公开(公告)号：US20080230092A1

公开(公告)日：2008-09-25

申请号：US11690405

申请日：2007-03-23

申请人： Alexander Sou-Kang Ko ,  Jianshe Tang ,  Brian J. Brown ,  Richard R. Endo ,  Steven Verhaverbeke ,  Cole Franklin ,  Dennis J. Yost ,  Runzi Chang

发明人： Alexander Sou-Kang Ko ,  Jianshe Tang ,  Brian J. Brown ,  Richard R. Endo ,  Steven Verhaverbeke ,  Cole Franklin ,  Dennis J. Yost ,  Runzi Chang

IPC分类号： B08B3/00

CPC分类号： B08B7/00 ,  B08B3/024 ,  B08B3/08 ,  H01L21/67051

摘要： A single-substrate cleaning apparatus and method of use are described. In an embodiment of the present invention, a liquid cleaning solution is dispensed in small volumes to form a substantially uniform static liquid layer over a substrate surface by atomizing the viscous liquid with an inert gas in a two-phase nozzle. In another embodiment of the present invention, after a layer of the cleaning solution is formed over the substrate to be cleaned, acoustic energy is applied to the substrate to improve the cleaning efficiency. In a further embodiment, cleaning solution precipitates are avoided by dispensing de-ionized water with a spray nozzle to gradually dilute the cleaning solution prior to dispensing de-ionized water with a stream nozzle.

摘要翻译： 对单基板清洗装置及其使用方法进行说明。 在本发明的一个实施例中，通过在两相喷嘴中用惰性气体雾化粘性液体，以小体积分配液体清洗溶液以在基板表面上形成基本均匀的静态液体层。 在本发明的另一个实施方案中，在将清洁溶液层形成在要清洁的基底上之后，将声能施加到基底以提高清洁效率。 在另一个实施方案中，通过用喷嘴分配去离子水以在用流喷嘴分配去离子水之前逐渐稀释清洁溶液来避免清洁溶液沉淀物。

公开(公告)号：US07718009B2

公开(公告)日：2010-05-18

申请号：US10931093

申请日：2004-08-30

申请人： Steven Verhaverbeke ,  Jianshe Tang ,  Roman Gouk ,  Brian J. Brown ,  Han-Wen Chen ,  Ching-Hwa Weng ,  James S. Papanu ,  Dennis Yost

发明人： Steven Verhaverbeke ,  Jianshe Tang ,  Roman Gouk ,  Brian J. Brown ,  Han-Wen Chen ,  Ching-Hwa Weng ,  James S. Papanu ,  Dennis Yost

IPC分类号： C23G1/02

CPC分类号： H01L21/02074 ,  B08B3/08 ,  B08B3/12 ,  C11D7/08 ,  C11D11/0047 ,  C11D11/007 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/0209 ,  H01L21/67051 ,  H01L21/76808 ,  H01L21/76814

摘要： Cleaning solutions and cleaning methods targeted to particular substrates and structures in semiconductor fabrication are described. A method of cleaning fragile structures having a dimension less than 0.15 um with a cleaning solution formed of a solvent having a surface tension less than water while applying acoustic energy to the substrate on which the structures are formed is described. Also, a method of cleaning copper with several different cleaning solutions, and in particular an aqueous sulfuric acid and HF cleaning solution, is described. Also, methods of cleaning both sides of a substrate at the same time with different cleaning solutions applied to the top and the bottom are described.

