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    Thin film magnetic head including layered magnetic side poles
    3.
    发明授权
    Thin film magnetic head including layered magnetic side poles 失效
    薄膜磁头包括分层磁极侧极

    公开(公告)号：US5748417A

    公开(公告)日：1998-05-05

    申请号：US641345

    申请日：1996-05-01

    申请人： Arun Malhotra ,  Jane Ang ,  G. Robert Gray ,  James Watterston

    发明人： Arun Malhotra ,  Jane Ang ,  G. Robert Gray ,  James Watterston

    IPC分类号： G11B5/23 ,  G11B5/235 ,  G11B5/31 ,  G11B5/48 ,  G11B5/147

    CPC分类号： G11B5/3133 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/3116 ,  G11B5/313 ,  G11B5/3146 ,  G11B5/3163 ,  G11B5/3183 ,  G11B5/488 ,  G11B5/232 ,  G11B5/235 ,  G11B5/3113 ,  G11B5/4893

    摘要： A thin film magnetic head is fabricated on a substrate by depositing a seed layer on the substrate. This seed layer is advantageously used as a common seed for a plurality of magnetic head related structures which are built-up on the substrate. A lower magnetic layer is plated on the substrate in an opening provided in an insulative layer which is deposited on the substrate. The aforementioned seed layer is used as the seed for this lower magnetic layer. A plurality of magnetic layers are plated at one end of the lower magnetic layer to build-up and form a first side pole by using the above seed layer as a seed. Another plurality of magnetic layers are plated at the other end of the lower magnetic layer to build-up and form a second side pole by using the same seed layer as a seed. The first and second side poles thus formed include upper and lower ends, the lower ends being plated to the ends of the lower magnetic layer. A first upper pole is plated to the upper end of the first side pole. The first upper pole includes a gap end facing the second side pole. A gap region of nonmagnetic material is deposited adjacent the gap end of the first upper pole. A second upper pole is plated to the upper end of the second side pole and includes a gap end adjacent the gap region.

    摘要翻译： 通过在衬底上沉积种子层，在衬底上制造薄膜磁头。 该种子层有利地用作在基底上积累的多个磁头相关结构的常见种子。 在设置在沉积在基板上的绝缘层中的开口中，在基板上电镀下层磁性层。 上述种子层用作该下层磁性层的种子。 多个磁性层通过使用上述种子层作为种子在下部磁性层的一端进行电镀以形成第一侧极。 另外多个磁性层在下部磁性层的另一端被电镀，以通过使用与种子相同的种子层来形成第二侧极。 这样形成的第一和第二侧极包括上端和下端，下端被电镀到下磁性层的端部。 第一上极被电镀到第一侧极的上端。 第一上极包括面向第二侧极的间隙端。 非磁性材料的间隙区域邻近第一上极的间隙端部沉积。 第二上极被电镀到第二侧极的上端，并且包括邻近间隙区的间隙端。

    Method of fabricating a thin film magnetic head including layered magnetic side poles
    4.
    发明授权
    Method of fabricating a thin film magnetic head including layered magnetic side poles 失效
    包括层状磁性侧极的薄膜磁头的制造方法

    公开(公告)号：US5673474A

    公开(公告)日：1997-10-07

    申请号：US722702

    申请日：1996-09-30

    申请人： James Watterston ,  Arun Malhotra ,  G. Robert Gray ,  Jane Ang

    发明人： James Watterston ,  Arun Malhotra ,  G. Robert Gray ,  Jane Ang

    IPC分类号： G11B5/235 ,  G11B5/31 ,  G11B5/42

    CPC分类号： G11B5/3133 ,  G11B5/3106 ,  G11B5/3163 ,  G11B5/3183 ,  G11B5/235 ,  G11B5/3113 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49062 ,  Y10T29/49064

    摘要： A method is provided for fabricating a thin film magnetic head on a substrate. A seed layer formed on the substrate and advantageously used as a common seed for a plurality of magnetic head related structures which are built-up on the substrate. A lower magnetic layer is plated on the substrate in an opening provided in an insulative layer which is deposited on the substrate. The aforementioned seed layer is used as the seed for the plating of this lower magnetic layer. A plurality of magnetic layers are plated at one end of the lower magnetic layer to build-up and form a first side pole by again using the aforementioned seed layer as a seed. Another plurality of magnetic layers are plated at the other end of the lower magnetic layer to build-up and form a second side pole by using the same seed layer as a seed. The first and second side poles thus formed include upper and lower ends, the lower ends being plated to the ends of the lower magnetic layer. A first upper pole is plated to the upper end of the first side pole. The first upper pole includes a gap end facing the second side pole. A gap region of nonmagnetic material is deposited adjacent the gap end of the first upper pole. A second upper pole is plated to the upper end of the second side pole and includes a gap end adjacent the gap region.

