公开(公告)号：US08821639B2

公开(公告)日：2014-09-02

申请号：US13235961

申请日：2011-09-19

申请人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

发明人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

IPC分类号： B23K10/00 ,  H05K3/30 ,  H01R12/00

CPC分类号： H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

摘要： An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.

摘要翻译： 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，电介质材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。

公开(公告)号：US08051556B2

公开(公告)日：2011-11-08

申请号：US12232673

申请日：2008-09-22

申请人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

发明人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

IPC分类号： C23C14/50 ,  C23C16/46 ,  H01L21/00

CPC分类号： H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

摘要： An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

摘要翻译： 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，电介质材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。 介电材料层形成静电夹持机构并支撑基板。

公开(公告)号：US20120018411A1

公开(公告)日：2012-01-26

申请号：US13235961

申请日：2011-09-19

申请人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

发明人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

IPC分类号： B23K10/00 ,  H01R12/00 ,  H05K3/30

CPC分类号： H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

摘要： An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.

摘要翻译： 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，电介质材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。

公开(公告)号：US08038796B2

公开(公告)日：2011-10-18

申请号：US11027481

申请日：2004-12-30

申请人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

发明人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

IPC分类号： H01L21/67 ,  H01L21/02 ,  C23C14/50

CPC分类号： H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

摘要： An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

摘要翻译： 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，电介质材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。 介电材料层形成静电夹持机构并支撑基板。

公开(公告)号：US20090078360A1

公开(公告)日：2009-03-26

申请号：US12232673

申请日：2008-09-22

申请人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

发明人： Anthony J. Ricci ,  Keith Comendant ,  James Tappan

IPC分类号： B32B37/14

CPC分类号： H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

摘要： An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

摘要翻译： 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，电介质材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。 介电材料层形成静电夹持机构并支撑基板。

公开(公告)号：US20060144516A1

公开(公告)日：2006-07-06

申请号：US11027481

申请日：2004-12-30

申请人： Anthony Ricci ,  Keith Comendant ,  James Tappan

发明人： Anthony Ricci ,  Keith Comendant ,  James Tappan

IPC分类号： C23F1/00 ,  C23C16/00

CPC分类号： H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

摘要： An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

摘要翻译： 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，电介质材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。 介电材料层形成静电夹持机构并支撑基板。

公开(公告)号：US07132080B2

公开(公告)日：2006-11-07

申请号：US10641946

申请日：2003-08-15

申请人： Marc R. Anderson ,  Michael J. West ,  James Tappan

发明人： Marc R. Anderson ,  Michael J. West ,  James Tappan

IPC分类号： B01L3/00

CPC分类号： G01N31/02 ,  G01N1/34 ,  G01N1/4077 ,  H01J49/04 ,  Y10T436/25375

摘要： An automated matrix removal module is configurable to automatically withdraw a portion of sample containing an interferent. The module is further configurable to mix the portion of sample with a precipitating reagent selected to react with the interferent to form a precipitant and then filter mixture of sample and precipitant reagent through a filter. Finally, the module is further configurable to flush the precipitant from the filter.

摘要翻译： 自动矩阵去除模块可配置为自动提取含有干扰物的样品的一部分。 该模块还可配置为将样品的一部分与选择的与沉淀剂反应的沉淀剂混合以形成沉淀剂，然后通过过滤器过滤样品和沉淀剂的混合物。 最后，该模块进一步可配置以从过滤器冲洗沉淀剂。

公开(公告)号：US20060065523A1

公开(公告)日：2006-03-30

申请号：US10957443

申请日：2004-09-30

申请人： Fangli Hao ,  John Daugherty ,  James Tappan

发明人： Fangli Hao ,  John Daugherty ,  James Tappan

IPC分类号： C23C14/00 ,  C23C14/32

CPC分类号： H01J37/3244 ,  H01J37/32082

摘要： In a plasma processing system, an integrated gas flow control assembly for connecting a gas distribution system to a multi-zone injector is disclosed. The assembly includes a first set of channels connecting the gas distribution system to a first valve assembly with a first flow rate, a second valve assembly with a second flow rate, a third flow assembly with a third flow rate, and a fourth flow assembly with a fourth flow rate, wherein when the first valve assembly is substantially open, the third flow rate is less than the first flow rate, and wherein when the second valve assembly is substantially open, the fourth flow rate is less than the second flow rate. The assembly also includes a second set of channels for connecting the third flow assembly and the first valve assembly to a first multi-zone injector zone. The assembly further includes a third set of channels for connecting the fourth flow assembly and the second valve assembly to a second multi-zone injector zone. Wherein if the first valve assembly is closed, a first multi-zone injector zone flow rate is about the third flow rate, and wherein if the second valve assembly is closed, a second multi-zone injector zone flow rate is about the fourth flow rate.

