-
公开(公告)号：US20200042050A1
公开(公告)日：2020-02-06
申请号：US16654793
申请日：2019-10-16
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20160378147A1
公开(公告)日：2016-12-29
申请号：US15263222
申请日：2016-09-12
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20170308134A1
公开(公告)日：2017-10-26
申请号：US15637940
申请日：2017-06-29
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , H05K7/20 , H05K5/03 , H05K1/02 , G08B21/18 , G08B5/36 , G06F3/00 , G06F1/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20170269641A1
公开(公告)日：2017-09-21
申请号：US15614354
申请日：2017-06-05
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B21/18 , G08B5/36 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20230251694A1
公开(公告)日：2023-08-10
申请号：US18131983
申请日：2023-04-07
Applicant: APPLE INC.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
CPC classification number: G06F1/181 , G06F1/20 , H05K7/20145 , H05K7/20163 , H05K7/20172 , H05K7/2049 , H01L23/4093 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , H05K5/03 , H05K1/0203 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H05K7/20154 , H05K7/20209 , H05K7/2039 , H05K7/20009
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
Patent Agency Ranking
公开(公告)号：US20220155830A1
公开(公告)日：2022-05-19
申请号：US17649661
申请日：2022-02-01
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20170300095A1
公开(公告)日：2017-10-19
申请号：US15637981
申请日：2017-06-29
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20180246548A1
公开(公告)日：2018-08-30
申请号：US15965272
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20180246547A1
公开(公告)日：2018-08-30
申请号：US15964973
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
-
公开(公告)号：US20160313767A1
公开(公告)日：2016-10-27
申请号：US14693814
申请日：2015-04-22
Applicant: Apple Inc.
Inventor： Brandon S. SMITH , Thomas R. TATE , Mark A. SALVADOR , Alexander C. CALKINS
CPC classification number: G06F1/1656 , G06F1/1681 , G06F1/1698 , H01Q1/2266 , H01Q1/526
Abstract: A shield feature and method of forming to prevent transmission of electromagnetic radiation is disclosed. The shield feature may include a first protrusion and a second protrusion, both of which are formed from an electrically conductive material. A non-electrically conductive material may cover the electrically conductive material in certain regions. The first protrusion, the second protrusion, and an extension between the first protrusion and the second protrusion are free of non-electrically conductive material, allowing the electrically conductive material to engage an enclosure of an electronic device. Also, a distance separates the first protrusion and the second protrusion that is less than a distance defined by a wavelength of the electromagnetic radiation, allowing the shield feature to prevent the electromagnetic radiation from passing through the shield feature. Also, the shield feature may further form an electrical grounding path for an internal component to electrically ground the internal component with the enclosure.
Abstract translation: 公开了防止电磁辐射传播的屏蔽特征和形成方法。 屏蔽特征可以包括第一突起和第二突起，它们都由导电材料形成。 非导电材料可以覆盖某些区域中的导电材料。 第一突起，第二突起和第一突起与第二突起之间的延伸部分不含非导电材料，允许导电材料接合电子器件的外壳。 此外，距离第一突起和第二突起的距离小于由电磁辐射的波长限定的距离，允许屏蔽特征防止电磁辐射穿过屏蔽特征。 此外，屏蔽特征还可以形成用于内部部件的电接地路径，以使内部部件与外壳电接地。
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.019 seconds)
