公开(公告)号：US10347562B1

公开(公告)日：2019-07-09

申请号：US15663024

申请日：2017-07-28

申请人： Amkor Technology, Inc.

发明人： Louis W. Nicholls ,  Roger D. St. Amand ,  Jin Seong Kim ,  Woon Kab Jung ,  Sung Jin Yang ,  Robert F. Darveaux

IPC分类号： H01L23/48

摘要： A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.

公开(公告)号：US10418318B1

公开(公告)日：2019-09-17

申请号：US16276151

申请日：2019-02-14

申请人： Amkor Technology, Inc.

发明人： Robert Francis Darveaux ,  David McCann ,  John McCormick ,  Louis W. Nicholls

IPC分类号： H01L21/56 ,  H01L23/498 ,  H01L23/00

摘要： An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.

公开(公告)号：US20190371706A1

公开(公告)日：2019-12-05

申请号：US16373357

申请日：2019-04-02

申请人： Amkor Technology, Inc.

发明人： Louis W. Nicholls ,  Roger D. St. Amand ,  Jin Seong Kim ,  Woon Kab Jung ,  Sung Jin Yang ,  Robert F. Darveaux

IPC分类号： H01L23/48

摘要： A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.

公开(公告)号：US10224270B1

公开(公告)日：2019-03-05

申请号：US15284242

申请日：2016-10-03

申请人： Amkor Technology, Inc.

发明人： Robert Francis Darveaux ,  David McCann ,  John McCormick ,  Louis W. Nicholls

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L21/56

摘要： An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.

公开(公告)号：US09462690B1

公开(公告)日：2016-10-04

申请号：US13963635

申请日：2013-08-09

申请人： Amkor Technology, Inc.

发明人： Robert Francis Darveaux ,  David McCann ,  John McCormick ,  Louis W. Nicholls

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K7/10 ,  H05K7/12 ,  H05K3/00

CPC分类号： H05K1/111 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/1146 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13013 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1412 ,  H01L2224/14133 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/15311 ,  H05K3/00 ,  H05K3/3436 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/206 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.

公开(公告)号：US10714408B2

公开(公告)日：2020-07-14

申请号：US16373357

申请日：2019-04-02

申请人： Amkor Technology, Inc.

发明人： Louis W. Nicholls ,  Roger D. St. Amand ,  Jin Seong Kim ,  Woon Kab Jung ,  Sung Jin Yang ,  Robert F. Darveaux

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538

摘要： A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.

公开(公告)号：US20200219802A1

公开(公告)日：2020-07-09

申请号：US16571565

申请日：2019-09-16

申请人： Amkor Technology, Inc.

发明人： Robert Francis Darveaux ,  David McCann ,  John McCormick ,  Louis W. Nicholls

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H05K1/11 ,  H05K3/00

摘要： An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.