摘要翻译： 在等离子体处理系统中，公开了一种用于将气体分配系统连接到多区域喷射器的集成气体流量控制组件。 组件包括将气体分配系统连接到具有第一流量的第一阀组件的第一组通道，具有第二流量的第二阀组件，具有第三流量的第三流量组件和具有第三流量的第四流量组件， 第四流量，其中当第一阀组件基本上打开时，第三流量小于第一流量，并且其中当第二阀组件基本上打开时，第四流量小于第二流量。 组件还包括用于将第三流动组件和第一阀组件连接到第一多区域注入器区域的第二组通道。 组件还包括用于将第四流动组件和第二阀组件连接到第二多区域注入器区域的第三组通道。 其中，如果第一阀组件关闭，则第一多区域喷射器区域流速约为第三流量，并且其中如果第二阀组件关闭，则第二多区域喷射器区域流速约为第四流量 。

公开(公告)号：US20050037517A1

公开(公告)日：2005-02-17

申请号：US10641480

申请日：2003-08-15

申请人： Marc Anderson ,  Michael West ,  James Tappan

发明人： Marc Anderson ,  Michael West ,  James Tappan

IPC分类号： B01L99/00 ,  G01N1/00 ,  G01N30/20 ,  G01N30/24 ,  G01N24/00

CPC分类号： G01N35/1097 ,  G01N30/24 ,  G01N2030/201 ,  G01N2030/202 ,  Y10T436/24

摘要： A loop dilution system includes a dual-loop multi-way valve. In a first configuration of the multi-way valve, a first loop may be filled with a first solution and a second loop may be filled with a second solution. In a second configuration of the multi-way valve, the first and second loops are serially connected with a pump so that their contents may be mixed with a diluent. In another aspect of the invention, an in-process mass spectrometry (IPMS) system is disclosed that uses an internal standard to determine the concentration of an analyte in a sample. The internal standard has a different molecular composition than the analyte but is sufficiently similar chemically and physically to the analyte such that it behaves substantially the same as the analyte during an ionization process in the mass spectrometer.

摘要翻译： 循环稀释系统包括双回路多通阀。 在多通阀的第一构造中，第一回路可以填充第一溶液，第二回路可以填充第二溶液。 在多通阀的第二配置中，第一和第二回路与泵串联连接，使得它们的内容物可以与稀释剂混合。 在本发明的另一方面，公开了一种使用内部标准来确定样品中分析物的浓度的过程中质谱（IPMS）系统。 内标与分析物具有不同的分子组成，但与分析物的化学和物理性质充分相似，使得其在质谱仪的离子化过程中与分析物基本上相同。

公开(公告)号：US08900404B2

公开(公告)日：2014-12-02

申请号：US12468670

申请日：2009-05-19

申请人： James Tappan

发明人： James Tappan

IPC分类号： C23C16/00 ,  C23C16/50 ,  C23F1/00 ,  H01L21/306 ,  H01J37/32

CPC分类号： H01J37/32568 ,  H01J37/32522 ,  H01J37/32623

摘要： A plasma processing system with improved component temperature control is disclosed. The system may include a plasma processing chamber having a chamber wall. The system may also include an electrode disposed inside the plasma processing chamber. The system may also include a support member disposed inside the plasma processing chamber for supporting the electrode. The system may also include a support plate disposed outside the chamber wall. The system may also include a cantilever disposed through the chamber wall for coupling the support member with the support plate. The system may also include a lift plate disposed between the chamber wall and the support plate. The system may also include thermally resistive coupling mechanisms for mechanically coupling the lift plate with the support plate.

摘要翻译： 公开了一种具有改进的组件温度控制的等离子体处理系统。 该系统可以包括具有室壁的等离子体处理室。 该系统还可以包括设置在等离子体处理室内部的电极。 该系统还可以包括设置在等离子体处理室内部用于支撑电极的支撑构件。 该系统还可以包括设置在室壁外部的支撑板。 该系统还可以包括通过室壁设置的用于将支撑构件与支撑板联接的悬臂。 该系统还可以包括设置在室壁和支撑板之间的提升板。 该系统还可以包括用于将升降板与支撑板机械联接的热阻耦合机构。