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公开(公告)号:US09617644B2
公开(公告)日:2017-04-11
申请号:US13636087
申请日:2011-03-21
IPC分类号: C23C18/54 , C23C18/28 , C23C18/30 , C23C18/40 , C23C18/16 , C23C18/20 , C23C18/34 , C23C18/36 , C23C18/44 , C23C18/52 , C25D11/00
CPC分类号: C23C18/54 , C23C18/1651 , C23C18/1653 , C23C18/208 , C23C18/285 , C23C18/30 , C23C18/34 , C23C18/36 , C23C18/40 , C23C18/44 , C23C18/52 , C25D11/00
摘要: The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.
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公开(公告)号:US20130316082A1
公开(公告)日:2013-11-28
申请号:US13636087
申请日:2011-03-21
CPC分类号: C23C18/54 , C23C18/1651 , C23C18/1653 , C23C18/208 , C23C18/285 , C23C18/30 , C23C18/34 , C23C18/36 , C23C18/40 , C23C18/44 , C23C18/52 , C25D11/00
摘要: The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.
摘要翻译: 本发明涉及非导电性基板的直接金属化方法以及在这种方法中使用的导体溶液。 根据本发明,提出了通过含有贵金属胶体的活化剂溶液激活后的非导电性基板表面与导体溶液接触,该导体溶液包含可由活化剂溶液的金属还原的金属,络合剂 和还原剂。
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公开(公告)号:US20110272284A1
公开(公告)日:2011-11-10
申请号:US13129300
申请日:2009-11-13
CPC分类号: C25D9/04 , C09D5/08 , C09D5/4411 , C09D5/4484 , C25D5/48 , C25D11/02 , C25D11/26 , C25D11/34 , C25D11/36 , C25D11/38
摘要: A process for treating the surface of a metal substrate comprising a constituent metal selected from the group consisting of Cr, Cu, Mn, Mo, Ag, Au, Pt, Pd, Rh, Pb, Sn, Ni, Zn, in some cases Fe, and alloys of these metals. An anodic potential is applied to the metal surface in an electrolytic circuit comprising the metal surface, a cathode, and an electrolytic solution that is in contact with the metal surface and in electrically conductive communication with the cathode. The electrolytic solution may contain an electrolyte comprising anions of phosphate, phosphonate, phosphite, phosphinate, nitrate, borate, silicate, molybdate, tungstate, carboxylate, oxalate and combinations thereof. The anion may comprise a polymer having a pendent moiety selected from the group consisting of phosphate, phosphonate, phosphite, phosphinate, sulfate, sulfonate, carboxylate and combinations thereof. The potential applied to the circuit is such that the substrate is anodically oxidized and reacts with the anion to form a composition that imparts an enhanced property to the metal surface. Preferably, the pH of the electrolytic solution is less than about 6.0, the potential applied is between about 0.5 and about 20 volts, and the current density is between about 0.01 and 2 amps/dm2 of the geometric surface area of metal in contact with the electrolytic solution and is controlled such that nascent cations of said constituent metal produced by anodic oxidation of said constituent metal react with said anions at the metal surface without significant formation of any oxide or hydroxide of said constituent metal.
