METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE

    公开(公告)号:US20220246411A1

    公开(公告)日:2022-08-04

    申请号:US17617555

    申请日:2019-06-24

    Inventor: Anke HELLMICH

    Abstract: A method of depositing a material on a substrate is described. The method includes sputtering at least a component of the material from a first rotary target with a first magnet assembly and a second rotary target with a second magnet assembly. The first magnet assembly within the first rotary target provides a first plasma confinement in a first direction facing towards the second rotary target. The second magnet assembly within the second rotary target provides a second plasma confinement in a second direction facing towards the first rotary target.

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