摘要:
Thermoplastic molding compositions comprising A) from 10 to 99.9% by weight of a thermoplastic polyamide, B) from 0.1 to 20% by weight of a terpolymer obtainable via copolymerization of (B1) from 1 to 70% by weight of at least one electron-deficient olefin, (B2) from 0 to 85% by weight of at least one olefin which, at its olefinic double bond, bears only hydrogen atoms and/or carbon atoms without electron-withdrawing substituents, and (B3) from 1 to 99% by weight of at least one alkoxyvinylsilane, C) from 0 to 50% by weight of a fibrous or particulate filler or a mixture of these, D) from 0 to 50% by weight of other additives, where the total of the percentages by weight of components A) to D) is 100%.
摘要:
The application provides a terpolymer obtainable by copolymerizing (A) 1% to 70% by weight of at least one electron-deficient olefin, an example being an anhydride of a monoethylenically unsaturated C4 to C6 dicarboxylic acid, (B) 1% to 85% by weight of at least one olefin which on its olefinic double bond carries only hydrogen atoms and/or carbon atoms without electron-withdrawing substituents, an example being an isobutene homopolymer or copolymer having a number-average molecular weight of 100 to 500 000, and (C) 1% to 70% by weight of at least one alkoxyvinylsilane, and also derivatives of this terpolymer that are obtainable by modification or crosslinking.
摘要:
Thermoplastic molding compositions comprising A) from 10 to 99.9% by weight of a thermoplastic polyamide, B) from 0.1 to 20% by weight of a terpolymer obtainable via copolymerization of (B1) from 1 to 70% by weight of at least one electron-deficient olefin, (B2) from 0 to 85% by weight of at least one olefin which, at its olefinic double bond, bears only hydrogen atoms and/or carbon atoms without electron-withdrawing substituents, and (B3) from 1 to 99% by weight of at least one alkoxyvinylsilane, C) from 0 to 50% by weight of a fibrous or particulate filler or a mixture of these, D) from 0 to 50% by weight of other additives, where the total of the percentages by weight of components A) to D) is 100%.
摘要:
The application provides a terpolymer obtainable by copolymerizing (A) 1% to 70% by weight of at least one electron-deficient olefin, an example being an anhydride of a monoethylenically unsaturated C4 to C6 dicarboxylic acid, (B) 1% to 85% by weight of at least one olefin which on its olefinic double bond carries only hydrogen atoms and/or carbon atoms without electron-withdrawing substituents, an example being an isobutene homopolymer or copolymer having a number-average molecular weight of 100 to 500 000, and (C) 1% to 70% by weight of at least one alkoxyvinylsilane, and also derivatives of this terpolymer that are obtainable by modification or crosslinking.
摘要:
Thermoplastic molding compositions comprising A) from 10 to 99.94% by weight of a polyamide, B) from 0.05 to 5% by weight of a polyethyleneimine homo- or copolymer, C) from 0.01 to 20% by weight of iron powder, and D) from 0 to 70% by weight of further additives, where the total of the percentages by weight of A) to D) is 100%.
摘要:
Thermoplastic molding compositions comprising A) from 10 to 99.94% by weight of a polyamide, B) from 0.05 to 5% by weight of a polyethyleneimine homo- or copolymer, C) from 0.01 to 20% by weight of iron powder, and D) from 0 to 70% by weight of further additives, where the total of the percentages by weight of A) to D) is 100%.
摘要:
Thermoplastic molding compositions, comprising A) from 10 to 98% by weight of a thermoplastic polyamide, B) from 0.01 to 20% by weight of a highly branched melamine polymer or melamine-urea polymer, or a mixture of these, C) from 0 to 70% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100%.
摘要:
Thermoplastic molding compositions, comprising A) from 10 to 99.99% by weight of a polyamide B) from 0.01 to 20% by weight of a high-functionality polyetherol with an OH number of from 3 to 1350 mg KOH/g of polyetherol (to DIN 53240, part 2), C) from 0 to 70% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100%.
摘要:
Thermoplastic molding compositions, comprising A) from 10 to 98% by weight of a polyamide B) from 0.001 to 20% by weight of iron powder with a particle size of at most 10 μm (d50 value) C) from 1 to 40% by weight of a halogen-free flame retardant from the group of the phosphorus- or nitrogen-containing compounds or P—N condensates, or a mixture of these D) from 0 to 70% by weight of further additives, where the total of the percentages by weight of components A) to D) is 100%.
摘要:
The use of thermoplastic molding materials comprising A) 10 to 98.8% by weight of a mixture formed from a1) 40 to 70% by weight of nylon-6,6 or nylon-4,6 or nylon-6 or mixtures thereof, a2) 30 to 60% by weight of a polyamide having a ratio of methylene to amide groups of 7 to 12, B) 1 to 50% by weight of a fibrous or particulate filler, C) 0.1 to 3% by weight of a lubricant, D) 0.05 to 3% by weight of a heat stabilizer, E) 0 to 40% by weight of further additives, where the sum of the percentages by weight A) to E) and a1) and a2) adds to 100%, for production of stress cracking- and corrosion-resistant moldings.