公开(公告)号：US20150380221A1

公开(公告)日：2015-12-31

申请号：US14551537

申请日：2014-11-24

Applicant: Applied Materials, Inc.

Inventor： Ren Liu ,  John C. Forster ,  Joseph Yudovsky ,  Somesh Khandelwal ,  Kallol Bera ,  Li-Qun Xia

IPC: H01J37/32 ,  C23C16/56 ,  C23C16/505 ,  C23C16/455

CPC classification number: H01J37/32091 ,  C23C16/45536 ,  C23C16/45551 ,  H01J37/32532 ,  H01J37/32559 ,  H01J37/32605

Abstract: A plasma source assembly for use with a processing chamber includes a blocker plate with a first set of apertures within an inner electrical center of the blocker plate and smaller apertures around the outer peripheral edge. The apertures can decrease gradually in diameter from the electrical center outward to the peripheral edge or can be in discrete increments with the smallest at the outer peripheral edge.

Abstract translation: 与处理室一起使用的等离子体源组件包括阻挡板，其在阻挡板的内部电气中心内具有第一组孔，并且围绕外周边缘具有较小的孔。 孔径可以从电气中心向外逐渐减小到周边边缘，或者可以在外围边缘处具有最小的离散增量。

公开(公告)号：US09721757B2

公开(公告)日：2017-08-01

申请号：US15168575

申请日：2016-05-31

Applicant: Applied Materials, Inc.

Inventor： John C. Forster ,  Joseph Yudovsky ,  Garry K. Kwong ,  Tai T. Ngo ,  Kevin Griffin ,  Kenneth S. Collins ,  Ren Liu

IPC: H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/32357 ,  H01J37/32513 ,  H01J37/32541 ,  H01J37/32568

Abstract: A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.

公开(公告)号：US20160276136A1

公开(公告)日：2016-09-22

申请号：US15168575

申请日：2016-05-31

Applicant: Applied Materials, Inc.

Inventor： John C. Forster ,  Joseph Yudovsky ,  Garry K. Kwong ,  Tai T. Ngo ,  Kevin Griffin ,  Kenneth S. Collins ,  Ren Liu

IPC: H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/32357 ,  H01J37/32513 ,  H01J37/32541 ,  H01J37/32568

Abstract: A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.