摘要:
Free standing quantum do (FSQDT) polymer composites and a method and apparatus for patterning the FSQDT polymer composites is provided. The method for patterning the FSQDT polymer composites includes creating a solution including FSQDTs where each of the FSQDTs has a plurality of reactive ligands chemically attached thereto. The method further includes providing a substrate, forming a coated substrate by coating a surface of the substrate with a layer of the solution, and providing a photo mask having a predetermined pattern thereon transparent to a predetermined radiation over the coated substrate. Finally, the method includes exposing a portion of the coated substrate to the predetermined radiation passing through the mask to pattern a polymer matrix in the predetermined pattern while adhering the FSQDTs to the polymer matrix to form the FSQDT polymer composite.
摘要:
Free standing quantum do (FSQDT) polymer composites and a method and apparatus for patterning the FSQDT polymer composites is provided. The method for patterning the FSQDT polymer composites includes creating a solution including FSQDTs where each of the FSQDTs has a plurality of reactive ligands chemically attached thereto. The method further includes providing a substrate, forming a coated substrate by coating a surface of the substrate with a layer of the solution, and providing a photo mask having a predetermined pattern thereon transparent to a predetermined radiation over the coated substrate. Finally, the method includes exposing a portion of the coated substrate to the predetermined radiation passing through the mask to pattern a polymer matrix in the predetermined pattern while adhering the FSQDTs to the polymer matrix to form the FSQDT polymer composite.
摘要:
A manufacturing method and manufacturing system for creating a modular electronic assembly are disclosed. The manufacturing system 300 may position a contact terminal 202 of a printed electronic component module 102 relative to a contact pad 204 of a printed electronic substrate 112. The manufacturing system 300 may connect the contact terminal 202 to the contact pad 204 using a conductive adhesive connection 116.
摘要:
A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
摘要:
A low-temperature process for creating a semiconductive device by printing a liquid composition containing semiconducting nanoparticles. The semiconductive device is formed on a polymeric substrate by printing a composition that contains nanoparticles of inorganic semiconductor suspended in a carrier, using a graphic arts printing method. The printed deposit is then heated to remove substantially all of the carrier from the printed deposit. The low-temperature process does not heat the substrate or the printed deposit above 300° C. The mobility of the resulting semiconductive device is between about 10 cm2/Vs and 200 cm2/Vs.
摘要:
A method and apparatus is provided for activating a layer (208, 308, 408) of free standing quantum dots. The apparatus comprises a first coil (216, 316, 426) disposed contiguous to a light emitting device (200, 300, 400, 612) including the free standing quantum dots. An alternating current is supplied to the coil (216, 316, 426) for generating an electric field, and the plurality of free standing quantum dots are subjected to the electric field thereby causing photons to be emitted therefrom. A structure (214, 328), such as a housing (620) of a portable electronic device (610, 710) may be positioned either, when opaque, between the light emitting device (300, 400) and the coil (316, 426), or, when transparent, on a side of the light emitting device (200) opposed to the coil (216).
摘要:
An apparatus is provided for modulating the photon output of a plurality of free standing quantum dots. The apparatus comprises a first electron injection layer (210, 310, 410) disposed between a first electrode (212, 312, 412) and a layer (208, 308, 408) of the plurality of free standing quantum dots. A hole transport layer (206, 306, 406) is disposed between the layer (208, 308, 408) of the plurality of quantum dots and a second electrode (204, 304, 404). A light source (224, 324, 424) is disposed so as to apply light to the layer (208, 308, 408) of the plurality of free standing quantum dots. The photon output of the layer (208, 308, 408) of the plurality of free standing quantum dots is modulated by applying a voltage to the first and second electrodes (212, 312, 412, 204, 304, 404). Electrons excited to a higher energy state within layer (208, 308, 408) of the free standing quantum dots by the light source (224, 324, 424) are prevented from returning to a lower state by electrons from the electric field of the applied voltage, and therefore the free standing quantum dots are prevented from emitting a photon. The voltage source (216, 316, 416) may be modulated to vary the photon output.
摘要:
A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
摘要:
A portable electronic device (510) having a self illuminating display (200, 202, 204, 206, 300, 512) that reduces both the thickness of known displays and processing steps in the fabrication thereof is provided. The portable electronic device (510) includes an electrowetting display (200, 202, 204, 206, 300, 512) having a plurality of transparent layers defining a cavity (219). A combination of a first fluid (218, 236) and a second fluid (210, 234, 244, 254) are positioned in the cavity. First circuitry (224) is configured to be coupled to a first voltage source (222) for selectively repositioning the second fluid (210, 234, 244, 254) in relation to the first fluid (218, 236). A plurality of quantum dots (208, 360) is positioned within the second fluid (210, 234, 244, 254), and a light source (209, 309) is disposed contiguous to the plurality of layers. Second circuitry (228) is configured to be coupled to a second voltage source (226) for selectively causing the light source (209, 309) to emit photons to strike the plurality of quantum dots (208, 360). Additional similar stacks of layers (204, 206) may be added to provide a color display.
摘要:
A display (1100) comprises a passive screen (106, 502, 700, 1114) printed with a pattern (404) of different color quantum dots (602, 604, 606) that is excited by scanning a laser (130, 1108) over the screen (106, 502, 700, 1114). The display (1100) can be incorporated into a handheld device (100, 1200) to improve the use-ability of the device (100, 1200).