公开(公告)号：US20020159864A1

公开(公告)日：2002-10-31

申请号：US09972562

申请日：2001-10-05

申请人： Applied Materials, Inc.

发明人： Robert B. Lowrance

IPC分类号： C23C016/00

CPC分类号： H01L21/67126 ,  H01L21/67201 ,  H01L21/67742

摘要： A method and apparatus for transferring substrates is provided. In one embodiment, an apparatus for transferring substrates includes a first evacuable chamber and a evacuable second chamber separated by a third chamber, and a first transfer mechanism. The first transfer mechanism is movable between a first position located in the first chamber and a second position located in the third chamber. The first transfer mechanism includes a first seal plate coupled to a second seal plate and one or more substrate holders. The seal plates provides vacuum seals on opposing sides of the first chamber thereby balancing a force required to hold the first transfer mechanism and seal the first chamber from the third chamber during transfer of substrates from the substrate holder.

摘要翻译： 提供了用于传送基板的方法和装置。 在一个实施例中，用于传送基板的设备包括由第三室隔开的第一可抽空腔和可抽空的第二室，以及第一传送机构。 第一传送机构可在位于第一室中的第一位置和位于第三室中的第二位置之间移动。 第一传送机构包括联接到第二密封板和一个或多个基板保持器的第一密封板。 密封板在第一腔室的相对侧上提供真空密封，从而平衡保持第一传送机构所需的力并且在从衬底保持器传送衬底期间将第一腔室与第三腔室密封。

公开(公告)号：US20040020781A1

公开(公告)日：2004-02-05

申请号：US10630185

申请日：2003-07-29

申请人： Applied Materials, Inc.

发明人： Yezdi Dordi ,  Joe Stevens ,  Roy Edwards ,  Robert B. Lowrance ,  Michael Sugarman ,  Mark Denome

IPC分类号： C25D017/16 ,  C25D005/00

CPC分类号： H01L21/68721 ,  C25D5/20 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/08 ,  C25D21/00 ,  C25D21/18 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/68792

摘要： An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

摘要翻译： 提供了一种用于将均匀金属层电化学沉积到基底上的装置和方法。 一方面，该装置包括连接到基板电镀表面的阴极，设置在基板支撑构件上方的阳极和供应流体连接阳极和基板电镀表面的电镀溶液的电镀溶液入口。 在另一方面，该装置还包括具有电镀溶液捕捉杯和冲洗捕捉杯的双捕获杯系统。 双捕捉杯系统在处理期间提供电镀溶液和冲洗溶液的分离，并为电镀系统的不同溶液提供再循环系统。

公开(公告)号：US20030202865A1

公开(公告)日：2003-10-30

申请号：US10133152

申请日：2002-04-25

申请人： Applied Materials, Inc.

发明人： Hari Ponnekanti ,  Vinay K. Shah ,  Michael Robert Rice ,  Victor Belitsky ,  Damon Cox ,  Robert B. Lowrance ,  Joseph Arthur Kraus ,  Jeffrey C. Hudgens

IPC分类号： B65G049/05 ,  B65G057/11

CPC分类号： H01L21/67766 ,  H01L21/67742 ,  H01L21/67745

摘要： A wafer handler having a central body with a first end and a central axis of rotation is provided. A first end effector, adapted to support a first wafer, is rotatably coupled to the first end of the central body so as to define a first axis of rotation between the central body and the first end effector. Optionally, a second end effector adapted to support a second wafer is rotatably coupled to the second end of the central body so as to define a second axis of rotation between the central body and the second end effector. When the central body is rotated about the central axis of rotation in a first direction over a first angular distance, the first end effector simultaneously rotates about the first axis of rotation and the optional second end effector rotates about the second axis of rotation. Both end effectors are rotated over a second angular distance that is greater than the first angular distance. One or more of the end effectors may be pocketless.

摘要翻译： 提供具有具有第一端和中心旋转轴线的中心体的晶片处理器。 适于支撑第一晶片的第一端部执行器可旋转地联接到中心体的第一端，以便限定第一中心体与第一端部执行器之间的旋转轴线。 可选地，适于支撑第二晶片的第二端部执行器可旋转地联接到中心体的第二端，从而在中心体和第二端部执行器之间限定第二旋转轴线。 当中心体在第一方向上围绕中心旋转轴线旋转第一角度距离时，第一端部执行器同时围绕第一旋转轴线旋转，并且可选的第二端部执行器围绕第二旋转轴线旋转。 两个端部执行器旋转超过第一角距离的第二角距离。 一个或多个末端效应器可以是无袋的。

公开(公告)号：US20040191030A1

公开(公告)日：2004-09-30

申请号：US10764982

申请日：2004-01-26

申请人： APPLIED MATERIALS, INC.

