WET CLEANING INSIDE OF GASLINE OF SEMICONDUCTOR PROCESS EQUIPMENT

    公开(公告)号:US20190352775A1

    公开(公告)日:2019-11-21

    申请号:US16412798

    申请日:2019-05-15

    摘要: Embodiments described herein relate to a gas line cleaning system and a method of cleaning gas lines. The gas line cleaning system includes a connector having a first end and a second end, and a fluid system. The fluid system includes a fluid source configured to flow a fluid through a fluid conduit connected to the first end, and an ultrasonic transducer coupled to the fluid conduit configured to apply an ultrasonic energy to the fluid conduit to agitate the fluid. The ultrasonic energy creates a mechanical energy that reverberates in the fluid conduit and propagates into the fluid to remove particles that may have formed on an inside surface of a gas line connected to the second end and carry away particles inside the gas line.

    TEXTURIZING A SURFACE WITHOUT BEAD BLASTING
    3.
    发明申请

    公开(公告)号:US20180257172A1

    公开(公告)日:2018-09-13

    申请号:US15955503

    申请日:2018-04-17

    IPC分类号: B23K26/00 B23K26/12 H01J37/32

    摘要: A system to provide a texture to a surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure comprising a processing region, a support disposed in the processing region, a photon light source to generate a stream of photons, an optical module operably coupled to the photon light source, and a lens. The optical module includes a beam modulator to create a beam of photons from the stream of photons generated from the photon light source, and a beam scanner to scan the beam of photons across the surface of the component. The lens is used to receive the beam of photons from the beam scanner and distribute the beam of photons at a wavelength in a range between about 345 nm and about 1100 nm across the surface of the component to form a plurality of features on the component.

    TEXTURIZING A SURFACE WITHOUT BEAD BLASTING

    公开(公告)号:US20210046587A1

    公开(公告)日:2021-02-18

    申请号:US17089531

    申请日:2020-11-04

    摘要: A system to provide a texture to a surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure comprising a processing region, a support disposed in the processing region, a photon light source to generate a stream of photons, an optical module operably coupled to the photon light source, and a lens. The optical module includes a beam modulator to create a beam of photons from the stream of photons generated from the photon light source, and a beam scanner to scan the beam of photons across the surface of the component. The lens is used to receive the beam of photons from the beam scanner and distribute the beam of photons at a wavelength in a range between about 345 nm and about 1100 nm across the surface of the component to form a plurality of features on the component.

    TEXTURIZING A SURFACE WITHOUT BEAD BLASTING
    5.
    发明申请

    公开(公告)号:US20190358746A1

    公开(公告)日:2019-11-28

    申请号:US16532011

    申请日:2019-08-05

    摘要: A system to provide a texture to a surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure comprising a processing region, a support disposed in the processing region, a photon light source to generate a stream of photons, an optical module operably coupled to the photon light source, and a lens. The optical module includes a beam modulator to create a beam of photons from the stream of photons generated from the photon light source, and a beam scanner to scan the beam of photons across the surface of the component. The lens is used to receive the beam of photons from the beam scanner and distribute the beam of photons at a wavelength in a range between about 345 nm and about 1100 nm across the surface of the component to form a plurality of features on the component.

    INTEGRATED SEMICONDUCTOR PART CLEANING SYSTEM

    公开(公告)号:US20190341276A1

    公开(公告)日:2019-11-07

    申请号:US16400603

    申请日:2019-05-01

    IPC分类号: H01L21/67 B08B3/12 B08B3/02

    摘要: Embodiments described herein relate to chamber component cleaning systems and methods for cleaning a chamber component. The chamber component cleaning system includes a spray station, at least a first cleaning station, a dry station, a component transfer mechanism, and one or more enclosures that enclose the spray station, at least the first cleaning station, the dry station, and the component transfer mechanism. The spray station has a holder to position a chamber component in a path of a flow of a cleaning spray and a movable nozzle to provide the flow of the cleaning spray at a first pressure in a path of portions of the chamber component. The first cleaning station has a push mechanism to force a cleaning fluid through features and/or holes of the chamber component and at least one movable transducer to provide ultrasonic energy to the portions of the chamber component.

    ALUMINUM PLATING AT LOW TEMPERATURE WITH HIGH EFFICIENCY

    公开(公告)号:US20180230616A1

    公开(公告)日:2018-08-16

    申请号:US15884006

    申请日:2018-01-30

    IPC分类号: C25D3/44 C25D5/00

    摘要: The present disclosure generally relates to methods of electro-depositing a crystalline layer of pure aluminum onto the surface of an aluminum alloy article. The methods may include positioning the article and an electrode in an electro-deposition solution. The electro-deposition solution includes one or more of an aluminum halide, an organic chloride salt, an aluminum reducing agent, a solvent such as a nitrile compound, and an alkali metal halide. The solution is blanketed with an inert gas, agitated, and a crystalline layer of aluminum is deposited on the article by applying a bias voltage to the article and the electrode.

    WET CLEANING OF ELECTROSTATIC CHUCK

    公开(公告)号:US20210249280A1

    公开(公告)日:2021-08-12

    申请号:US17051071

    申请日:2019-05-02

    IPC分类号: H01L21/67 H01L21/683 B08B3/12

    摘要: Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface. The cleaning fixture includes a mounting plate having a plurality of thru-holes arranged on a bolt circle and configured to align with a plurality of thread holes disposed in an electrostatic chuck, a recess formed in the mounting plate, and a gas port formed through the mounting plate. A sealed plenum is formed between the recess of the mounting plate and a lower surface of the electrostatic chuck when the electrostatic chuck is coupled to the mounting plate. The gas port is fluidly coupled to the sealed plenum.