BACK CONTACT TO FILM SILICON ON METAL FOR PHOTOVOLTAIC CELLS
    1.
    发明申请
    BACK CONTACT TO FILM SILICON ON METAL FOR PHOTOVOLTAIC CELLS 审中-公开
    返回联系FILM SILICON ON METAL FOR PHOTOVOLTAIC CELLS

    公开(公告)号:US20140141563A1

    公开(公告)日:2014-05-22

    申请号:US14173324

    申请日:2014-02-05

    IPC分类号: H01L31/18

    摘要: Systems and Methods for back contact to film silicon on metal for photovoltaic cells are provided. In one embodiment, a method for creating a conductive pathway in a photovoltaic cell comprises: obtaining a layered photovoltaic device comprising: a metal substrate with a crystal orientation; a crystal semiconductor layer with the crystal orientation; and a heteroepitaxially grown buffer layer positioned between the substrate and the crystal semiconductor layer; and forming one or more conductive pathways between the crystal semiconductor layer and the metal substrate, the pathways being through at least a portion of the buffer layer.

    摘要翻译: 提供了用于光电池的用于金属的薄膜硅背面接触的系统和方法。 在一个实施例中,用于在光伏电池中产生导电通路的方法包括:获得层状光伏器件,其包括:具有晶体取向的金属衬底; 具有晶体取向的晶体半导体层; 以及位于所述基板和所述晶体半导体层之间的异质外延生长缓冲层; 以及在所述晶体半导体层和所述金属衬底之间形成一个或多个导电路径,所述路径通过所述缓冲层的至少一部分。

    Forming high-efficiency silicon solar cells using density-graded anti-reflection surfaces
    2.
    发明授权
    Forming high-efficiency silicon solar cells using density-graded anti-reflection surfaces 有权
    使用密度梯度防反射表面形成高效硅太阳能电池

    公开(公告)号:US09076903B2

    公开(公告)日:2015-07-07

    申请号:US14150221

    申请日:2014-01-08

    摘要: A method (50) is provided for processing a graded-density AR silicon surface (14) to provide effective surface passivation. The method (50) includes positioning a substrate or wafer (12) with a silicon surface (14) in a reaction or processing chamber (42). The silicon surface (14) has been processed (52) to be an AR surface with a density gradient or region of black silicon. The method (50) continues with heating (54) the chamber (42) to a high temperature for both doping and surface passivation. The method (50) includes forming (58), with a dopant-containing precursor in contact with the silicon surface (14) of the substrate (12), an emitter junction (16) proximate to the silicon surface (14) by doping the substrate (12). The method (50) further includes, while the chamber is maintained at the high or raised temperature, forming (62) a passivation layer (19) on the graded-density silicon anti-reflection surface (14).

    摘要翻译: 提供了一种用于处理渐变密度的AR硅表面(14)以提供有效的表面钝化的方法(50)。 方法(50)包括将具有硅表面(14)的衬底或晶片(12)定位在反应或处理室(42)中。 硅表面(14)已被处理(52)为具有密度梯度或黑色硅区域的AR表面。 方法(50)继续将腔室(42)加热(54)至用于掺杂和表面钝化的高温。 所述方法(50)包括通过与衬底(12)的硅表面(14)接触的含掺杂剂的前体形成(58),通过掺杂所述衬底(12)的接近硅表面的发射极结(16) 衬底(12)。 所述方法(50)还包括当所述室保持在高或升高温度时,在所述渐变密度硅抗反射表面(14)上形成(62)钝化层(19)。

    High sensitivity, solid state neutron detector
    3.
    发明授权
    High sensitivity, solid state neutron detector 有权
    高灵敏度,固态中子探测器

    公开(公告)号:US09029792B2

    公开(公告)日:2015-05-12

    申请号:US14026429

    申请日:2013-09-13

    摘要: An apparatus (200) for detecting slow or thermal neutrons (160). The apparatus (200) includes an alpha particle-detecting layer (240) that is a hydrogenated amorphous silicon p-i-n diode structure. The apparatus includes a bottom metal contact (220) and a top metal contact (250) with the diode structure (240) positioned between the two contacts (220, 250) to facilitate detection of alpha particles (170). The apparatus (200) includes a neutron conversion layer (230) formed of a material containing boron-10 isotopes. The top contact (250) is pixilated with each contact pixel extending to or proximate to an edge of the apparatus to facilitate electrical contacting. The contact pixels have elongated bodies to allow them to extend across the apparatus surface (242) with each pixel having a small surface area to match capacitance based upon a current spike detecting circuit or amplifier connected to each pixel. The neutron conversion layer (860) may be deposited on the contact pixels (830) such as with use of inkjet printing of nanoparticle ink.

    摘要翻译: 一种用于检测慢或热中子(160)的装置(200)。 装置(200)包括作为氢化非晶硅p-i-n二极管结构的α粒子检测层(240)。 该装置包括底部金属触点(220)和顶部金属触点(250),二极管结构(240)位于两个触点(220,250)之间,以便于检测α粒子(170)。 装置(200)包括由含有硼-10同位素的材料形成的中子转换层(230)。 顶部接触(250)被像素化,每个接触像素延伸到或靠近设备的边缘以促进电接触。 接触像素具有细长体以允许它们跨过装置表面(242)延伸,每个像素具有小的表面积,以基于连接到每个像素的电流尖峰检测电路或放大器来匹配电容。 中子转换层(860)可以沉积在接触像素(830)上,例如使用纳米颗粒油墨的喷墨印刷。

    FORMING HIGH-EFFICIENCY SILICON SOLAR CELLS USING DENSITY-GRADED ANTI-REFLECTION SURFACES
    4.
    发明申请
    FORMING HIGH-EFFICIENCY SILICON SOLAR CELLS USING DENSITY-GRADED ANTI-REFLECTION SURFACES 有权
    使用密度级抗反射表面形成高效硅太阳能电池

    公开(公告)号:US20140127850A1

    公开(公告)日:2014-05-08

    申请号:US14150221

    申请日:2014-01-08

    IPC分类号: H01L31/0232

    摘要: A method (50) is provided for processing a graded-density AR silicon surface (14) to provide effective surface passivation. The method (50) includes positioning a substrate or wafer (12) with a silicon surface (14) in a reaction or processing chamber (42). The silicon surface (14) has been processed (52) to be an AR surface with a density gradient or region of black silicon. The method (50) continues with heating (54) the chamber (42) to a high temperature for both doping and surface passivation. The method (50) includes forming (58), with a dopant-containing precursor in contact with the silicon surface (14) of the substrate (12), an emitter junction (16) proximate to the silicon surface (14) by doping the substrate (12). The method (50) further includes, while the chamber is maintained at the high or raised temperature, forming (62) a passivation layer (19) on the graded-density silicon anti-reflection surface (14).

    摘要翻译: 提供了一种用于处理渐变密度的AR硅表面(14)以提供有效的表面钝化的方法(50)。 方法(50)包括将具有硅表面(14)的衬底或晶片(12)定位在反应或处理室(42)中。 硅表面(14)已被处理(52)为具有密度梯度或黑色硅区域的AR表面。 方法(50)继续将腔室(42)加热(54)至用于掺杂和表面钝化的高温。 所述方法(50)包括通过与衬底(12)的硅表面(14)接触的含掺杂剂的前体形成(58),通过掺杂所述硅表面(14)的发射极结(16) 衬底(12)。 所述方法(50)还包括当所述室保持在高或升高温度时,在所述渐变密度硅抗反射表面(14)上形成(62)钝化层(19)。