公开(公告)号：US10604846B2

公开(公告)日：2020-03-31

申请号：US15787328

申请日：2017-10-18

Applicant: Applied Materials, Inc.

Inventor： Shinichi Kurita ,  Makoto Inagawa ,  Suhas Bhoski

IPC: C23C16/52 ,  C23C16/48 ,  F27D11/10 ,  C23C14/56 ,  C23C16/54 ,  C23C14/04 ,  C23C16/04 ,  F27B5/14 ,  C23C16/02

Abstract: Embodiments described herein relate to a thermal chamber utilized in the processing of display substrates. The thermal chamber may be part of a larger processing system configured to manufacture OLED devices. The thermal chamber may be configured to heat and cool masks and/or substrates utilized in deposition processes in the processing system. The thermal chamber may include a chamber body defining a volume sized to receive one or more cassettes containing a plurality of masks and/or substrates. Heaters coupled to the chamber body within the volume may be configured to controllably heat masks and/or substrates prior to deposition processes and cool the masks and/or substrates after deposition processes.

公开(公告)号：US08915389B2

公开(公告)日：2014-12-23

申请号：US13966329

申请日：2013-08-14

Applicant: Applied Materials, Inc.

Inventor： Shinichi Kurita ,  Mehran Behdjat ,  Makoto Inagawa

IPC: B65D6/00 ,  B65D6/02 ,  B23K15/00 ,  H01L21/673 ,  B65D6/32

CPC classification number: B65D7/06 ,  B23K15/0006 ,  B65D7/38 ,  H01L21/67379

Abstract: Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.

Abstract translation: 本文公开的实施例涉及已经焊接在一起的大型真空室主体。 腔体可以在其中的至少一个表面上具有高发射率涂层。 由于腔室主体的尺寸较大，可以通过将多个部件焊接在一起而不是从单个金属件锻造主体而形成腔体。 这些部件可以在与身体的角部间隔开的位置处被焊接在一起，该位置在排空期间可能处于最大的应力下，以确保可能是身体中最弱点的焊缝不会失效。 室主体的至少一个表面可以涂覆有高发射率涂层，以帮助来自加热的基底的热传递。 高发射率涂层可以通过降低降低衬底温度所需的时间来增加衬底通量。

公开(公告)号：US20250027887A1

公开(公告)日：2025-01-23

申请号：US18742909

申请日：2024-06-13

Applicant: Applied Materials, Inc.

Inventor： Srikanth V. Racherla ,  Ashish Singh Raichur ,  Jaeyoung Kim ,  Makoto Inagawa

IPC: G01N21/956 ,  G01N21/88 ,  G01N21/95 ,  G01N35/00

Abstract: A load lock system including an imaging subsystem and an image processing subsystem to capture comprehensive data of a substrate within a load lock chamber. The imaging subsystem can include multiple imaging elements (e.g. cameras or image sensors), to capture image data of a substrate. The image processing subsystem can process the image data with a number of computer vision, or feature extraction techniques to identify nonconformities associated with the substrate. These nonconformities can include chips, breaks, scratch, placement errors, orientation errors, or a number of other errors associated with the substrate and substrate components. The image processing subsystem can further output a message indicating any one of these errors have occurred.

公开(公告)号：US10453718B2

公开(公告)日：2019-10-22

申请号：US14035829

申请日：2013-09-24

Applicant: Applied Materials, Inc.

Inventor： Mehran Behdjat ,  Shinichi Kurita ,  John M. White ,  Suhail Anwar ,  Makoto Inagawa

IPC: H01L21/67 ,  F16K51/02

Abstract: Embodiments disclosed herein generally relate to a slit valve door assembly for sealing an opening in a chamber. A slit valve door that is pressed against the chamber to seal the slit valve opening moves with the chamber as the slit valve opening shrinks so that an o-ring pressed between the slit valve door and the chamber may move with the slit valve door and the chamber. Thus, less rubbing of the o-ring against the chamber may occur. With less rubbing, fewer particles may be generated and the o-ring lifetime may be extended. With a longer lifetime for the o-ring, substrate throughput may be increased.