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公开(公告)号：US12144090B2
公开(公告)日：2024-11-12
申请号：US18082452
申请日：2022-12-15
Applicant: Applied Materials, Inc.
Inventor： James Carducci , Richard C. Fovell , Larry D. Elizaga , Silverst Rodrigues , Thai Cheng Chua , Philip Allan Kraus
Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
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公开(公告)号：US20230135935A1
公开(公告)日：2023-05-04
申请号：US18082452
申请日：2022-12-15
Applicant: Applied Materials, Inc.
Inventor： James Carducci , Richard C. Fovell , Larry D. Elizaga , Silverst Rodrigues , Thai Cheng Chua , Philip Allan Kraus
Abstract: Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.
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公开(公告)号：US11881384B2
公开(公告)日：2024-01-23
申请号：US16586482
申请日：2019-09-27
Applicant: Applied Materials, Inc.
Inventor： James Carducci , Richard C. Fovell , Larry D. Elizaga , Silverst Rodrigues , Vladimir Knyazik , Philip Allan Kraus , Thai Cheng Chua
IPC: H01J37/32 , C23C16/511 , C23C16/455
CPC classification number: H01J37/3244 , C23C16/45559 , C23C16/45561 , C23C16/511 , H01J2237/334 , H01J2237/335 , H01J2237/3321
Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.
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公开(公告)号：US11670489B2
公开(公告)日：2023-06-06
申请号：US17351088
申请日：2021-06-17
Applicant: Applied Materials, Inc.
Inventor： Joseph F. AuBuchon , James Carducci , Larry D. Elizaga , Richard C. Fovell , Philip Allan Kraus , Thai Cheng Chua
CPC classification number: H01J37/32256 , H01J37/32266 , H01J2237/0817 , H01J2237/334 , H01J2237/335 , H01P1/2084
Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.
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公开(公告)号：US20210391149A1
公开(公告)日：2021-12-16
申请号：US16898259
申请日：2020-06-10
Applicant: Applied Materials, Inc.
Inventor： Philip Allan Kraus , Robert Moore , James Carducci , Richard Fovell , Sathya Swaroop Ganta , Karthikeyan Balaraman , Silverst Rodrigues
IPC: H01J37/32
Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.
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Patent Agency Ranking
公开(公告)号：US12033835B2
公开(公告)日：2024-07-09
申请号：US16898259
申请日：2020-06-10
Applicant: Applied Materials, Inc.
Inventor： Philip Allan Kraus , Robert Moore , James Carducci , Richard Fovell , Sathya Swaroop Ganta , Karthikeyan Balaraman , Silverst Rodrigues
IPC: H01J37/32
CPC classification number: H01J37/32467 , H01J37/3222 , H01J37/3244 , H01J37/32513
Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.
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公开(公告)号：US11189502B2
公开(公告)日：2021-11-30
申请号：US16376367
申请日：2019-04-05
Applicant: Applied Materials, Inc.
Inventor： Kallol Bera , Shahid Rauf , James Carducci , Vladimir Knyazik , Anantha K. Subramani
Abstract: Gas distribution modules comprising a housing with an upper plenum and a lower plenum are described. One of the upper plenum and lower plenum is in fluid communication with an inlet and the other is in fluid communication with an outlet. A plurality of upper passages connects the upper plenum to the bottom of the housing to allow a flow of gas to pass through and be isolated from the first plenum.
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公开(公告)号：US20210098231A1
公开(公告)日：2021-04-01
申请号：US16586482
申请日：2019-09-27
Applicant: Applied Materials, Inc.
Inventor： James Carducci , Richard C. Fovell , Larry D. Elizaga , Silverst Rodrigues , Vladimir Knyazik , Philip Allan Kraus , Thai Cheng Chua
IPC: H01J37/32
Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.
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公开(公告)号：US20210313153A1
公开(公告)日：2021-10-07
申请号：US17351088
申请日：2021-06-17
Applicant: Applied Materials, Inc.
Inventor： Joseph F. AuBuchon , James Carducci , Larry D. Elizaga , Richard C. Fovell , Philip Allan Kraus , Thai Cheng Chua
IPC: H01J37/32
Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.
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公开(公告)号：US11049694B2
公开(公告)日：2021-06-29
申请号：US16586597
申请日：2019-09-27
Applicant: Applied Materials, Inc.
Inventor： Joseph F. AuBuchon , James Carducci , Larry D. Elizaga , Richard C. Fovell , Philip Allan Kraus , Thai Cheng Chua
Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.
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