公开(公告)号：US09896765B2

公开(公告)日：2018-02-20

申请号：US15112205

申请日：2015-01-14

Applicant: Atotech Deutschland GmbH

Inventor： Boris Alexander Janssen ,  Donny Lautan

IPC: B05D3/10 ,  C23C18/32 ,  C23C18/18 ,  C23C18/16 ,  C23C18/50 ,  C23F1/30 ,  C23F1/02 ,  C23F1/44 ,  H05K3/26 ,  H05K3/18 ,  H05K3/24 ,  C23C18/42

CPC classification number: C23C18/32 ,  C23C18/1608 ,  C23C18/1841 ,  C23C18/42 ,  C23C18/50 ,  C23F1/02 ,  C23F1/30 ,  C23F1/44 ,  H05K3/187 ,  H05K3/244 ,  H05K3/26

Abstract: The present invention discloses a process for electroless plating of a metal or metal alloy onto copper features of an electronic device such as a printed circuit board which suppresses undesired skip plating and extraneous plating. The process comprises the steps i) providing such a substrate, ii) activating of the copper features with noble metal ions; iii) removing excessive noble metal ions or precipitates formed thereof with an aqueous pre-treatment composition comprising an acid, a source for halide ions and an additive selected from the group consisting of thiourea, thiourea derivatives and polymers comprising thiourea groups, and iv) electroless plating of a metal or metal alloy layer.

公开(公告)号：US20150009638A1

公开(公告)日：2015-01-08

申请号：US14368878

申请日：2013-01-21

Applicant: Atotech Deutschland GmbH

Inventor： Boris Alexander Janssen

IPC: H05K1/09 ,  H05K1/02 ,  C23C18/16 ,  H05K3/22 ,  C23C18/50

CPC classification number: H05K1/09 ,  B05D5/12 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/36 ,  C23C18/50 ,  H05K1/028 ,  H05K3/22 ,  H05K3/244 ,  H05K2201/032

Abstract: The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.

Abstract translation: 本发明涉及一种将可弯曲的镍 - 磷合金层无电沉积到诸如柔性印刷电路板等柔性基板上的方法。 镍 - 磷合金层由包含镍离子，次亚磷酸根离子，至少一种络合剂和选自甲醛和甲醛前体的晶粒细化添加剂的水性镀浴沉积。 获得的镍 - 磷合金层具有垂直于柔性基板的柱状微结构，并且是足够弯曲的。

公开(公告)号：US09089062B2

公开(公告)日：2015-07-21

申请号：US14368878

申请日：2013-01-21

Applicant: Atotech Deutschland GmbH

Inventor： Boris Alexander Janssen

IPC: B05D5/12 ,  H05K1/09 ,  C23C18/16 ,  C23C18/36 ,  H05K3/24 ,  C23C18/50 ,  H05K1/02 ,  H05K3/22

CPC classification number: H05K1/09 ,  B05D5/12 ,  C23C18/16 ,  C23C18/1633 ,  C23C18/36 ,  C23C18/50 ,  H05K1/028 ,  H05K3/22 ,  H05K3/244 ,  H05K2201/032

Abstract: The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.

Abstract translation: 本发明涉及一种将可弯曲的镍 - 磷合金层无电沉积到诸如柔性印刷电路板等柔性基板上的方法。 镍 - 磷合金层由包含镍离子，次亚磷酸根离子，至少一种络合剂和选自甲醛和甲醛前体的晶粒细化添加剂的水性镀浴沉积。 获得的镍 - 磷合金层具有垂直于柔性基板的柱状微结构，并且是足够弯曲的。