-
公开(公告)号:US20160270213A1
公开(公告)日:2016-09-15
申请号:US15041033
申请日:2016-02-11
申请人: APPLE INC.
发明人: Amir Salehi , Vu T. Vo , Wyeman Chen , Chang Liu , Dennis R. Pyper , Steven Patrick Cardinali , Lan Hoang , Siddharth Nangia , Meng Chi Lee , Takayoshi Katahira
CPC分类号: H05K3/284 , B33Y80/00 , H05K1/0224 , H05K2201/0141 , H05K2201/0715 , H05K2201/10242 , H05K2201/10318 , H05K2201/10969 , H05K2201/2036
摘要: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.
摘要翻译: 易于制造的结构,用于将封装或封装在系统级封装模块中,使得模块易于组装,具有薄型,并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓,例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时,其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。
-
公开(公告)号:US20180092213A1
公开(公告)日:2018-03-29
申请号:US15710579
申请日:2017-09-20
申请人: Apple Inc.
发明人: Corey S. Provencher , Meng Chi Lee , Derek J. Walters , Ian A. Spraggs , Flynn P. Carson , Shakti S. Chauhan , Daniel W. Jarvis , David A. Pakula , Jun Zhai , Michael V. Yeh , Alex J. Crumlin , Dennis R. Pyper , Amir Salehi , Vu T. Vo , Gregory N. Stephens
CPC分类号: H05K1/181 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K1/144 , H05K3/0014 , H05K3/284 , H05K3/341 , H05K3/3436 , H05K2201/10159 , H05K2201/10674 , H05K2203/1316 , Y02P70/611
摘要: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.
-