公开(公告)号：US5959214A

公开(公告)日：1999-09-28

申请号：US995801

申请日：1997-12-22

申请人： Aparna Vaidyanthan ,  Robert Keith Constable ,  Shailendra Verma

发明人： Aparna Vaidyanthan ,  Robert Keith Constable ,  Shailendra Verma

IPC分类号： G01L1/22 ,  H01L29/96

CPC分类号： G01L1/2293

摘要： A strain gauge has a stainless steel substrate with a dielectric coating comprising two dielectric layers. A circuit comprising conductors, resistors and piezoresistors in a Wheatstone bridge configuration is formed on the dielectric. One dielectric layer is to adhere to the steel and a second is to form a barrier against diffusion of the first layer into the piezoresistor material. An amplification and signal conditioning circuit is applied adjacent the bridge. The steel substrate is to be welded or bolted at its marginal portions to a structure subject to strain.

摘要翻译： 应变计具有不锈钢基底，其具有包括两个电介质层的电介质涂层。 包括惠斯通电桥配置中的导体，电阻器和压电阻器的电路形成在电介质上。 一个电介质层将粘附到钢上，其次是形成防止第一层扩散到压敏电阻材料中的屏障。 在桥附近施加放大和信号调理电路。 钢基材将在其边缘部分被焊接或螺栓连接到受到应变的结构。

公开(公告)号：US06184581B2

公开(公告)日：2001-02-06

申请号：US08977525

申请日：1997-11-24

申请人： Ralph Edward Cornell ,  Aparna Vaidyanthan ,  Curt A Erickson

发明人： Ralph Edward Cornell ,  Aparna Vaidyanthan ,  Curt A Erickson

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A surface mount circuit device (110), such as a flip chip, of the type which is attached to a conductor pattern (126) with solder bump connections (120). The solder bump connections (120) are formed by reflowing solder on shaped input/output pads (112) on the device (110), with the shape of the pads (112) being tailored to favorably affect optimal distribution, shape and height of the solder bump connections (120) following reflow soldering of the device (110) to the conductor pattern (126). The solder bump connections (120) are preferably characterized by a shape that increases the stand-off height of the device (110). The shaped solder bump connections (120) also promote stress relief during thermal cycling, improve mechanical bonding, allow better penetration of cleaning solutions, and improve flow of encapsulation materials between the device (110) and its substrate (122).

摘要翻译： 一种表面贴装电路器件（110），例如倒装芯片，其类型被连接到具有焊料凸点连接（120）的导体图案（126）上。 焊料凸块连接（120）通过在装置（110）上的成形输入/输出垫（112）上回流焊料而形成，其中衬垫（112）的形状被定制以有利地影响最佳分布，形状和高度 在器件（110）回流焊接到导体图案（126）之后的焊料凸点连接（120）。 焊料凸点连接（120）的特征在于增加了装置（110）的支座高度的形状。 成形焊料凸块连接（120）还促进热循环期间的应力消除，改善机械粘合，允许更好地渗透清洁溶液，并改善装置（110）和其基板（122）之间的封装材料的流动。