摘要翻译: 一种用于处理包括选自Cr,Cu,Mn,Mo,Ag,Au,Pt,Pd,Rh,Pb,Sn,Ni,Zn中的组成金属的金属基材的表面的方法,在某些情况下为Fe ,以及这些金属的合金。 在包括金属表面,阴极和与金属表面接触并与阴极导电连通的电解液的电解电路中,将金属表面施加阳极电位。 电解液可以含有包含磷酸盐,膦酸盐,亚磷酸盐,次膦酸盐,硝酸盐,硼酸盐,硅酸盐,钼酸盐,钨酸盐,羧酸盐,草酸盐及其组合的阴离子的电解质。 阴离子可以包含具有选自磷酸盐,膦酸盐,亚磷酸盐,次膦酸盐,硫酸盐,磺酸盐,羧酸盐及其组合的侧悬链部分的聚合物。 施加到电路的电位使得基板被阳极氧化并与阴离子反应形成赋予金属表面增强性能的组合物。 优选地,电解溶液的pH值小于约6.0,所施加的电位在约0.5至约20伏特之间,并且电流密度介于金属的几何表面积的约0.01和2安培/ dm 2之间 并且被控制,使得通过所述构成金属的阳极氧化产生的所述构成金属的初生阳离子与金属表面上的所述阴离子反应,而不显着形成所述组成金属的任何氧化物或氢氧化物。
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公开(公告)号:US09222189B2
公开(公告)日:2015-12-29
申请号:US13129300
申请日:2009-11-13
IPC分类号: C25D9/04 , C09D5/08 , C09D5/44 , C25D5/48 , C25D11/02 , C25D11/26 , C25D11/34 , C25D11/36 , C25D11/38
CPC分类号: C25D9/04 , C09D5/08 , C09D5/4411 , C09D5/4484 , C25D5/48 , C25D11/02 , C25D11/26 , C25D11/34 , C25D11/36 , C25D11/38
摘要: A process for treating the surface of a metal substrate comprising a constituent metal selected from the group consisting of Cr, Cu, Mn, Mo, Ag, Au, Pt, Pd, Rh, Pb, Sn, Ni, Zn, in some cases Fe, and alloys of these metals. An anodic potential is applied to the metal surface in an electrolytic circuit comprising the metal surface, a cathode, and an electrolytic solution that is in contact with the metal surface and in electrically conductive communication with the cathode. The electrolytic solution may contain an electrolyte comprising anions of phosphate, phosphonate, phosphite, phosphinate, nitrate, borate, silicate, molybdate, tungstate, carboxylate, oxalate and combinations thereof. The anion may comprise a polymer having a pendent moiety selected from the group consisting of phosphate, phosphonate, phosphite, phosphinate, sulfate, sulfonate, carboxylate and combinations thereof. The potential applied to the circuit is such that the substrate is anodically oxidized and reacts with the anion to form a composition that imparts an enhanced property to the metal surface. Preferably, the pH of the electrolytic solution is less than about 6.0, the potential applied is between about 0.5 and about 20 volts, and the current density is between about 0.01 and 2 amps/dm2 of the geometric surface area of metal in contact with the electrolytic solution and is controlled such that nascent cations of said constituent metal produced by anodic oxidation of said constituent metal react with said anions at the metal surface without significant formation of any oxide or hydroxide of said constituent metal.
摘要翻译: 一种用于处理包括选自Cr,Cu,Mn,Mo,Ag,Au,Pt,Pd,Rh,Pb,Sn,Ni,Zn中的组成金属的金属基材的表面的方法,在某些情况下为Fe ,以及这些金属的合金。 在包括金属表面,阴极和与金属表面接触并与阴极导电连通的电解液的电解电路中,将金属表面施加阳极电位。 电解液可以含有包含磷酸盐,膦酸盐,亚磷酸盐,次膦酸盐,硝酸盐,硼酸盐,硅酸盐,钼酸盐,钨酸盐,羧酸盐,草酸盐及其组合的阴离子的电解质。 阴离子可以包含具有选自磷酸盐,膦酸盐,亚磷酸盐,次膦酸盐,硫酸盐,磺酸盐,羧酸盐及其组合的侧悬链部分的聚合物。 施加到电路的电位使得基板被阳极氧化并与阴离子反应形成赋予金属表面增强性能的组合物。 优选地,电解溶液的pH值小于约6.0,所施加的电位在约0.5至约20伏特之间,并且电流密度介于金属的几何表面积的约0.01和2安培/ dm 2之间 并且被控制,使得通过所述构成金属的阳极氧化产生的所述构成金属的初生阳离子与金属表面上的所述阴离子反应,而不显着形成所述组成金属的任何氧化物或氢氧化物。
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