摘要翻译： 描述了针对半导体制造中的特定衬底和结构的清洁溶液和清洁方法。 描述了一种使用表面张力小于水的溶剂形成的清洁溶液清洁尺寸小于0.15μm的脆弱结构的方法，同时向其上形成结构的基底施加声能。 此外，还描述了用几种不同的清洁溶液，特别是硫酸水溶液和HF清洗溶液清洗铜的方法。 此外，还描述了使用不同的清洁溶液同时清洁基板的两侧的方法，所述清洗溶液应用于顶部和底部。

公开(公告)号：US20080135070A1

公开(公告)日：2008-06-12

申请号：US11609843

申请日：2006-12-12

申请人： Wei Lu ,  Jianshe Tang ,  Alexander Sou-Kang Ko ,  Nelson A. Yee ,  Bo Xie ,  Tseng-Chung Lee

发明人： Wei Lu ,  Jianshe Tang ,  Alexander Sou-Kang Ko ,  Nelson A. Yee ,  Bo Xie ,  Tseng-Chung Lee

IPC分类号： B08B3/02

CPC分类号： B08B3/02 ,  B05B7/0861 ,  H01L21/67051

摘要： An apparatus and a method for cleaning a wafer are described. A chamber has a substrate support. A nozzle is disposed above the substrate support to spray de-ionized water droplets. The nozzle is coupled to a source of de-ionized water and a source of nitrogen. The nozzle is configured to mix the de-ionized water and the nitrogen outside the nozzle to have independent flow rate control of the two fluids for an optimized atomization in terms of spray uniformity in droplet size and velocity distributions. The nozzle to wafer distance can be adjusted and tuned to have an optimized jet spray for efficiently removing particles or contaminants from a surface of a wafer without causing any feature damage.

摘要翻译： 描述了用于清洁晶片的装置和方法。 室具有基板支撑。 喷嘴设置在基板支架上方以喷射去离子水滴。 喷嘴连接到去离子水源和氮源。 喷嘴构造成将去离子水和喷嘴外部的氮混合以具有独立的流速控制两种流体，以便在液滴尺寸和速度分布中的喷雾均匀性方面实现优化的雾化。 喷嘴到晶片间距可以被调节和调整以具有优化的喷射喷雾，以有效地从晶片表面去除颗粒或污染物，而不会造成任何特征损坏。

公开(公告)号：US20080135069A1

公开(公告)日：2008-06-12

申请号：US11977935

申请日：2007-10-25

申请人： Wei Lu ,  Jianshe Tang ,  Alexander Sou-Kang Ko ,  Nelson A. Yee ,  Bo Xie ,  Tseng-Chung Lee

发明人： Wei Lu ,  Jianshe Tang ,  Alexander Sou-Kang Ko ,  Nelson A. Yee ,  Bo Xie ,  Tseng-Chung Lee

IPC分类号： B08B3/02 ,  B08B5/00 ,  B08B11/02

CPC分类号： B08B3/02 ,  B05B7/0861 ,  H01L21/67051

摘要： An apparatus and a method for cleaning a wafer are described. A chamber has a substrate support. A nozzle is disposed above the substrate support to spray de-ionized water droplets. The nozzle is coupled to a source of de-ionized water and a source of nitrogen. The nozzle is configured to mix the de-ionized water and the nitrogen outside the nozzle to have independent flow rate control of the two fluids for an optimized atomization in terms of spray uniformity in droplet size and velocity distributions. The nozzle to wafer distance can be adjusted and tuned to have an optimized jet spray for efficiently removing particles or contaminants from a surface of a wafer without causing any feature damage.

摘要翻译： 描述了用于清洁晶片的装置和方法。 室具有基板支撑。 喷嘴设置在基板支架上方以喷射去离子水滴。 喷嘴连接到去离子水源和氮源。 喷嘴构造成将去离子水和喷嘴外部的氮混合以使得两个流体具有独立的流速控制，以便在液滴尺寸和速度分布的喷雾均匀性方面优化雾化。 喷嘴到晶片间距可以被调节和调整以具有优化的喷射喷雾，以有效地从晶片表面去除颗粒或污染物，而不会造成任何特征损坏。

公开(公告)号：US20060042651A1

公开(公告)日：2006-03-02

申请号：US10931093

申请日：2004-08-30

申请人： Steven Verhaverbeke ,  Jianshe Tang ,  Roman Gouk ,  Brian Brown ,  Han-Wen Chen ,  Ching-Hwa Weng ,  James Papanu ,  Dennis Yost

