公开(公告)号：US20170098565A1

公开(公告)日：2017-04-06

申请号：US14875673

申请日：2015-10-05

Applicant: Applied Materials, Inc.

Inventor： Xuesong LU ,  Lin ZHANG ,  Andy LE

IPC: H01L21/67 ,  H01J37/32 ,  G05B19/418 ,  C23C16/52

CPC classification number: H01L21/67253 ,  C23C16/50 ,  C23C16/52 ,  G05B19/41875 ,  G05B19/4189 ,  G05B2219/37008 ,  G05B2219/45032 ,  G05B2219/50388 ,  H01J37/32091 ,  H01J37/3211 ,  H01J37/32449 ,  H01J37/32522 ,  H01J37/32935 ,  H01J2237/327 ,  H01J2237/3321 ,  H01J2237/3323 ,  Y02P90/14 ,  Y02P90/22

Abstract: Embodiments of the present disclosure provide methodology to match and calibrate processing chamber performance in a processing chamber. In one embodiment, a method for calibrating a processing chamber for semiconductor manufacturing process includes performing a first predetermined process in a processing chamber, collecting a first set of signals transmitted from a first group of sensors disposed in the processing chamber to a controller while performing the predetermined process, analyzing the collected first set of signals, comparing the collected first set of signals with database stored in the controller to check sensor responses from the first group of sensors, calibrating sensors based on the collected first set of signals when a mismatch sensor response is found, subsequently performing a first series of processes in the processing chamber, and collecting a second set of signals transmitted from the sensors to the controller while performing the series of processes.