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公开(公告)号：US20160378147A1
公开(公告)日：2016-12-29
申请号：US15263222
申请日：2016-09-12
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US20170308134A1
公开(公告)日：2017-10-26
申请号：US15637940
申请日：2017-06-29
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , H05K7/20 , H05K5/03 , H05K1/02 , G08B21/18 , G08B5/36 , G06F3/00 , G06F1/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US20170269641A1
公开(公告)日：2017-09-21
申请号：US15614354
申请日：2017-06-05
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B21/18 , G08B5/36 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US20180246548A1
公开(公告)日：2018-08-30
申请号：US15965272
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US20180246547A1
公开(公告)日：2018-08-30
申请号：US15964973
申请日：2018-04-27
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , F21V8/00 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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Patent Agency Ranking
公开(公告)号：US20230413416A1
公开(公告)日：2023-12-21
申请号：US17843884
申请日：2022-06-17
Applicant: Apple Inc.
Inventor： Trevor J. EDMONDS , Jay S. NIGEN , Richard D. KOSOGLOW , Ron A. HOPKINSON
CPC classification number: H05K1/0203 , H05K7/2039 , G06F1/203 , H05K2201/10128
Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).
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公开(公告)号：US20200042050A1
公开(公告)日：2020-02-06
申请号：US16654793
申请日：2019-10-16
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US20190053610A1
公开(公告)日：2019-02-21
申请号：US16166005
申请日：2018-10-19
Applicant: Apple Inc.
Inventor： Richard D. KOSOGLOW , Hao ZHU , James A. STRYKER
CPC classification number: A45F5/00 , A44C5/2071 , A44D2203/00 , A45F2005/008 , A45F2200/0508
Abstract: A wearable band may include a first strap portion including a loop, and a second strap portion positionable through the loop of the first strap portion. The second strap portion may include a multi-pole magnet assembly, the multi-pole magnet assembly including two or more magnets arranged in a multi-pole magnet structure and at least one discrete shunt positioned over a surface of the multi-pole magnet structure.
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公开(公告)号：US20230251694A1
公开(公告)日：2023-08-10
申请号：US18131983
申请日：2023-04-07
Applicant: APPLE INC.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
CPC classification number: G06F1/181 , G06F1/20 , H05K7/20145 , H05K7/20163 , H05K7/20172 , H05K7/2049 , H01L23/4093 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , H05K5/03 , H05K1/0203 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H05K7/20154 , H05K7/20209 , H05K7/2039 , H05K7/20009
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号：US20220155830A1
公开(公告)日：2022-05-19
申请号：US17649661
申请日：2022-02-01
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Caitlin Elizabeth KALINOWSKI , Richard D. KOSOGLOW , Joshua D. BANKO , David H. NARAJOWSKI , Jonathan L. BERK , Michael E. LECLERC , Michael D. MCBROOM , Asif IQBAL , Paul S. MICHELSEN , Mark K. SIN , Paul A. BAKER , Harold L. SONTAG , Wai Ching YUEN , Matthew P. CASEBOLT , Kevin S. FETTERMAN , Alexander C. CALKINS , Daniel L. MCBROOM
IPC: G06F1/18 , G06F1/20 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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