    摘要翻译： 提供了一种在衬底上制造薄膜磁头的方法。 种子层，形成在衬底上并且有利地用作在衬底上积累的多个与磁头相关的结构的共同种子。 在设置在沉积在基板上的绝缘层中的开口中，在基板上电镀下层磁性层。 使用上述种子层作为用于该下部磁性层的电镀的种子。 多个磁性层在下部磁性层的一端被电镀以再次使用上述种子层作为种子来积聚并形成第一侧极。 另外多个磁性层在下部磁性层的另一端被电镀，以通过使用与种子相同的种子层来形成第二侧极。 这样形成的第一和第二侧极包括上端和下端，下端被电镀到下磁性层的端部。 第一上极被电镀到第一侧极的上端。 第一上极包括面向第二侧极的间隙端。 非磁性材料的间隙区域邻近第一上极的间隙端部沉积。 第二上极被电镀到第二侧极的上端，并且包括邻近间隙区的间隙端。

    Thin film magnetic head including an integral layered shield structure
    5.
    发明授权
    Thin film magnetic head including an integral layered shield structure 失效
    薄膜磁头包括一体的分层屏蔽结构

    公开(公告)号：US5490028A

    公开(公告)日：1996-02-06

    申请号：US297183

    申请日：1994-08-26

    申请人： Jane Ang ,  Arun Malhotra ,  G. Robert Gray ,  James Watterston

    发明人： Jane Ang ,  Arun Malhotra ,  G. Robert Gray ,  James Watterston

    IPC分类号： G11B5/11 ,  G11B5/23 ,  G11B5/235 ,  G11B5/31 ,  G11B5/48 ,  G11B5/147

    CPC分类号： G11B5/488 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/3116 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3146 ,  G11B5/3163 ,  G11B5/3183 ,  G11B5/112 ,  G11B5/232 ,  G11B5/235 ,  G11B5/3113 ,  G11B5/4893 ,  Y10T29/49064

    摘要： A thin film magnetic head is fabricated on a substrate by depositing a lower shield layer on the substrate. A lower layer of a magnetic yoke is situated on the lower shield layer to couple the yoke to the shield. Alternatively, the magnetic yoke is isolated from the lower shield layer by an insulative layer therebetween. At the same time that first and second magnetic side poles are built up layer by layer via successive plating operations at the respective ends of a lower magnetic layer of the yoke, a side shield structure is plated up, layer by layer, at the periphery of the lower shield layer to surround resultant side pole structure. A shield cover is plated on the top of the side shield to substantially enclose the side pole structure, but leave an opening for an insulative pedestal though which the tops of the side poles extend. First and second magnetic poles are plated to the tops of the first and second side poles such that a gap region of non-magnetic material is formed therebetween.

    摘要翻译： 通过在衬底上沉积下屏蔽层，在衬底上制造薄膜磁头。 磁轭的下层位于下屏蔽层上，以将磁轭耦合到屏蔽。 或者，磁轭通过其间的绝缘层与下屏蔽层隔离。 同时，通过在磁轭的下磁性层的各个端部处经过连续的电镀操作逐层地构成第一和第二磁性侧极，侧屏蔽结构逐层地在 所述下屏蔽层围绕所得到的侧极结构。 屏蔽盖被镀在侧护罩的顶部上以基本上封闭侧杆结构，但是留下用于绝缘基座的开口，侧极的顶部延伸通过该开口。 第一和第二磁极被电镀到第一和第二侧极的顶部，使得在它们之间形成非磁性材料的间隙区域。

    Method for electroplating metal films including use a cathode ring insulator ring and thief ring
    6.
    发明授权
    Method for electroplating metal films including use a cathode ring insulator ring and thief ring 失效
    电镀金属膜的方法，包括使用阴极环绝缘体环和小偷环

