公开(公告)号：US20140001580A1

公开(公告)日：2014-01-02

申请号：US13925076

申请日：2013-06-24

Applicant: Analog Devices, Inc.

Inventor： David Bolognia ,  Kieran P. Harney

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC classification number: B81C1/00333 ,  B81B3/0094 ,  B81B7/0032 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/16152 ,  H04R19/005 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

Abstract translation: 封装集成器件包括具有第一表面和与第一表面相对的第二表面的封装衬底，并且封装衬底具有穿过其中的孔。 集成器件封装还包括安装在封装衬底的第一表面上以限定第一腔的第一盖和安装在封装衬底的第二表面上以限定第二腔的第二盖。 微机电系统（MEMS）管芯可以安装在封装衬底的第一表面的第一腔内和孔的上方。 可以在第一盖或第二盖中形成端口。

公开(公告)号：US08767982B2

公开(公告)日：2014-07-01

申请号：US13661401

申请日：2012-10-26

Applicant: Analog Devices, Inc.

Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

IPC: H04R25/00

CPC classification number: H04R1/342 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/04 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract translation: 麦克风模块具有带孔的基板，以允许声波通过基板，安装到基板上以限定第一内部空间的盖，安装到第一内部空间内的基板的麦克风以及耦合到该基板的壳体 衬底并覆盖孔径。 壳体形成第二内部容积并且包括被配置为允许声音进入第二内部容积的声学端口。 模块还包括从壳体中的声学接口延伸的管道，以及在第二内部容积体外部的至少一个外部接口焊盘。 管道具有接收声波的开口端，并将它们引导到壳体中的声学端口。 此外，至少一个外部接口垫电连接到麦克风。

公开(公告)号：US20130236037A1

公开(公告)日：2013-09-12

申请号：US13871177

申请日：2013-04-26

Applicant: ANALOG DEVICES, INC.

Inventor： Jason W. Weigold ,  Kieran P. Harney

IPC: H04R1/08

CPC classification number: H04R1/083 ,  H04R1/406 ,  H04R19/005 ,  H04R19/04

Abstract: A microphone system implements multiple microphones on a single base. To that end, the microphone system has a base, and a plurality of substantially independently movable diaphragms secured to the base. Each of the plurality of diaphragms forms a variable capacitance with the base and thus, each diaphragm effectively forms a generally independent, separate microphone with the base.

Abstract translation: 麦克风系统在单个基座上实现多个麦克风。 为此，麦克风系统具有基座和固定到基座的多个基本可独立移动的隔膜。 多个隔膜中的每一个与基座形成可变电容，因此，每个隔膜有效地形成与基座大致独立的分开的麦克风。

公开(公告)号：US20130129136A1

公开(公告)日：2013-05-23

申请号：US13661401

申请日：2012-10-26

Applicant: Analog Devices, Inc.

Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

IPC: H04R1/04

CPC classification number: H04R1/342 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/04 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract translation: 麦克风模块具有带孔的基板，以允许声波通过基板，安装到基板上以限定第一内部空间的盖，安装到第一内部空间内的基板的麦克风以及耦合到该基板的壳体 衬底并覆盖孔径。 壳体形成第二内部容积并且包括被配置为允许声音进入第二内部容积的声学端口。 模块还包括从壳体中的声学接口延伸的管道，以及在第二内部容积体外部的至少一个外部接口焊盘。 管道具有接收声波的开口端，并将它们引导到壳体中的声学端口。 此外，至少一个外部接口垫电连接到麦克风。

公开(公告)号：US20130101151A1

公开(公告)日：2013-04-25

申请号：US13712325

申请日：2012-12-12

Applicant: ANALOG DEVICES, INC.

Inventor： Kieran P. Harney ,  Jason W. Weigold ,  Gary W. Elko

IPC: H04R1/04

CPC classification number: H04R1/04 ,  H04M1/0214 ,  H04M1/03 ,  H04M1/035 ,  H04M1/19 ,  H04M1/6008 ,  H04R1/245 ,  H04R3/005 ,  H04R2410/05

Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The first microphone apparatus may have a first back-side cavity and the second microphone may have a second back-side cavity. The first and second back-side cavities may be fluidly unconnected. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.

Abstract translation: 麦克风系统具有与第一和第二麦克风装置耦合的基座。 第一麦克风装置能够产生具有噪声分量的第一输出信号，而第二麦克风装置能够产生第二输出信号。 第一麦克风装置可以具有第一后侧腔，并且第二麦克风可以具有第二后侧空腔。 第一和第二后侧空腔可以是流体不连接的。 该系统还具有与第一麦克风装置和第二麦克风装置操作耦合的组合逻辑。 组合逻辑使用第二输出信号从第一输出信号中去除噪声分量的至少一部分。