公开(公告)号：US11881384B2

公开(公告)日：2024-01-23

申请号：US16586482

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Vladimir Knyazik ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32 ,  C23C16/511 ,  C23C16/455

CPC classification number: H01J37/3244 ,  C23C16/45559 ,  C23C16/45561 ,  C23C16/511 ,  H01J2237/334 ,  H01J2237/335 ,  H01J2237/3321

Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.

公开(公告)号：US11670489B2

公开(公告)日：2023-06-06

申请号：US17351088

申请日：2021-06-17

Applicant: Applied Materials, Inc.

Inventor： Joseph F. AuBuchon ,  James Carducci ,  Larry D. Elizaga ,  Richard C. Fovell ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32 ,  H01P1/208

CPC classification number: H01J37/32256 ,  H01J37/32266 ,  H01J2237/0817 ,  H01J2237/334 ,  H01J2237/335 ,  H01P1/2084

Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.

公开(公告)号：US20210098231A1

公开(公告)日：2021-04-01

申请号：US16586482

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Vladimir Knyazik ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.

公开(公告)号：US12144090B2

公开(公告)日：2024-11-12

申请号：US18082452

申请日：2022-12-15

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H05B6/64 ,  H05B6/80

Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.

公开(公告)号：US20230135935A1

公开(公告)日：2023-05-04

申请号：US18082452

申请日：2022-12-15

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H05B6/64 ,  H05B6/80

Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.

公开(公告)号：US11915850B2

公开(公告)日：2024-02-27

申请号：US15848856

申请日：2017-12-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Richard C. Fovell ,  Kartik Ramaswamy ,  Larry D. Elizaga

IPC: H01F27/08 ,  H01F27/28 ,  H01J37/32 ,  H01L21/67

CPC classification number: H01F27/08 ,  H01F27/28 ,  H01F27/2876 ,  H01J37/321 ,  H01J37/3244 ,  H01L21/67069 ,  H01J2237/334 ,  H01L21/67109

Abstract: A coil assembly for controlling a magnetic field in a plasma chamber is provided herein. In some embodiments, the coil assembly may include a mandrel including an annular body that includes at least one upper body coolant channel and at least one lower body coolant channel, and a plurality of cooling fins disposed circumferentially about an outer diameter of the body and radially outward from the outer diameter, an inner electromagnetic cosine-theta (cos θ) coil ring including a first set of inner coils wrapped around the plurality of cooling fins in the body and configured to generate a magnetic field in a first direction, an outer electromagnetic cosine-theta (cos θ) coil ring including a second set of outer coils wrapped around the plurality of cooling fins and configured to generate a magnetic field in a second direction orthogonal to the first direction.

公开(公告)号：US20210313153A1

公开(公告)日：2021-10-07

申请号：US17351088

申请日：2021-06-17

Applicant: Applied Materials, Inc.

Inventor： Joseph F. AuBuchon ,  James Carducci ,  Larry D. Elizaga ,  Richard C. Fovell ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.

公开(公告)号：US11049694B2

公开(公告)日：2021-06-29

申请号：US16586597

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： Joseph F. AuBuchon ,  James Carducci ,  Larry D. Elizaga ,  Richard C. Fovell ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32 ,  H01P1/208

Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.

公开(公告)号：US12191118B2

公开(公告)日：2025-01-07

申请号：US18419389

申请日：2024-01-22

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Vladimir Knyazik ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/511

Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.

公开(公告)号：US11564292B2

公开(公告)日：2023-01-24

申请号：US16586548

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： James Carducci ,  Richard C. Fovell ,  Larry D. Elizaga ,  Silverst Rodrigues ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H05B6/64 ,  H05B6/80

Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.