    公开(公告)号：US5744019A

    公开(公告)日：1998-04-28

    申请号：US789914

    申请日：1997-01-31

    申请人： Jane Ang

    发明人： Jane Ang

    IPC分类号： C25D7/12 ,  C25D17/12 ,  C25D21/12 ,  H01L21/48 ,  C25D5/00 ,  B05B5/025 ,  C25B15/00

    CPC分类号： C25D17/12 ,  C25D17/001 ,  C25D21/12 ,  C25D7/123 ,  H01L21/4846

    摘要： Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially uniform using a cathode assembly on which the substrate wafer is mounted. The cathode assembly includes an inner cathode ring electrically connected to the wafer, a thief ring external to the cathode ring and an insulating ring connected between and electrically insulating the cathode and thief rings. The cathode ring and the thief ring are powered by separate power sources.

    摘要翻译： 多层薄膜器件通过电镀沉积在另外基本上干净的衬底晶片上。 使用其上安装有基板晶片的阴极组件，电镀合金层的组成保持基本均匀。 阴极组件包括电连接到晶片的内部阴极环，阴极环外部的小偷环和连接在阴极和小偷环之间并将其电绝缘的绝缘环。 阴极环和小偷环由独立的电源供电。

    Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps
    7.
    发明授权
    Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps 失效
    在制造薄膜头间隙时的无电镀镍均匀配热装置和方法

    公开(公告)号：US5938845A

    公开(公告)日：1999-08-17

    申请号：US546389

    申请日：1995-10-20

    申请人： Jane Ang

    发明人： Jane Ang

    IPC分类号： C23C18/16 ,  B05C3/00

    CPC分类号： C23C18/168 ,  C23C18/1617 ,  C23C18/1619

    摘要： An electroless plating apparatus heats a plating bath solution with precise uniformity and avoids localized high temperatures within the bath. The electroless plating apparatus achieves this performance using two solution tanks included an inner tank nested inside an outer tank. A distributed heating element encases a plurality of surfaces of the outer tank, which contains an ethylene glycol solution. The inner tank contains a plating bath solution. A substrate is placed inside the inner tank for plating. Each of the outer tank and the inner tank include a device for evenly distributing the applied heat. In one embodiment, the outer tank heat distributing device is a pump which mixes the ethylene glycol solution. The inner tank heat distributing device is a pump which recirculates plating bath solution, applying returning solution via a sparger.

    摘要翻译： 无电解电镀装置加热电镀液，精细均匀，避免了浴液内的局部高温。 化学镀设备使用两个溶液罐来实现这一性能，其中包括嵌在外槽内的内罐。 分布式加热元件包围含有乙二醇溶液的外罐的多个表面。 内罐含有镀液溶液。 将基板放置在内槽内用于电镀。 外箱和内罐均设有用于均匀分布施加热量的装置。 在一个实施例中，外罐散热装置是混合乙二醇溶液的泵。 内箱散热装置是一种使电镀液溶液再循环的泵，通过喷射器应用返回的溶液。

    Electroless plating method
    8.
    发明授权
    Electroless plating method 失效
    无电镀法

    公开(公告)号：US6093453A

    公开(公告)日：2000-07-25

    申请号：US310884

    申请日：1999-05-17

    申请人： Jane Ang

    发明人： Jane Ang

    IPC分类号： C23C18/16 ,  B05D1/18

    CPC分类号： C23C18/168 ,  C23C18/1617 ,  C23C18/1619

    摘要： An electroless plating apparatus heats a plating bath solution with precise uniformity and avoids localized high temperatures within the bath. The electroless plating apparatus achieves this performance using two solution tanks included an inner tank nested inside an outer tank. A distributed heating element encases a plurality of surfaces of the outer tank, which contains an ethylene glycol solution. The inner tank contains a plating bath solution. A substrate is placed inside the inner tank for plating. Each of the outer tank and the inner tank include a device for evenly distributing the applied heat. In one embodiment, the outer tank heat distributing device is a pump which mixes the ethylene glycol solution. The inner tank heat distributing device is a pump which recirculates plating bath solution, applying returning solution via a sparger.

