Cleaning method for thin-film processing applications and apparatus for use therein
    10.
    发明授权
    Cleaning method for thin-film processing applications and apparatus for use therein 有权
    薄膜加工用的清洗方法及其用途

    公开(公告)号:US09534294B2

    公开(公告)日:2017-01-03

    申请号:US13965968

    申请日:2013-08-13

    Abstract: According to the present disclosure, a method for cleaning the processing chamber of a flexible substrate processing apparatus without breaking the vacuum in the processing chamber is provided. The method for cleaning the processing chamber includes guiding a sacrificial foil into the processing chamber; initiating a first pump process in the processing chamber; plasma cleaning the processing chamber while the sacrificial foil is provided in the processing chamber; initiating a second pump process in the processing chamber; and guiding a flexible substrate into the processing chamber.

    Abstract translation: 根据本公开,提供了一种用于清洁柔性基板处理设备的处理室而不破坏处理室中的真空的方法。 用于清洁处理室的方法包括将牺牲箔引导到处理室中; 在处理室中启动第一泵过程; 等离子体清洁处理室,同时牺牲箔设置在处理室中; 在处理室中启动第二泵过程; 并将柔性基板引导到处理室中。

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