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公开(公告)号：US08507804B2
公开(公告)日：2013-08-13
申请号：US12710189
申请日：2010-02-22
IPC分类号： H05K1/09
CPC分类号： H01R12/52 , G01R1/0416 , H05K3/32 , H05K3/3436 , H05K2201/09827 , H05K2201/10378 , H05K2203/0278 , H05K2203/162 , Y02P70/613
摘要： An electrical connector is provided for mating with an electrical component. The connector includes a substrate having a mating side, and a solder column extending from the mating side of the substrate. The solder column includes a base that is engaged with the substrate. The solder column extends a length away from the mating side of the substrate to a tip. The tip includes a contact surface that is configured to engage and electrically connect to an electrical contact of the electrical component. The solder column is linearly tapered along at least a portion of the length from the base to the tip.
摘要翻译： 提供电连接器用于与电气部件配合。 连接器包括具有配合侧的基板和从基板的配合侧延伸的焊料柱。 焊料柱包括与基底接合的基底。 焊料柱从衬底的配合侧向尖端延伸一段长度。 尖端包括被配置为接合并电连接到电气部件的电触点的接触表面。 焊料柱沿着从基部到尖端的长度的至少一部分线性渐缩。
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公开(公告)号：US20110203838A1
公开(公告)日：2011-08-25
申请号：US12710189
申请日：2010-02-22
IPC分类号： H01R12/04
CPC分类号： H01R12/52 , G01R1/0416 , H05K3/32 , H05K3/3436 , H05K2201/09827 , H05K2201/10378 , H05K2203/0278 , H05K2203/162 , Y02P70/613
摘要： An electrical connector is provided for mating with an electrical component. The connector includes a substrate having a mating side, and a solder column extending from the mating side of the substrate. The solder column includes a base that is engaged with the substrate. The solder column extends a length away from the mating side of the substrate to a tip. The tip includes a contact surface that is configured to engage and electrically connect to an electrical contact of the electrical component. The solder column is linearly tapered along at least a portion of the length from the base to the tip.
摘要翻译： 提供电连接器用于与电气部件配合。 连接器包括具有配合侧的基板和从基板的配合侧延伸的焊料柱。 焊料柱包括与基底接合的基底。 焊料柱从衬底的配合侧向尖端延伸一段长度。 尖端包括被配置为接合并电连接到电气部件的电触点的接触表面。 焊料柱沿着从基部到尖端的长度的至少一部分线性渐缩。
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公开(公告)号：US07316064B2
公开(公告)日：2008-01-08
申请号：US11213496
申请日：2005-08-26
IPC分类号： H01R43/00
CPC分类号： C25D5/50 , C25D17/00 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49222
摘要： A method for manufacturing an electrical contact includes providing a series of electrical contacts joined on a carrier strip to a plating station followed by an induction heating station. At the plating station, plating the electrical contacts with a conductive alloy coating to form coated electrical contacts. At the induction heating station, induction heating the coated electrical contacts.
摘要翻译： 一种用于制造电接触的方法包括提供一系列接合在载体带上的电触点到电镀站，随后是感应加热站。 在电镀站，用导电合金涂层电镀电触点，形成涂层电触点。 在感应加热站，感应加热涂层电接点。
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公开(公告)号：US07568917B1
公开(公告)日：2009-08-04
申请号：US12013182
申请日：2008-01-11
申请人： Charles Randall Malstrom , George Jyh-Shann Chou , Robert Daniel Hilty , Michael Fredrick Laub , Peter David Wapenski
发明人： Charles Randall Malstrom , George Jyh-Shann Chou , Robert Daniel Hilty , Michael Fredrick Laub , Peter David Wapenski
IPC分类号： H01R12/00
CPC分类号： H01R13/2435 , H01R31/085
摘要： A laminated electrical contact strip includes a plurality of electrical contacts. Each electrical contact includes a pair of opposite first and second surfaces extending between a pair of opposite end portions. A pair of first and second dielectric layers are laminated over the plurality of electrical contacts such that the first and second dielectric layers hold the plurality of electrical contacts therebetween. The first dielectric layer is bonded to and covers a portion of the first surface of each of the electrical contacts. The second dielectric layer is bonded to and covers a portion of the second surface of each of the electrical contacts.