发明人： Michael R. Rice ,  Robert B. Lowrance ,  Martin R. Elliott ,  Jeffrey C. Hudgens ,  Eric A. Englhardt

IPC分类号： B65G049/07

CPC分类号： H01L21/67706 ,  B65G17/20 ,  B65G37/02 ,  B65G2201/0297 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67769 ,  H01L21/67778 ,  Y10S414/135

摘要： According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

摘要翻译： 根据第一方面，提供了一种适于在半导体器件制造设备内传送衬底载体的第一传送系统。 第一输送机系统包括沿半导体器件制造设备的至少一部分形成闭合回路的带状物。 该带适于（1）在水平面上具有柔性并且在垂直平面中是刚性的; 和（2）在所述半导体器件制造设备的至少一部分内传输多个衬底载体。 还提供了许多其他方面，以及根据这些和其它方面的系统，方法和计算机程序产品。

公开(公告)号：US20040076496A1

公开(公告)日：2004-04-22

申请号：US10650312

申请日：2003-08-28

申请人： APPLIED MATERIALS, INC.

发明人： Martin R. Elliott ,  Michael Robert Rice ,  Robert B. Lowrance ,  Jeffrey C. Hudgens ,  Eric Andrew Englhardt ,  Loy Randall Stuart

IPC分类号： B65G001/00

CPC分类号： H01L21/67353 ,  H01L21/67373 ,  H01L21/67379 ,  H01L21/67386 ,  H01L21/67772 ,  Y10S414/139

摘要： A system for opening a substrate carrier includes a substrate carrier having an openable portion. The substrate carrier also has an opening mechanism coupled to the openable portion. A substrate transfer location has a support adapted to support a substrate carrier. The substrate transfer location also has an actuator mechanism. The actuator mechanism is positioned relative to the support so as to interact with the opening mechanism of the substrate carrier. The actuator mechanism of the substrate transfer location and the opening mechanism of the substrate carrier are adapted to interface with each other at the substrate transfer location so as to employ movement of the substrate carrier to achieve opening and closing of the substrate carrier.

摘要翻译： 用于打开衬底载体的系统包括具有可打开部分的衬底载体。 衬底托架还具有联接到可打开部分的打开机构。 衬底转移位置具有适于支撑衬底载体的支撑件。 基板转印位置也具有致动器机构。 致动器机构相对于支撑件定位，以便与衬底载体的开启机构相互作用。 衬底传送位置的致动器机构和衬底载体的打开机构适于在衬底传送位置处彼此接合，以便采用衬底载体的移动来实现衬底载体的打开和闭合。

公开(公告)号：US20020182036A1

公开(公告)日：2002-12-05

申请号：US09874169

申请日：2001-06-04

申请人： Applied Materials, Inc.

发明人： Robert B. Lowrance

IPC分类号： B65G049/07

CPC分类号： B25J9/106 ,  H01L21/67742

摘要： A wafer-handling robot is installed in a linear transfer chamber. The robot includes two cars mounted to travel along a linear guide. A first arm is pivotally mounted on the first car and a second arm is pivotally mounted on the second car. A robot wrist is pivotally mounted on outer ends of the two arms. When the cars are driven toward each other, the robot wrist is extended away from the linear guide. When the cars are driven away from each other, the robot wrist is retracted toward the linear guide.

摘要翻译： 晶片处理机器人安装在线性传递室中。 机器人包括安装成沿线性引导件行进的两个汽车。 第一臂枢转地安装在第一轿厢上，第二臂枢转地安装在第二轿厢上。 机器人腕部可枢转地安装在两个臂的外端。 当汽车彼此相向驱动时，机器人手腕远离线性导轨。 当汽车彼此驱动时，机器人手腕向着直线导轨缩回。

公开(公告)号：US20040081546A1

公开(公告)日：2004-04-29

申请号：US10650479

申请日：2003-08-28

申请人： APPLIED MATERIALS, INC.

