公开(公告)号：US07767472B2

公开(公告)日：2010-08-03

申请号：US11882398

申请日：2007-08-01

申请人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： H01L21/00

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20060019417A1

公开(公告)日：2006-01-26

申请号：US11187024

申请日：2005-07-22

申请人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： H01L21/66 ,  H01L21/302

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20100255757A1

公开(公告)日：2010-10-07

申请号：US12819578

申请日：2010-06-21

申请人： Atsushi SHIGETA ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi SHIGETA ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： B24B49/10 ,  B24B49/16 ,  B24B21/12

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20070287364A1

公开(公告)日：2007-12-13

申请号：US11882398

申请日：2007-08-01

申请人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

发明人： Atsushi Shigeta ,  Gen Toyota ,  Hiroyuki Yano ,  Kunio Oishi ,  Kenya Ito ,  Masayuki Nakanishi ,  Kenji Yamaguchi

IPC分类号： B24B7/00 ,  B24B1/00

CPC分类号： B24B37/013 ,  B24B9/065

摘要： A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

摘要翻译： 基板处理方法用于抛光基板。 基板处理方法包括通过马达12旋转基板13，通过将研磨机构20的研磨面压在第一面上来研磨基板13的周边部的第一面，确定第一面的研磨终点 通过监测第一表面的抛光状态，根据确定抛光终点停止抛光，确定抛光所用的抛光时间，基于抛光时间确定周边部分的第二表面的抛光时间 第一表面，并抛光第二表面以确定抛光时间。

公开(公告)号：US20090117828A1

公开(公告)日：2009-05-07

申请号：US10581669

申请日：2005-02-23

申请人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

发明人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

IPC分类号： B24B49/04 ,  B24B1/04 ,  B24B49/12 ,  B24B9/02 ,  B24B57/02

CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table (1) for holding and rotating a substrate (W), a polishing tape supply mechanism (6) for supplying a polishing tape (5) into the polishing chamber (2) and supplied to the polishing chamber (2), a polishing head (35) for pressing the polishing tape (5) against a bevel portion of the substrate (W), a liquid supply (50) for supplying a liquid to a front surface and a rear surface of the substrate (W), and a regulation mechanism (16) for making an internal pressure of the polishing chamber (2) being set to be lower than an external pressure of the polishing chamber (2).

摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括用于在其中形成研磨室（2）的壳体（3），用于保持和旋转基底（W）的旋转台（1），用于供应研磨带（5）的研磨带供给机构 ）到抛光室（2）中并供给到抛光室（2），用于将抛光带（5）压靠在基板（W）的斜面部分上的抛光头（35） 将液体供给到所述基板（W）的前表面和后表面;以及调节机构（16），用于使所述研磨室（2）的内部压力被设定为低于所述研磨室 （2）。

公开(公告)号：US20100136886A1

公开(公告)日：2010-06-03

申请号：US12699318

申请日：2010-02-03

申请人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

发明人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

IPC分类号： B24B49/04 ,  B24B49/12 ,  B24B21/18 ,  B24B9/02

CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带 用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构 被设定为低于抛光室的外部压力。

公开(公告)号：US07862402B2

公开(公告)日：2011-01-04

申请号：US12699318

申请日：2010-02-03

申请人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

发明人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

IPC分类号： B24B49/00

CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带 用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构 被设定为低于抛光室的外部压力。

公开(公告)号：US07682225B2

公开(公告)日：2010-03-23

申请号：US10581669

申请日：2005-02-23

申请人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

发明人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

IPC分类号： B24B24/00

CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带 用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构 被设定为低于抛光室的外部压力。

公开(公告)号：US20110237164A1

公开(公告)日：2011-09-29

申请号：US12986481

申请日：2011-01-07

申请人： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

发明人： Masaya SEKI ,  Kenya Ito ,  Masayuki Nakanishi

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： B24B9/065 ,  B24B21/004 ,  B24B37/27

摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.

摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构3，其构造成水平地保持基板W并使基板W旋转; 以及设置在基板的周边部分附近的至少一个抛光头30。 抛光头30具有沿着基板W的圆周方向延伸的至少一个突起51a，51b，并且抛光头30被构造成通过突起51a，51b将抛光带23的抛光表面压靠在基板 基底W从上方或下方。

公开(公告)号：US08445360B2

公开(公告)日：2013-05-21

申请号：US13027551

申请日：2011-02-15

申请人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

发明人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota

IPC分类号： H01L21/46 ,  H01L21/30 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L21/02038 ,  B24B9/065 ,  B24B21/002 ,  B24B37/042 ,  H01L21/02087 ,  H01L21/304 ,  H01L21/76256

摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.

摘要翻译： 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜， 暴露下面的硅。 在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。