摘要:
In order to allow critical flaws in an inspected item to be determined early during a production process, the present invention includes the following steps: a step of detecting defects in a production process for the inspected item and storing defect positions; a step of collecting detailed defect information and storing the detailed information in association with defect positions; a step of storing positions at which flaws were generated based on a final inspection of the inspected item; a step of comparing defect positions with positions at which flaws were generated; and a step of classifying and displaying detailed information based on the comparison results.
摘要:
A system for analyzing defects in electronic circuit patterns, including: comparing position information of structural defects with position information of electrical faults and extracting corroborated defects having common position information between the structural defects and electrical faults; classifying images of extracted corroborated defects into critical defect images and non-critical defect images based on a pre-stored classification rule which defines critical and non-critical defects by referring to images of defects, position information of defects, and results of performing an electronic test; modifying the pre-stored classification rule by correcting classification of classified defect images displayed on the screen; and repeating the operations for each subsequent object, wherein for each present object under inspection, using a modified pre-stored classification rule with respect to a previous object, as the pre-stored classification rule for the operations with respect to the present object.
摘要:
A system for analyzing defects in electronic circuit patterns, including: comparing position information of structural defects with position information of electrical faults and extracting corroborated defects having common position information between the structural defects and electrical faults; classifying images of extracted corroborated defects into critical defect images and non-critical defect images based on a pre-stored classification rule which defines critical and non-critical defects by referring to images of defects, position information of defects, and results of performing an electronic test; modifying the pre-stored classification rule by correcting classification of classified defect images displayed on the screen; and repeating the operations for each subsequent object, wherein for each present object under inspection, using a modified pre-stored classification rule with respect to a previous object, as the pre-stored classification rule for the operations with respect to the present object.
摘要:
The invention is a scanning electron microscope including a switching control unit for controlling to switch at least scanning unit to switch a digital image signal of a low magnification based on a wide image taking field of view to and from a digital image signal of a high magnification based on a narrow image taking field of view from an A/D conversion unit and a beam spot diameter control unit for controlling to switch a spot diameter of electron beam on a surface of an object substrate in controlling to switch the signals by the switching control unit and a defect portion analyzing method using the scanning electron microscope.
摘要:
During closer inspection with a local defect area being magnified, it is desirable to reduce image acquisition time by making the number of stage moves as few as possible so that a defect can be observed efficiently. To accomplish this, the invention offers a method of observing samples characterized by: acquiring a reference sample image not including any defect on a sample by capturing an image of the sample, based on the information on the defect developed on the sample and detected by an inspection apparatus; adjusting the position of the sample so that the defect will fall within the field of view of image capture, based on the above information; acquiring a defective sample image including the defect on the sample by capturing an image of the sample in the adjusted position; locating the defect on the defective sample image by comparing the reference sample image and the defective sample image; acquiring a magnified image of the defect by capturing a magnified view of the local area where the located defect exists within the field of view of image capture; and displaying the magnified image of the defect on a screen.
摘要:
A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.
摘要:
A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.
摘要:
An induction heat cooking device is provided that finishes preheating in a short time and maintains the temperature obtained at the finish of the preheating. The induction heat cooking device includes a heating coil for heating a cooking container by induction, an inverter circuit for providing a high frequency current to the heating coil, an operation unit including an operation mode setting unit for setting an operation mode of the inverter circuit, an infrared sensor for detecting an infrared light that is emitted from a bottom surface of the cooking container, a control unit for controlling an output of the inverter circuit based on an output of the infrared sensor and a setting inputted to the operation unit, and a notification unit.
摘要:
An induction heat cooking device is provided that finishes preheating in a short time and maintains the temperature obtained at the finish of the preheating. When a preheating heating mode is selected as an operation mode, a control unit (8) arranged in the induction heat cooking device starts operation in a preheating mode in which a cooking container is heated with a first heating output. When an increment of an output value of an infrared sensor exceeds a first predetermined increment since the heating starts with the first heating output, the control unit causes a notification unit to notify a user that the preheating is finished, and the operation mode is changed to a waiting mode for performing heating with a second heating output that is lower than the first heating output. Further, when the user sets a heating power by means of a heating power setting unit in the preheating mode, the control unit prohibits changing to the heating power set by the user. When the user sets a heating power by means of a heating power setting unit in the waiting mode, the control unit permits changing to the heating power set by the user, and the operation mode is changed to a heating mode for performing heating with a third heating output corresponding to the heating power set by the user.
摘要:
An electro-optical inspection apparatus prevents adhesion of dust or particles to a sample surface, wherein a stage on which a sample is placed is disposed inside a vacuum chamber that can be evacuated, and a dust collecting electrode is disposed to surround a periphery of the sample. The dust collecting electrode is applied with a voltage having the same polarity as a voltage applied to the sample and an absolute value that is the same or larger than an absolute value of the voltage. Because dust or particles adhere to the dust collecting electrode, adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.