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    Process control in electrochemically assisted planarization
    3.
    发明授权
    Process control in electrochemically assisted planarization 失效
    电化学辅助平面化过程控制

    公开(公告)号：US07294038B2

    公开(公告)日：2007-11-13

    申请号：US11425339

    申请日：2006-06-20

    申请人： Antoine P. Manens ,  Liang-Yuh Chen

    发明人： Antoine P. Manens ,  Liang-Yuh Chen

    IPC分类号： B23H3/00 ,  B24D11/02 ,  C23H3/00 ,  C25D17/00

    CPC分类号： B24B37/046 ,  B23H5/06 ,  B23H5/08 ,  B24B37/042 ,  B24B37/22 ,  B24B49/16

    摘要： In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, and a second conductive layer coupled to the intermediate layer. The second conductive layer may have a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. The intermediate layer may contain a polymer material support disk, a backing layer, or combinations thereof. Generally, the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. In one example, the intermediate layer may contain a plurality of perforations or cannels that have a diameter within a range from about 0.5 mm to about 10 mm.

    摘要翻译： 在一个实施例中，提供了一种用于电处理衬底的焊盘组件，其包括第一导电层，其具有适于在抛光工艺期间接触衬底的工作表面，耦合到第一导电层的中间层和第二导电层 耦合到中间层。 第二导电层可以具有多个独立的电可偏置区域，并且被配置为与电力输送装置耦合。 中间层可以包含聚合物材料支撑盘，背衬层或其组合。 通常，第一导电层，第二导电层和中间层被粘合或固定在一起并作为整体可更换体移动。 在一个示例中，中间层可以包含多个穿孔或孔，其直径在约0.5mm至约10mm的范围内。

    Electroprocessing profile control
    6.
    发明授权
    Electroprocessing profile control 失效
    电加工配置文件控制

    公开(公告)号：US07709382B2

    公开(公告)日：2010-05-04

    申请号：US11877233

    申请日：2007-10-23

    申请人： Antoine P. Manens ,  Vladimir Galburt ,  Yan Wang ,  Alain Duboust ,  Donald J. K. Olgado ,  Liang-Yuh Chen

    发明人： Antoine P. Manens ,  Vladimir Galburt ,  Yan Wang ,  Alain Duboust ,  Donald J. K. Olgado ,  Liang-Yuh Chen

    IPC分类号： H01L21/44 ,  H01L21/302 ,  H01L21/461

    CPC分类号： B23H5/08 ,  B24B37/042 ,  C25D17/10 ,  C25F7/00

    摘要： Embodiments of the present invention provide methods of electroprocessing a substrate. One embodiment of the present invention provides a method comprises pressing a substrate against a polishing pad with a force less than about two pounds per square inch, the substrate contacting a first electrode of the polishing pad, applying an electrical bias to the substrate with the first electrode relative to a second electrode of the polishing pad, wherein the second electrode is disposed below the second electrode, and biasing a third electrode disposed in the polishing pad radially outward of the second electrode.

    摘要翻译： 本发明的实施方案提供了对基底进行电处理的方法。 本发明的一个实施方案提供了一种方法，包括以小于约2磅/平方英寸的力将衬底压靠抛光垫，衬底与抛光垫的第一电极接触，将第一电极施加电偏压至衬底 电极，其中所述第二电极设置在所述第二电极下方，并且偏置设置在所述抛光垫中的第三电极，所述第三电极位于所述第二电极的径向外侧。

    PAD ASSEMBLIES FOR ELECTROCHEMICALLY ASSISTED PLANARIZATION
    8.
    发明申请
    PAD ASSEMBLIES FOR ELECTROCHEMICALLY ASSISTED PLANARIZATION 审中-公开
    用于电化学辅助平面化的PAD组件

    公开(公告)号：US20080254713A1

    公开(公告)日：2008-10-16

    申请号：US11870975

    申请日：2007-10-11

    申请人： Antoine P. Manens ,  Liang-Yuh Chen

    发明人： Antoine P. Manens ,  Liang-Yuh Chen

    IPC分类号： B23H3/00 ,  B24B1/00

    CPC分类号： B24B37/046 ,  B23H5/06 ,  B23H5/08 ,  B24B37/042 ,  B24B37/22 ,  B24B49/16

    摘要： In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, wherein the intermediate layer contains a plurality of perforations, channels, or combinations thereof, which have diameters within a range from about 0.5 mm to about 10 mm, and a second conductive layer coupled to the intermediate layer, wherein the second conductive layer has a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. The intermediate layer may contain a polymer material support disk, a backing layer, or combinations thereof. Generally, the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body.

    摘要翻译： 在一个实施例中，提供了一种用于电处理衬底的焊盘组件，其包括在抛光过程期间具有与衬底接触的工作表面的第一导电层，耦合到第一导电层的中间层，其中中间层包含 其直径在约0.5mm至约10mm范围内的多个穿孔，通道或其组合，以及耦合到中间层的第二导电层，其中第二导电层具有多个独立的可电偏压区域， 被配置为与电力传送装置耦合。 中间层可以包含聚合物材料支撑盘，背衬层或其组合。 通常，第一导电层，第二导电层和中间层被粘合或固定在一起并作为整体可更换体移动。