发明人： Steven Verhaverbeke ,  Jianshe Tang ,  Roman Gouk ,  Brian Brown ,  Han-Wen Chen ,  Ching-Hwa Weng ,  James Papanu ,  Dennis Yost

IPC分类号： B08B3/12

CPC分类号： H01L21/02074 ,  B08B3/08 ,  B08B3/12 ,  C11D7/08 ,  C11D11/0047 ,  C11D11/007 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/0209 ,  H01L21/67051 ,  H01L21/76808 ,  H01L21/76814

摘要： Cleaning solutions and cleaning methods targeted to particular substrates and structures in semiconductor fabrication are described. A method of cleaning fragile structures having a dimension less than 0.15 um with a cleaning solution formed of a solvent having a surface tension less than water while applying acoustic energy to the substrate on which the structures are formed is described. Also, a method of cleaning copper with several different cleaning solutions, and in particular an aqueous sulfuric acid and HF cleaning solution, is described. Also, methods of cleaning both sides of a substrate at the same time with different cleaning solutions applied to the top and the bottom are described.

摘要翻译： 描述了针对半导体制造中的特定衬底和结构的清洁溶液和清洁方法。 描述了一种使用表面张力小于水的溶剂形成的清洁溶液清洁尺寸小于0.15μm的脆弱结构的方法，同时向其上形成结构的基底施加声能。 此外，还描述了用几种不同的清洁溶液，特别是硫酸水溶液和HF清洗溶液清洗铜的方法。 此外，还描述了使用不同的清洁溶液同时清洁基板的两侧的方法，所述清洗溶液应用于顶部和底部。

公开(公告)号：US06345630B2

公开(公告)日：2002-02-12

申请号：US09738797

申请日：2000-12-15

申请人： Boris Fishkin ,  Jianshe Tang ,  Brian J. Brown

发明人： Boris Fishkin ,  Jianshe Tang ,  Brian J. Brown

IPC分类号： B08B310

CPC分类号： H01L21/67051 ,  H01L21/67046 ,  Y10S134/902

摘要： An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.

摘要翻译： 提供了一种创新的边缘清洁装置，用于清洁边缘诸如半导体晶片的薄盘。 本发明的边缘清洁装置具有定位成在薄盘的边缘表面处引导液体射流的声波喷嘴。 优选地，声波喷嘴与薄盘的边缘径向间隔开，使得当由声波喷嘴清洁薄盘边缘时，可以在薄盘的主表面上同时进行洗涤，旋转漂洗或旋转清洁。 液体射流可以包括去离子水，NH 4 OH，KOH，TMAH，HF，柠檬酸，表面活性剂或其他类似的清洁溶液，并且当薄盘旋转时喷嘴可以保持静止，或者喷嘴可以扫描薄盘的圆周 以清洁薄片的整个边缘。

公开(公告)号：US06276371B1

公开(公告)日：2001-08-21

申请号：US09589463

申请日：2000-06-07

申请人： Boris Fishkin ,  Brian J. Brown ,  Jianshe Tang

发明人： Boris Fishkin ,  Brian J. Brown ,  Jianshe Tang

IPC分类号： B08B312

CPC分类号： H01L21/67057 ,  Y10S134/902

摘要： A method and apparatus for cleaning wafer edges is provided. The inventive wafer cleaner employs a transducer equal in length to the diameter of a wafer to be cleaned, and positioned to direct sonic energy in line with the wafer's edge. Supporting and rotating mechanisms are positioned along the wafer's edge, outside of the transducer's high energy field, and preferably such that approximately 50 percent of the wafer is positioned between the wafer supports and the transducer. Therefore, minimal sonic energy is blocked from reaching the wafer's surface. The transducer dimensions relative to the wafer, and the positioning of the wafer supports relative to the transducer enable the system to achieve an approximately 50 percent edge cleaning duty cycle as the wafer is rotated.