    摘要翻译： 无电解电镀装置加热电镀液，精细均匀，避免了浴液内的局部高温。 化学镀设备使用两个溶液罐来实现这一性能，其中包括嵌在外槽内的内罐。 分布式加热元件包围含有乙二醇溶液的外罐的多个表面。 内罐含有镀液溶液。 将基板放置在内槽内用于电镀。 外箱和内罐均设有用于均匀分布施加热量的装置。 在一个实施例中，外罐散热装置是混合乙二醇溶液的泵。 内箱散热装置是一种使电镀液溶液再循环的泵，通过喷射器应用返回的溶液。

    Method and system for removing an antiferromagnetic seed structure
    9.
    发明授权
    Method and system for removing an antiferromagnetic seed structure 失效
    去除反铁磁种子结构的方法和系统

    公开(公告)号：US08419953B1

    公开(公告)日：2013-04-16

    申请号：US13170491

    申请日：2011-06-28

    申请人： Wencheng Su ,  Zhigang Zhou ,  Jane Ang ,  Ming Jiang

    发明人： Wencheng Su ,  Zhigang Zhou ,  Jane Ang ,  Ming Jiang

    IPC分类号： B44C1/22

    CPC分类号： H01L43/12 ,  G01R33/09 ,  G01R33/093 ,  G11B5/3163 ,  G11B5/3906 ,  G11B5/3929

    摘要： A method for fabricating a transducer on a substrate is described. The transducer includes an antiferromagnetic seed structure. The antiferromagnetic seed structure includes a first NiFe layer, a first multilayer including a first Ru layer, a second NiFe layer, and a second multilayer including a second Ru layer. The second multilayer, the second NiFe layer and part of the first Ru layer are removed using a first wet etch, which uses a first etchant combination to remove NiFe and in which Ru is insoluble. The second Ru layer is removed through lift-off due to etching of the second NiFe layer. A remainder of the first Ru layer is removed through a second wet etch, which uses a second etchant combination to remove Ru. A remaining portion of the first multilayer and the first NiFe layer are removed through a third etch, which uses a third etchant combination that removes NiFe.

    摘要翻译： 描述了在衬底上制造换能器的方法。 换能器包括反铁磁种子结构。 反铁磁种子结构包括第一NiFe层，包括第一Ru层的第一多层，第二NiFe层和包含第二Ru层的第二层。 使用第一湿蚀刻去除第二层，第二NiFe层和第一Ru层的一部分，第一湿法蚀刻使用第一蚀刻剂组合去除NiFe，其中Ru不溶。 由于第二NiFe层的蚀刻，第二Ru层被剥离除去。 通过第二湿蚀刻去除第一Ru层的剩余部分，其使用第二蚀刻剂组合去除Ru。 通过第三蚀刻去除第一多层和第一NiFe层的剩余部分，该蚀刻使用去除NiFe的第三蚀刻剂组合。

    Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring
    10.
    发明授权
    Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring 失效
    用于电镀金属膜的装置，包括阴极环，绝缘体环和小偷环

    公开(公告)号：US5620581A

    公开(公告)日：1997-04-15

    申请号：US564508

    申请日：1995-11-29

    申请人： Jane Ang

    发明人： Jane Ang

    IPC分类号： C25D7/12 ,  C25D17/12 ,  C25D21/12 ,  H01L21/48 ,  B05B5/025 ,  C25B15/00 ,  C25D5/00

    CPC分类号： C25D17/12 ,  C25D17/001 ,  C25D21/12 ,  C25D7/123 ,  H01L21/4846

    摘要： Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially uniform using a cathode assembly on which the substrate wafer is mounted. The cathode assembly includes an inner cathode ring electrically connected to the wafer, a thief ring external to the cathode ring and an insulating ring connected between and electrically insulating the cathode and thief rings. The cathode ring and the thief ring are powered by separate power sources.

    摘要翻译： 多层薄膜器件通过电镀沉积在另外基本上干净的衬底晶片上。 使用其上安装有基板晶片的阴极组件，电镀合金层的组成保持基本均匀。 阴极组件包括电连接到晶片的内部阴极环，阴极环外部的小偷环和连接在阴极和小偷环之间并将其电绝缘的绝缘环。 阴极环和小偷环由独立的电源供电。