公开(公告)号：US20240042570A1

公开(公告)日：2024-02-08

申请号：US18358563

申请日：2023-07-25

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Yasuhiro Hori ,  Sameer Deshpande ,  Chad Pollard ,  Sih-Ling Yeh ,  Priscilla Diep ,  Ningzhuo Cui ,  Brian J. Brown ,  Hui Chen

IPC分类号： B24B37/015

CPC分类号： B24B37/015

摘要： A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm with an a plurality of openings positioned over the platen and separated from a polishing pad for delivering the heated gas onto the polishing pad. The controller is configured to cause the heated gas to flow from the source of heated gas through the manifold and the plurality of openings to heat the polishing pad during a polishing operation, and to cause the apparatus to perform a purging operation which alternates between flowing purge gas from the purge gas source and flowing purge liquid from the purge liquid source through the manifold and the plurality of openings.

公开(公告)号：US11951589B2

公开(公告)日：2024-04-09

申请号：US16953139

申请日：2020-11-19

申请人： Applied Materials, Inc.

发明人： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

CPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B37/27

摘要： A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US20240075583A1

公开(公告)日：2024-03-07

申请号：US18505871

申请日：2023-11-09

申请人： Applied Materials, Inc.

发明人： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

CPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B37/27

摘要： A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US11298794B2

公开(公告)日：2022-04-12

申请号：US16688604

申请日：2019-11-19

申请人： Applied Materials, Inc.

发明人： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC分类号： H01L21/306 ,  B24B37/005 ,  H01L21/321

摘要： A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.

公开(公告)号：US20200282509A1

公开(公告)日：2020-09-10

申请号：US16688604

申请日：2019-11-19

申请人： Applied Materials, Inc.

发明人： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC分类号： B24B37/005 ,  H01L21/321

摘要： A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.