公开(公告)号：US12060634B2

公开(公告)日：2024-08-13

申请号：US17317115

申请日：2021-05-11

Applicant: Applied Materials, Inc.

Inventor： Stefan Bangert ,  Thomas Deppisch ,  Wolfgang Buschbeck

IPC: C23C14/54 ,  C23C14/50 ,  C23C14/56 ,  C23C16/458 ,  C23C16/46

CPC classification number: C23C14/541 ,  C23C14/505 ,  C23C14/562 ,  C23C16/4584 ,  C23C16/463

Abstract: A roller for transporting a flexible substrate is described. The roller includes a first coolant supply for cooling a first part of the roller and a second coolant supply for cooling a second part and a third part of the roller. The first part is provided between the second part and the third part. Additionally, a vacuum processing apparatus including a roller and a method of cooling a roller are described.

公开(公告)号：US09873945B2

公开(公告)日：2018-01-23

申请号：US13871899

申请日：2013-04-26

Applicant: Applied Materials, Inc.

Inventor： Neil Morrison ,  Jose Manuel Dieguez-Campo ,  Heike Landgraf ,  Tobias Stolley ,  Stefan Hein ,  Florian Ries ,  Wolfgang Buschbeck

IPC: C23C16/509 ,  C23C16/54 ,  H01J37/32 ,  C23C16/455 ,  C23C16/50

CPC classification number: C23C16/545 ,  C23C16/45517 ,  C23C16/45519 ,  C23C16/50 ,  H01J37/32449 ,  H01J37/32513 ,  H01J37/32568 ,  H01J37/32752 ,  H01J37/32761 ,  H01J37/3277

Abstract: An apparatus includes a substrate support having an outer surface for guiding the substrate through a first vacuum processing region and at least one second vacuum processing region. First and second deposition sources correspond to the first processing region and at least one second deposition source corresponds to the at least one second vacuum processing region, wherein at least the first deposition source includes an electrode having a surface that opposes the substrate support. A processing gas inlet and a processing gas outlet are arranged at opposing sides of the surface of the electrode. At least one separation gas inlet how one or more openings, wherein the one or more openings are at least provided at one of opposing sides of the electrode surface such that the processing gas inlet and/or the processing gas outlet are provided between the one or more openings and the surface of the electrode.

公开(公告)号：US08869967B2

公开(公告)日：2014-10-28

申请号：US13748271

申请日：2013-01-23

Applicant: Applied Materials, Inc.

Inventor： Wolfgang Buschbeck ,  Juergen Henrich ,  Andreas Lopp ,  Susanne Schlaefer

IPC: B23B13/00 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67739 ,  H01L21/67201

Abstract: A dynamic load lock chamber that includes a plurality of actuators positioned along its length to achieve a desired pressure gradient from an atmospheric pressure side to a processing pressure side of the chamber is provided. The chamber includes a transport belt continuously running through the chamber to transport substrates from the atmospheric pressure side to the processing pressure side of the chamber, if situated on an inlet side of a production line, and from the processing pressure side to the atmospheric pressure side of the chamber, if positioned on an outlet side of the production line. Separation mechanisms may be attached to the belt to separate discrete regions within the chamber into a plurality of discrete volumes. Substrates may be disposed between the separation mechanisms, such that separation between adjacent pressure regions within the chamber is maintained as the substrates are transported through the chamber.

Abstract translation: 提供一种动态负载锁定室，其包括沿其长度定位的多个致动器，以实现从室的大气压侧到处理压力侧的期望的压力梯度。 所述腔室包括连续运行通过所述腔室的输送带，以将衬底从所述大气压侧输送到所述腔室的处理压力侧，如果位于生产线的入口侧，以及从处理压力侧到大气压侧 如果位于生产线的出口侧。 分离机构可以附接到带上以将腔室内的离散区域分离成多个离散体积。 衬底可以设置在分离机构之间，使得当衬底被输送通过腔室时，保持室内的相邻压力区域之间的间隔。

公开(公告)号：US11905589B2

公开(公告)日：2024-02-20

申请号：US16998872

申请日：2020-08-20

Applicant: Applied Materials, Inc.

Inventor： Andreas Lopp ,  Stefan Bangert ,  Wolfgang Buschbeck

IPC: C23C14/24 ,  C23C14/56 ,  C23C14/54 ,  C23C14/26

CPC classification number: C23C14/26 ,  C23C14/24 ,  C23C14/541 ,  C23C14/562

Abstract: One or more heating assemblies for a material deposition apparatus for pre-heating a substrate before entering a material deposition area and/or for post-heating the substrate after exiting the material deposition area are described.