公开(公告)号：US10273578B2

公开(公告)日：2019-04-30

申请号：US14506317

申请日：2014-10-03

Applicant: Applied Materials, Inc.

Inventor： Joseph Yudovsky ,  Robert T. Trujillo ,  Kevin Griffin ,  Garry K. Kwong ,  Kallol Bera ,  Li-Qun Xia ,  Mandyam Sriram

IPC: C23C16/455 ,  C23C16/46 ,  C23C16/458

Abstract: A heating module for use in a substrate processing chamber. The heating module having a housing with a heat source therein. The heating module can be part of a gas distribution assembly positioned above a susceptor assembly to heat the top surface of the susceptor and wafers directly. The heating module can have constant or variable power output. Processing chambers and methods of processing a wafer using the heating module are described.

公开(公告)号：US10197385B2

公开(公告)日：2019-02-05

申请号：US15608361

申请日：2017-05-30

Applicant: Applied Materials, Inc.

Inventor： Somesh Khandelwal ,  Garry K. Kwong ,  Kevin Griffin ,  Joseph Yudovsky

IPC: G01D5/34 ,  C23C16/52 ,  G01B11/14 ,  H01L21/67 ,  H01L21/68 ,  C23C16/455 ,  H01L21/687

Abstract: Apparatus and methods for measuring the proximity between two components using a hardstop, an actuator and an emitter/detector passing light through a passage in the actuator are disclosed. The passage provides attenuation to the light which changes as the gap between the components changes allowing the measurement and control of the gap. Methods of determining the topology of the components using the apparatus are also described.

公开(公告)号：US20160097122A1

公开(公告)日：2016-04-07

申请号：US14506317

申请日：2014-10-03

Applicant: Applied Materials, Inc.

Inventor： Joseph Yudovsky ,  Robert T. Trujillo ,  Kevin Griffin ,  Garry K. Kwong ,  Kallol Bera ,  Li-Qun Xia ,  Mandyam Sriram

IPC: C23C16/455 ,  C23C16/46 ,  C23C16/458

CPC classification number: C23C16/45544 ,  C23C16/45551 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/45574 ,  C23C16/45578 ,  C23C16/4584 ,  C23C16/46

Abstract: A heating module for use in a substrate processing chamber. The heating module having a housing with a heat source therein. The heating module can be part of a gas distribution assembly positioned above a susceptor assembly to heat the top surface of the susceptor and wafers directly. The heating module can have constant or variable power output. Processing chambers and methods of processing a wafer using the heating module are described.

Abstract translation: 一种用于基板处理室的加热模块。 加热模块具有其中具有热源的壳体。 加热模块可以是位于基座组件上方的气体分配组件的一部分，以直接加热基座和晶片的顶表面。 加热模块可以具有恒定或可变的功率输出。 描述了处理室和使用加热模块处理晶片的方法。

公开(公告)号：US20220411924A1

公开(公告)日：2022-12-29

申请号：US17360337

申请日：2021-06-28

Applicant: Applied Materials, Inc.

Inventor： William J. Durand ,  Kenric Choi ,  Garry K. Kwong

IPC: C23C16/448

Abstract: Ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules include a container with an inlet port and an outlet port. Alternating first and second elongate walls in the container are arranged to define longitudinal flow channels containing a precursor material, and alternating first and second passages between each of the longitudinal flow channels permitting fluid communication between adjacent longitudinal flow channels, wherein the first passages are located in a lower portion of the precursor cavity and the second passages are located an upper portion of the cavity. A flow path is defined by the longitudinal flow channels and the passages, through which a carrier gas flows in contact with the precursor material. In one or more embodiments, the precursor material is a solid.

公开(公告)号：US10959294B2

公开(公告)日：2021-03-23

申请号：US15392453

申请日：2016-12-28

Applicant: Applied Materials, Inc.

