公开(公告)号：US20180144966A1

公开(公告)日：2018-05-24

申请号：US15812922

申请日：2017-11-14

Applicant: Applied Materials, Inc.

Inventor： Kyung-Tae KIM ,  Su Ho CHO ,  Tsunehiko KITAMURA ,  Shinobu ABE ,  Shuran SHENG

IPC: H01L21/677

Abstract: In one embodiment, a chamber is provided that includes a chamber body and a lid defining an interior volume, a frame within the interior volume, the frame sized to receive a plurality of substrates in a first orientation, and a rotational drive assembly coupled to the frame for rotating the frame and flipping each of the plurality of substrates to a second orientation that is different than the first orientation.

公开(公告)号：US20230260811A1

公开(公告)日：2023-08-17

申请号：US18024318

申请日：2021-08-18

Applicant: Applied Materials, Inc.

Inventor： Shinobu ABE ,  Chang Hee SHIN ,  Shinichi KURITA ,  Masahiko KOWAKA

IPC: H01L21/673 ,  H01L31/18

CPC classification number: H01L21/6734 ,  H01L31/1876

Abstract: An assembled grid tray is disclosed, comprising a frame for holding multiple substrate trays to form a larger tray for use in a semiconductor processing tool. The frame may be comprised of two outer frame members that hold one or more of the trays, each with a magnet rail use with a maglev system. The frame may be further comprised of an inner frame member positioned between the outer frame members, which may also include a magnet rail, with the frame members being held in position by one or more outer beam members. The frame members may be fabricated of a material having a similar thermal expansion to trays to be placed in the frame.

公开(公告)号：US20140109940A1

公开(公告)日：2014-04-24

申请号：US14037719

申请日：2013-09-26

Applicant: Applied Materials, Inc.

Inventor： Kengo OHASHI ,  Takao HASHIMOTO ,  Shinobu ABE

IPC: B08B7/00

CPC classification number: C23C16/4405 ,  H01J37/32449 ,  H01J37/32862

Abstract: The present invention generally provides a processing chamber having shadow frame supports that direct cleaning gas flow to the corners of the chamber. The shadow frame supports are disposed along part of the chamber walls, thus leaving the corners unoccupied. During cleaning, the shadow frame is disposed in a way that it rests on both the substrate support and the shadow frame supports. Therefore, the cleaning gas flowing along the chamber walls is blocked by the shadow frame supports and the cleaning gas is forced to the corners since the shadow frame supports do not extend to the corners.

Abstract translation: 本发明总体上提供了一种处理室，该处理室具有将清洁气流引导到室的角部的阴影框架支架。 阴影框架支撑件沿着室壁的一部分设置，从而使得角部未被占据。 在清洁期间，阴影框架以其搁置在基板支撑件和阴影框架支架上的方式设置。 因此，沿着室壁流动的清洁气体被阴影框架支撑件阻挡，并且由于阴影框架支撑件不延伸到拐角，清洁气体被迫到角落。

公开(公告)号：US20210280389A1

公开(公告)日：2021-09-09

申请号：US16321660

申请日：2017-07-31

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Shinobu ABE ,  Keita KUWAHARA ,  Su Ho CHO

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/505

Abstract: Embodiments disclosed herein generally relate to a plasma processing system for modifying the uniformity pattern of a thin film deposited in a plasma processing chamber which includes at least one VHF power generator coupled to a diffuser within the plasma processing chamber. The feeding location offset of each VHF power generator and the controlling of each VHF power generator via phase modulation and sweeping allows for plasma uniformity improvements by compensating for the non-uniformity of the thin film patterns produced by the chamber, due to the standing wave effect. The power distribution between the multiple VHF power generators coupled to and/or disposed at different locations on the backing plate may be produced by dynamic phase modulation between the VHF power applied at the different coupling points.

公开(公告)号：US20190252161A1

公开(公告)日：2019-08-15

申请号：US15898133

申请日：2018-02-15

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Shinobu ABE ,  Keita KUWAHARA ,  Chang Hee SHIN ,  Su Ho CHO

IPC: H01J37/32 ,  C23C16/509

CPC classification number: H01J37/32669 ,  C23C16/509 ,  H01J37/32183 ,  H01J37/3244 ,  H01J2237/3321 ,  H01J2237/3323

Abstract: An apparatus for plasma processing of substrates is disclosed. A plasma processing chamber is provided which includes a chamber body and a lid. The lid includes a faceplate coupled to a backing plate. The faceplate and the backing plate are disposed within a processing volume defined by the chamber body and the lid. One or more ferrite blocks are coupled to the backing plate to modulate an electromagnetic field created by an RF current from an RF generator. A gas feed assembly including a gas source, a remote plasma source, and a zero field feed through are coupled to, and in fluid communication with, the processing volume through the backing plate and faceplate.

公开(公告)号：US20170306482A1

公开(公告)日：2017-10-26

申请号：US15644554

申请日：2017-07-07

Applicant: Applied Materials, Inc.

Inventor： Kengo OHASHI ,  Takao HASHIMOTO ,  Shinobu ABE

IPC: C23C16/44 ,  H01J37/32

CPC classification number: C23C16/4405 ,  H01J37/32449 ,  H01J37/32862

Abstract: The present invention generally provides a processing chamber having shadow frame supports that direct cleaning gas flow to the corners of the chamber. The shadow frame supports are disposed along part of the chamber walls, thus leaving the corners unoccupied. During cleaning, the shadow frame is disposed in a way that it rests on both the substrate support and the shadow frame supports. Therefore, the cleaning gas flowing along the chamber walls is blocked by the shadow frame supports and the cleaning gas is forced to the corners since the shadow frame supports do not extend to the corners.