摘要翻译： 层叠的电接触条包括多个电触点。 每个电触点包括在一对相对端部之间延伸的一对相对的第一和第二表面。 一对第一和第二电介质层层压在多个电触点上，使得第一和第二电介质层将多个电触头保持在其间。 第一电介质层被接合并覆盖每个电触点的第一表面的一部分。 第二电介质层被接合并覆盖每个电触点的第二表面的一部分。
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公开(公告)号：US20090181559A1
公开(公告)日：2009-07-16
申请号：US12013182
申请日：2008-01-11
申请人： Charles Randall Malstrom , George Jyh-Shann Chou , Robert Daniel Hilty , Michael Fredrick Laub , Peter David Wapenski
发明人： Charles Randall Malstrom , George Jyh-Shann Chou , Robert Daniel Hilty , Michael Fredrick Laub , Peter David Wapenski
IPC分类号： H01R12/00
CPC分类号： H01R13/2435 , H01R31/085
摘要： A laminated electrical contact strip includes a plurality of electrical contacts. Each electrical contact includes a pair of opposite first and second surfaces extending between a pair of opposite end portions. A pair of first and second dielectric layers are laminated over the plurality of electrical contacts such that the first and second dielectric layers hold the plurality of electrical contacts therebetween. The first dielectric layer is bonded to and covers a portion of the first surface of each of the electrical contacts. The second dielectric layer is bonded to and covers a portion of the second surface of each of the electrical contacts.
摘要翻译： 层叠的电接触条包括多个电触点。 每个电触点包括在一对相对端部之间延伸的一对相对的第一和第二表面。 一对第一和第二电介质层层压在多个电触点上，使得第一和第二电介质层将多个电触头保持在其间。 第一电介质层被接合并覆盖每个电触点的第一表面的一部分。 第二电介质层被接合并覆盖每个电触点的第二表面的一部分。
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公开(公告)号：US08574722B2
公开(公告)日：2013-11-05
申请号：US13103552
申请日：2011-05-09
IPC分类号： B32B15/01
CPC分类号： H01B1/02 , C23C28/02 , C23C28/023 , C23C28/028 , Y10T428/12479 , Y10T428/12715 , Y10T428/12722 , Y10T428/12889 , Y10T428/12944
摘要： An electrical conductor has a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interface layers with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.
摘要翻译： 电导体具有金属基板。 在金属基板的外部设置有密封镀层。 在密封镀层的外部设置镀镍层。 在镀镍层的外部设置镀金层。 密封镀层是非镍基金属。 可选地，密封镀层可以是锡基的。 可选地，密封镀层可以与镍镀层和金属衬底形成金属间界面层。 可选地，电导体可以构成用于与印刷电路板或另一配合触点中的至少一个配合的触点。
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公开(公告)号：US07147729B2
公开(公告)日：2006-12-12
申请号：US10073488
申请日：2002-02-11
IPC分类号： C21D1/10
摘要： A method and apparatus are provided in accordance with embodiments of the present invention for heat-treating electrical contacts. The method and apparatus include plating a core wire with at least one conductive coating to form an electrical contact that experiences internal stresses. The method and apparatus further include induction heating the electrical contact for a predetermined period of time to at least partially relieve the internal stresses. A plurality of electrical contacts may be mounted on a substrate that is held near induction coils to cause heating. The electrical contacts may be formed with spring shaped bodies that are aligned at a desired orientation within magnetic fields created during induction heating. In accordance with at least one embodiment of the present invention, different portions of each electrical contact may be annealed by different desired amounts. The electrical contacts are annealed such that a base portion of each electrical contact undergoes less annealing to retain superior strength properties and the flexible portion of the electrical contact which retains superior stress-relaxation properties.
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