layer and overlapping a portion of the second conductive layer to provide a capacitor electrode of a capacitor coupled to the first electrode and/or the second electrode.

    Bulk acoustic wave resonator filters with integrated capacitors

    公开(公告)号:US11870422B2

    公开(公告)日:2024-01-09

    申请号:US17110675

    申请日:2020-12-03

    Applicant: Akoustis, Inc.

    CPC classification number: H03H9/542 H03H3/02

    Abstract: A device includes a piezoelectric layer on a substrate and including a portion included in an acoustic resonator, a first conductive layer on the piezoelectric layer and including a first electrode of the acoustic resonator on a first side of resonator portion of the piezoelectric layer, and a second conductive layer on the piezoelectric layer and including a second electrode of the acoustic resonator on a second side of the resonator portion of the piezoelectric layer. An insulating layer is disposed on the second conductive layer and an interconnection metal layer is electrically connected to the second conductive layer or the first conductive layer and has a portion extending onto the insulating layer and overlapping a portion of the second conductive layer to provide a capacitor electrode of a capacitor coupled to the first electrode and/or the second electrode.

    METHODS OF FORMING PIEZOELECTRIC RESONATOR DEVICES INCLUDING EMBEDDED ENERGY CONFINEMENT FRAMES

    公开(公告)号:US20230299733A1

    公开(公告)日:2023-09-21

    申请号:US18185577

    申请日:2023-03-17

    Applicant: Akoustis, Inc.

    CPC classification number: H03H3/02

    Abstract: A piezoelectric resonator device can be formed to include a piezoelectric film including an active area configured to provide a thickness excited mode of vibration, a first electrode on a first surface of the piezoelectric film positioned to electromechanically couple to the active area, a second electrode on a second surface of the piezoelectric film, opposite the first surface, the second electrode positioned to electromechanically couple to the active area, an energy confinement frame extending on the piezoelectric film embedded in the first or second electrode, an inner side wall of the energy confinement frame facing toward the active area and extending around the active area to define a perimeter that separates the active area located inside the perimeter from an outer area located outside the perimeter adjacent to the active area, an outer side wall of the energy confinement frame facing toward the outer area and aligned to an outer side wall of the first or second electrode and a conformal low-impedance acoustic layer extending on the active area over the energy confinement frame to cover the outer side wall of the energy confinement frame, and onto the piezoelectric film in the outer area.

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