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公开(公告)号:US20180351164A1
公开(公告)日:2018-12-06
申请号:US15570988
申请日:2015-05-15
Applicant: Applied Materials, Inc.
Inventor: Anke HELLMICH , Thomas Werner ZILBAUER , Jose Manuel DIEGUEZ-CAMPO , Stefan KELLER , Georg JOST
IPC: H01M4/1395 , H01M4/04 , H01M4/38 , H01M4/40 , H01M10/052 , H01M6/40
CPC classification number: H01M4/1395 , H01M4/0423 , H01M4/0426 , H01M4/382 , H01M4/405 , H01M6/40 , H01M10/052 , H01M10/0585
Abstract: The present disclosure provides a masking device for use in a lithium deposition process in the manufacturing of thin film batteries. The masking device includes a mask portion made of a metal or metal alloy, and one or more openings in the mask portion, wherein the one or more openings are configured to allow particles of a deposition material to pass through the mask portion, and wherein a size of each opening of the one or more openings, is at least 0.5 cm2.
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公开(公告)号:US20180135160A1
公开(公告)日:2018-05-17
申请号:US15852820
申请日:2017-12-22
Applicant: Applied Materials, Inc.
Inventor: Frank SCHNAPPENBERGER , Anke HELLMICH , Thomas KOCH , Thomas DEPPISCH
CPC classification number: C23C14/0042 , C23C14/544 , H01J37/32449 , H01J37/32981 , H01J37/3299
Abstract: A method for controlling a gas supply to a process chamber is provided. The method includes: measuring a gas parameter by each of two or more sensors provided in the process chamber; determining a combined gas parameter from the measured gas parameters; and controlling the gas supply to the process chamber based on the determined combined gas parameter.
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公开(公告)号:US20220246411A1
公开(公告)日:2022-08-04
申请号:US17617555
申请日:2019-06-24
Applicant: Applied Materials, Inc.
Inventor: Anke HELLMICH
Abstract: A method of depositing a material on a substrate is described. The method includes sputtering at least a component of the material from a first rotary target with a first magnet assembly and a second rotary target with a second magnet assembly. The first magnet assembly within the first rotary target provides a first plasma confinement in a first direction facing towards the second rotary target. The second magnet assembly within the second rotary target provides a second plasma confinement in a second direction facing towards the first rotary target.
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