公开(公告)号：US09873945B2

公开(公告)日：2018-01-23

申请号：US13871899

申请日：2013-04-26

Applicant: Applied Materials, Inc.

Inventor： Neil Morrison ,  Jose Manuel Dieguez-Campo ,  Heike Landgraf ,  Tobias Stolley ,  Stefan Hein ,  Florian Ries ,  Wolfgang Buschbeck

IPC: C23C16/509 ,  C23C16/54 ,  H01J37/32 ,  C23C16/455 ,  C23C16/50

CPC classification number: C23C16/545 ,  C23C16/45517 ,  C23C16/45519 ,  C23C16/50 ,  H01J37/32449 ,  H01J37/32513 ,  H01J37/32568 ,  H01J37/32752 ,  H01J37/32761 ,  H01J37/3277

Abstract: An apparatus includes a substrate support having an outer surface for guiding the substrate through a first vacuum processing region and at least one second vacuum processing region. First and second deposition sources correspond to the first processing region and at least one second deposition source corresponds to the at least one second vacuum processing region, wherein at least the first deposition source includes an electrode having a surface that opposes the substrate support. A processing gas inlet and a processing gas outlet are arranged at opposing sides of the surface of the electrode. At least one separation gas inlet how one or more openings, wherein the one or more openings are at least provided at one of opposing sides of the electrode surface such that the processing gas inlet and/or the processing gas outlet are provided between the one or more openings and the surface of the electrode.

公开(公告)号：US10689760B2

公开(公告)日：2020-06-23

申请号：US15351279

申请日：2016-11-14

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel Dieguez-Campo ,  Heike Landgraf ,  Tobias Stolley ,  Stefan Hein ,  Florian Ries ,  Morrison Neil

IPC: C23C16/54 ,  C23C16/44 ,  C23C16/509 ,  C23C16/455 ,  C23C14/56

Abstract: An apparatus for processing a flexible substrate is provided including a vacuum chamber having a first chamber portion, second chamber portion and third chamber portion. The apparatus further includes an unwinding shaft supporting the flexible substrate to be processed and a winding shaft supporting the flexible substrate after processing, wherein the unwinding shaft and the winding shaft are disposed in the first chamber portion, a first wall separating the first chamber portion from the second chamber portion, wherein the first wall is inclined with respect to a vertical and horizontal orientation, a coating drum having a first portion disposed in the second chamber portion and a second portion disposed in the third chamber portion, and a plurality of processing stations disposed at least partially in the third chamber portion, wherein a majority of the plurality of the processing stations are disposed below a rotational axis of the coating drum.

公开(公告)号：US09534294B2

公开(公告)日：2017-01-03

申请号：US13965968

申请日：2013-08-13

Applicant: Applied Materials, Inc.

Inventor： Florian Ries ,  Stefan Hein ,  Stefan Lorenz ,  Neil Morrison ,  Tobias Stolley

IPC: C25F1/00 ,  C23C16/44 ,  H01J37/32

CPC classification number: C23C16/4405 ,  H01J37/3277 ,  H01J37/32862 ,  Y10T428/18 ,  Y10T428/192

Abstract: According to the present disclosure, a method for cleaning the processing chamber of a flexible substrate processing apparatus without breaking the vacuum in the processing chamber is provided. The method for cleaning the processing chamber includes guiding a sacrificial foil into the processing chamber; initiating a first pump process in the processing chamber; plasma cleaning the processing chamber while the sacrificial foil is provided in the processing chamber; initiating a second pump process in the processing chamber; and guiding a flexible substrate into the processing chamber.

Abstract translation: 根据本公开，提供了一种用于清洁柔性基板处理设备的处理室而不破坏处理室中的真空的方法。 用于清洁处理室的方法包括将牺牲箔引导到处理室中; 在处理室中启动第一泵过程; 等离子体清洁处理室，同时牺牲箔设置在处理室中; 在处理室中启动第二泵过程; 并将柔性基板引导到处理室中。