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公开(公告)号：US10103005B2
公开(公告)日：2018-10-16
申请号：US14795877
申请日：2015-07-09
Applicant: Applied Materials Israel Ltd.
Inventor： Yuval Gronau , Ishai Schwarzband , Barak Dee-Noor
Abstract: Disclosed herein are a system and method for imaging low electron yield regions with a charged beam imager. In certain embodiments, a system may include a processor, wherein the processor comprise an image waveform finder, a synthetic image generator and an output image generator; wherein the processor is configured to (i) receive or generate multiple images of a region of the object; wherein the region has an electron yield that is below an electron yield threshold; (ii) process the multiple images to generate multiple synthetic images, and (iii) generate an output image of the region in response to the multiple synthetic images.
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公开(公告)号：US10288409B2
公开(公告)日：2019-05-14
申请号：US14676571
申请日：2015-04-01
Applicant: APPLIED MATERIALS ISRAEL LTD.
Inventor： Yuval Gronau , Chun-Hsiang Yen , Barak Dee-Noor
IPC: G01B11/02 , G01B11/00 , F16M11/42 , H01L21/67 , H01L21/687
Abstract: A system that may include a movable support module for supporting an object and a controller, wherein the controller is configured to: receive an estimated location of a movable support module that supports an object and temperature information about an actual or estimated temperature of at least a portion of the object support module; and calculate movable support module location information, in response to (a) the estimated location of the movable support module, (b) the temperature information, and (c) a mapping between (i) values of the temperature information, (ii) estimated locations of the movable support module, and (iii) location errors of the movable support module.
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公开(公告)号：US10074512B2
公开(公告)日：2018-09-11
申请号：US14795795
申请日：2015-07-09
Applicant: APPLIED MATERIALS ISRAEL LTD.
Inventor： Chun-Hsiang Yen , Barak Dee-Noor , Yuval Gronau , Ronen Hagai , Efim Vinnitsky , Yohanan Madmon
CPC classification number: H01J37/24 , G03F7/70875 , H01J37/20 , H01J2237/002 , H01J2237/20278 , H01L21/67248 , H01L21/68 , H01L22/12
Abstract: A system that may include a chamber, a motorized system, a chuck, a controller, multiple temperature sensors and a cooling module; wherein the chuck is configured to support an object that is positioned within the chamber; wherein the motorized system is configured to move the chuck in relation to the chamber; wherein the multiple temperature sensors are configured to sense multiple temperatures of at least one point within the chamber; wherein the cooling module is configured to cool a unit of the motorized system; and wherein the controller is configured to control the cooling module in response to the multiple temperatures.
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4.发明申请公开(公告)号：US20170011882A1
公开(公告)日：2017-01-12
申请号：US14795795
申请日：2015-07-09
Applicant: Applied Materials Israel, Ltd.
Inventor： Chun-Hsiang Yen , Barak Dee-Noor , Yuval Gronau , Ronen Hagai , Efim Vinnitsky , Yohanan Madmon
CPC classification number: H01J37/24 , G03F7/70875 , H01J37/20 , H01J2237/002 , H01J2237/20278 , H01L21/67248 , H01L21/68 , H01L22/12
Abstract: A system that may include a chamber, a motorized system, a chuck, a controller, multiple temperature sensors and a cooling module; wherein the chuck is configured to support an object that is positioned within the chamber; wherein the motorized system is configured to move the chuck in relation to the chamber; wherein the multiple temperature sensors are configured to sense multiple temperatures of at least one point within the chamber; wherein the cooling module is configured to cool a unit of the motorized system; and wherein the controller is configured to control the cooling module in response to the multiple temperatures.
Abstract translation: 可以包括室，电动系统，卡盘，控制器，多个温度传感器和冷却模块的系统; 其中所述卡盘被构造成支撑位于所述腔室内的物体; 其中所述电动系统被配置成相对于所述室移动所述卡盘; 其中所述多个温度传感器被配置为感测所述室内的至少一个点的多个温度; 其中所述冷却模块被配置为冷却所述电动系统的单元; 并且其中所述控制器被配置为响应于所述多个温度来控制所述冷却模块。
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