发明人： Martin R. Elliott ,  Michael R. Rice ,  Robert B. Lowrance ,  Jeffrey C. Hudgens ,  Eric A. Englhardt

IPC分类号： B65H001/00

CPC分类号： H01L21/67775 ,  Y10S414/14

摘要： In one aspect, a substrate loading station for a processing tool includes plural load ports. Each load port is operatively coupled to the processing tool and has a mechanism for opening a substrate carrier. A carrier handler transports substrate carriers from a factory exchange location to the load ports without placing the carriers on any carrier support location other than the load ports. Numerous other aspects are provided.

摘要翻译： 一方面，用于处理工具的基板装载站包括多个装载端口。 每个负载端口可操作地耦合到处理工具并且具有用于打开衬底载体的机构。 载体处理器将基板载体从工厂交换位置传送到负载端口，而不将载体放置在除负载端口之外的任何载体支撑位置上。 提供了许多其他方面。

公开(公告)号：US20040081545A1

公开(公告)日：2004-04-29

申请号：US10650311

申请日：2003-08-28

申请人： APPLIED MATERIALS, INC.

发明人： Martin R. Elliott ,  Michael R. Rice ,  Robert B. Lowrance ,  Jeffrey C. Hudgens ,  Eric A. Englhardt

IPC分类号： B65H001/00

CPC分类号： H01L21/67353 ,  H01L21/67373 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S414/14

摘要： In a first aspect, an automatic door opener is provided that includes (1) a platform adapted to support a substrate carrier; (2) a door opening mechanism adapted to open a door of the substrate carrier while the substrate carrier is supported by the platform; and (3) a tunnel. The tunnel is adapted to extend from an opening in a clean room wall toward the platform and at least partially surround the platform. The tunnel is further adapted to direct a flow of air from the clean room wall toward the platform and out of the tunnel. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了一种自动开门器，其包括：（1）适于支撑衬底载体的平台; （2）门打开机构，其适于在基板载体由平台支撑的同时打开基板载体的门; 和（3）隧道。 隧道适于从洁净室壁中的开口延伸到平台并且至少部分地围绕平台。 隧道还适于将来自洁净室壁的空气流引向平台并且离开隧道。 提供了许多其他方面。

公开(公告)号：US20040062633A1

公开(公告)日：2004-04-01

申请号：US10650310

申请日：2003-08-28

申请人： APPLIED MATERIALS, INC.

发明人： Michael Robert Rice ,  Robert B. Lowrance ,  Martin R. Elliott ,  Jeffrey C. Hudgens ,  Eric A. Englhardt

IPC分类号： B65G049/07

CPC分类号： H01L21/67276 ,  H01L21/67769 ,  H01L21/67778

摘要： In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

摘要翻译： 在半导体制造设备中，输送机输送基板载体。 基板载体从输送机卸载并装载到输送机上而不停止输送机。 在卸载操作期间，负载和/或卸载机构将基板载体从输送机提升，同时匹配输送机的水平速度。 类似地，在装载操作期间，装载/卸载机构降低了基板载体与输送机的接合，同时匹配输送机的水平速度。 没有载体的单个基底可以类似地从输送机装载和/或卸载。

公开(公告)号：US20020157960A1

公开(公告)日：2002-10-31

申请号：US10178469

申请日：2002-06-24

申请人： Applied Materials, Inc.

发明人： Yezdi Dordi ,  Joe Stevens ,  Roy Edwards ,  Robert B. Lowrance ,  Michael Sugarman ,  Mark Denome

IPC分类号： C25D005/00 ,  C25D017/16 ,  C25D005/20 ,  C25D021/10 ,  C25C007/00

CPC分类号： H01L21/68721 ,  C25D5/20 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/08 ,  C25D21/00 ,  C25D21/18 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/68792

摘要： An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

摘要翻译： 提供了一种用于将均匀金属层电化学沉积到基底上的装置和方法。 一方面，该装置包括连接到基板电镀表面的阴极，设置在基板支撑构件上方的阳极和供应流体连接阳极和基板电镀表面的电镀溶液的电镀溶液入口。 在另一方面，该装置还包括具有电镀溶液捕捉杯和冲洗捕捉杯的双捕获杯系统。 双捕捉杯系统在处理期间提供电镀溶液和冲洗溶液的分离，并为电镀系统的不同溶液提供再循环系统。