摘要翻译： 提供了一种用于清洁晶片边缘的方法和装置。 本发明的晶片清洁器采用与要清洁的晶片的直径相等的换能器，并定位成引导与晶片边缘一致的声能。 支撑和旋转机构沿着晶片的边缘定位在换能器的高能场外部，并且优选地使得大约50％的晶片位于晶片支架和换能器之间。 因此，最小的声能被阻止到达晶片的表面。 相对于晶片的换能器尺寸以及晶片支撑件相对于换能器的定位使得系统能够在晶片旋转时实现大约50％的边缘清洁占空比。

公开(公告)号：US06202658B1

公开(公告)日：2001-03-20

申请号：US09191061

申请日：1998-11-11

申请人： Boris Fishkin ,  Jianshe Tang ,  Brian J. Brown

发明人： Boris Fishkin ,  Jianshe Tang ,  Brian J. Brown

IPC分类号： B08B310

CPC分类号： H01L21/67051 ,  H01L21/67046 ,  Y10S134/902

摘要： An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include de-ionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.

摘要翻译： 提供了一种创新的边缘清洁装置，用于清洁边缘诸如半导体晶片的薄盘。 本发明的边缘清洁装置具有定位成在薄盘的边缘表面处引导液体射流的声波喷嘴。 优选地，声波喷嘴与薄盘的边缘径向间隔开，使得当由声波喷嘴清洁薄盘边缘时，可以在薄盘的主表面上同时进行洗涤，旋转漂洗或旋转清洁。 液体射流可以包括去离子水，NH 4 OH，KOH，TMAH，HF，柠檬酸，表面活性剂或其它类似的清洁溶液，并且当薄盘旋转时喷嘴可以保持静止，或者喷嘴可以扫描 薄光盘清洁光盘的整个边缘。

公开(公告)号：US06148833A

公开(公告)日：2000-11-21

申请号：US191058

申请日：1998-11-11

申请人： Jianshe Tang ,  Brian J. Brown ,  Boris Fishkin

发明人： Jianshe Tang ,  Brian J. Brown ,  Boris Fishkin

IPC分类号： B08B3/12 ,  H01L21/00 ,  H01L21/304

CPC分类号： H01L21/67057 ,  B08B3/12 ,  Y10S134/902

摘要： A sonic tank for cleaning substrates is provided. The tank has two or more upwardly angled walls. Arrays of one or more transducers are positioned along at least two of the two or more angled walls. The transducer arrays are alternately energized maintaining nearly 100% substrate surface cleaning at any given time, and 50% duty cycle (or less) for each transducer array. The substrate supports are positioned such that nearly every point along the substrate's surface is contacted by energy from at least one transducer, and transducer opposing walls are positioned to avoid interfering reflections therefrom.

公开(公告)号：US06855043B1

公开(公告)日：2005-02-15

申请号：US09611247

申请日：2000-07-07

申请人： Jianshe Tang ,  Brian J. Brown ,  Charles C. Garretson ,  Benjamin A. Bonner ,  Thomas H. Osterheld ,  Fred C. Redeker

发明人： Jianshe Tang ,  Brian J. Brown ,  Charles C. Garretson ,  Benjamin A. Bonner ,  Thomas H. Osterheld ,  Fred C. Redeker

IPC分类号： B24B37/30 ,  B24B37/32 ,  H01L21/304 ,  B24B47/02

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate and a retaining ring. The friction coefficient of the lower surface of the flexible membrane is increased to prevent contact between the substrate and the retaining ring, thereby preventing slurry compaction and buildup and substrate deformation caused by such contact.

摘要翻译： 用于化学机械抛光装置的载体头包括向基材和保持环施加载荷的柔性膜。 增加柔性膜的下表面的摩擦系数，以防止基板与保持环之间的接触，从而防止由此引起的浆料压实和堆积以及基板变形。