Adaptive non-rigid targeted deformation of images for synthetic image generation

    公开(公告)号:US11625811B2

    公开(公告)日:2023-04-11

    申请号:US17216459

    申请日:2021-03-29

    Abstract: A method includes determining a plurality of features of a first original image of a first product that are expected to be different for one or more products to be produced via manufacturing parameters of a manufacturing process compared to the first product. The method further includes adjusting one or more of the plurality of features of the first original image to generate a first synthetic image. The method further includes providing a plurality of images including the first original image and the first synthetic image to train a machine learning model to generate a trained machine learning model configured to generate output associated with updating the manufacturing parameters of the manufacturing process.

    PLASMA SPRAY COATING PROCESS ENHANCEMENT FOR CRITICAL CHAMBER COMPONENTS
    5.
    发明申请
    PLASMA SPRAY COATING PROCESS ENHANCEMENT FOR CRITICAL CHAMBER COMPONENTS 审中-公开
    等离子喷涂涂层工艺改进了关键室组件

    公开(公告)号:US20130288037A1

    公开(公告)日:2013-10-31

    申请号:US13749600

    申请日:2013-01-24

    Abstract: In an optimized method to apply a plasma sprayed coating of a yttrium containing oxide onto an article, a plasma power of between about 89-91 kW is selected for a plasma spraying system. Gas is flowed through the plasma spraying system at a selected gas flow rate of about 115-130 L/min. Ceramic powder comprising a yttrium containing oxide is fed into the plasma spraying system at a selected powder feed rate of about 10-30 g/min. A yttrium dominant ceramic coating is then formed on the article based on the selected power, the selected gas flow rate and the selected powder feed rate.

    Abstract translation: 在将含有钇的氧化物的等离子喷涂涂层施加到制品上的优化方法中,等离子体喷涂系统选择约89-91kW的等离子体功率。 气体以约115-130L / min的选定气体流速流过等离子喷涂系统。 包含含钇氧化物的陶瓷粉末以约10-30g / min的选定的粉末进料速率进料到等离子喷涂系统中。 然后基于所选择的功率,所选择的气体流速和所选择的粉末进料速率,在制品上形成钇优势陶瓷涂层。

    Wafer based corrosion and time dependent chemical effects

    公开(公告)号:US10515862B2

    公开(公告)日:2019-12-24

    申请号:US15480337

    申请日:2017-04-05

    Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.

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