Inventor： Alexander S. Polyak ,  Joseph Yudovsky ,  Garry K. Kwong

IPC: H05B3/18 ,  H01L21/67 ,  H01L21/687

Abstract: Heater assemblies comprising a cylindrical body with a surface and a central axis including a plurality of heating elements are described. The plurality of heating elements is axially spaced on the surface of the cylindrical body. Each of the heating elements forms an axially spaced heating zone. Each heating element has a spiral shape with an inner end and an outer end defining a length of the heating element. Each coil of the spiral shape is spaced from an adjacent coil by a distance sufficient to prevent arcing between adjacent coils.

公开(公告)号：US20170196047A1

公开(公告)日：2017-07-06

申请号：US15392453

申请日：2016-12-28

Applicant: Applied Materials, Inc.

Inventor： Alexander S. Polyak ,  Joseph Yudovsky ,  Garry K. Kwong

IPC: H05B6/10 ,  H05B6/36

CPC classification number: H05B6/105 ,  H01L21/67103 ,  H01L21/68764 ,  H01L21/68771 ,  H05B6/362

Abstract: Heater assemblies comprising a cylindrical body with a surface and a central axis including a plurality of heating elements are described. The plurality of heating elements is axially spaced on the surface of the cylindrical body. Each of the heating elements forms an axially spaced heating zone. Each heating element has a spiral shape with an inner end and an outer end defining a length of the heating element. Each coil of the spiral shape is spaced from an adjacent coil by a distance sufficient to prevent arcing between adjacent coils.

公开(公告)号：US20170051407A1

公开(公告)日：2017-02-23

申请号：US15222010

申请日：2016-07-28

Applicant: Applied Materials, Inc.

Inventor： Garry K. Kwong ,  Joseph Yudovsky ,  Kevin Griffin ,  Kallol Bera ,  Omer Ozgun

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/52 ,  C23C16/46

CPC classification number: C23C16/46 ,  C23C16/4404 ,  C23C16/45551

Abstract: Heating apparatus for heating substrates having a graphite body and at least one heating element comprising a continuous section of material disposed within the body are disclosed. Processing chambers incorporating the heating apparatus are also disclosed.

Abstract translation: 公开了一种用于加热具有石墨体的基板和至少一个加热元件的加热装置，该加热元件包括设置在主体内的材料的连续部分。 还公开了包括加热装置的加工室。

公开(公告)号：US20160276136A1

公开(公告)日：2016-09-22

申请号：US15168575

申请日：2016-05-31

Applicant: Applied Materials, Inc.

Inventor： John C. Forster ,  Joseph Yudovsky ,  Garry K. Kwong ,  Tai T. Ngo ,  Kevin Griffin ,  Kenneth S. Collins ,  Ren Liu

IPC: H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/32357 ,  H01J37/32513 ,  H01J37/32541 ,  H01J37/32568

Abstract: A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.

公开(公告)号：US20170261312A1

公开(公告)日：2017-09-14

申请号：US15608361

申请日：2017-05-30

Applicant: Applied Materials, Inc.

Inventor： Somesh Khandelwal ,  Garry K. Kwong ,  Kevin Griffin ,  Joseph Yudovsky

IPC: G01B11/14 ,  H01L21/687 ,  H01L21/67 ,  H01L21/68 ,  C23C16/455 ,  G01D5/34

CPC classification number: G01B11/14 ,  C23C16/455 ,  C23C16/45551 ,  C23C16/52 ,  G01D5/34 ,  H01L21/67259 ,  H01L21/681 ,  H01L21/68764

Abstract: Apparatus and methods for measuring the proximity between two components using a hardstop, an actuator and an emitter/detector passing light through a passage in the actuator are disclosed. The passage provides attenuation to the light which changes as the gap between the components changes allowing the measurement and control of the gap. Methods of determining the topology of the components using the apparatus are also described.

公开(公告)号：US09721757B2

公开(公告)日：2017-08-01

申请号：US15168575

申请日：2016-05-31

Applicant: Applied Materials, Inc.

Inventor： John C. Forster ,  Joseph Yudovsky ,  Garry K. Kwong ,  Tai T. Ngo ,  Kevin Griffin ,  Kenneth S. Collins ,  Ren Liu

IPC: H01J37/32

CPC classification number: H01J37/32091 ,  H01J37/32357 ,  H01J37/32513 ,  H01J37/32541 ,  H01J37/32568

Abstract: A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.