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公开(公告)号：US08632229B2
公开(公告)日：2014-01-21
申请号：US12874239
申请日：2010-09-02
申请人： Atsushi Yamazaki , Akira Konishi
发明人： Atsushi Yamazaki , Akira Konishi
CPC分类号： B60Q1/076 , B60Q1/10 , B60Q1/12 , B60Q2200/38
摘要： A vehicle headlamp system includes a headlamp having multiple control devices and an ECU. Each of the control devices controls a light irradiation condition of the headlamp. The ECU stores vehicle constants, error code information and initialization information corresponding to different types of vehicle, and controls the control devices. When a vehicle type is changed, the ECU selects at least one of the vehicle constants corresponding to the changed vehicle type, clears the stored error code information and the initialization information after selecting the at least one of the vehicle constants, stores initialization information corresponding to the changed vehicle type, and initializes the control devices. The ECU recognizes dependencies between the control devices and, if the control devices include a first control device that is independent, executes normal control by the first control device directly after initializing the first control device.
摘要翻译： 车辆前照灯系统包括具有多个控制装置和ECU的前照灯。 每个控制装置控制前照灯的光照条件。 ECU存储车辆常数，错误代码信息和对应于不同类型车辆的初始化信息，并控制控制装置。 当车辆类型改变时，ECU选择与改变的车辆类型相对应的车辆常数中的至少一个，在选择车辆常数中的至少一个之后清除所存储的错误代码信息和初始化信息，存储对应于 改变的车型，并初始化控制装置。 ECU识别控制装置之间的依赖关系，并且如果控制装置包括独立的第一控制装置，则在初始化第一控制装置之后直接执行第一控制装置的正常控制。
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公开(公告)号：US20110063860A1
公开(公告)日：2011-03-17
申请号：US12874239
申请日：2010-09-02
申请人： Atsushi Yamazaki , Akira Konishi
发明人： Atsushi Yamazaki , Akira Konishi
IPC分类号： B60Q1/04
CPC分类号： B60Q1/076 , B60Q1/10 , B60Q1/12 , B60Q2200/38
摘要： A vehicle headlamp system includes a headlamp having multiple control devices and an ECU. Each of the control devices controls a light irradiation condition of the headlamp. The ECU stores vehicle constants, error code information and initialization information corresponding to different types of vehicle, and controls the control devices. When a vehicle type is changed, the ECU selects at least one of the vehicle constants corresponding to the changed vehicle type, clears the stored error code information and the initialization information after selecting the at least one of the vehicle constants, stores initialization information corresponding to the changed vehicle type, and initializes the control devices. The ECU recognizes dependencies between the control devices and, if the control devices include a first control device that is independent, executes normal control by the first control device directly after initializing the first control device.
摘要翻译： 车辆前照灯系统包括具有多个控制装置和ECU的前照灯。 每个控制装置控制前照灯的光照条件。 ECU存储车辆常数，错误代码信息和对应于不同类型车辆的初始化信息，并控制控制装置。 当车辆类型改变时，ECU选择与改变的车辆类型相对应的车辆常数中的至少一个，在选择车辆常数中的至少一个之后清除所存储的错误代码信息和初始化信息，存储对应于 改变的车型，并初始化控制装置。 ECU识别控制装置之间的依赖关系，并且如果控制装置包括独立的第一控制装置，则在初始化第一控制装置之后直接执行第一控制装置的正常控制。
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公开(公告)号：US5204122A
公开(公告)日：1993-04-20
申请号：US824646
申请日：1992-01-23
申请人： Akira Konishi
发明人： Akira Konishi
CPC分类号： B29C45/2701 , B29C45/02 , Y10S425/228
摘要： A mold system for use in resin encapsulation molding includes a cavity serving as a resin molding section in which small size electric elements such as semiconductor devices and electrical parts are encapsulated with a synthetic resin. The system also incudes at least one pot for receiving the synthetic resin material and melting the received synthetic resin material by heating, a cull section communicating with the pot and formed facing to an opening end face, and a conveying passage for communicating the cull section and the cavity to convey molten resin material through the cull section. The synthetic resin material is placed in the cavity and is heated to melt therein, and is extruded out of the pot by a plunger disposed in an axial direction of the pot. The inner bottom of the cull section facing to the opening end face of the pot is formed unevenly.
摘要翻译： 用于树脂封装成型的模具系统包括用作树脂模制部分的空腔，其中诸如半导体装置和电气部件的小尺寸电气元件用合成树脂包封。 该系统还包括至少一个用于接收合成树脂材料的罐并通过加热熔化所接收的合成树脂材料，与罐连通并形成为面向开口端面的剔除部分，以及用于连通拣选部分和 该腔体将熔融树脂材料输送通过剔除部分。 将合成树脂材料放置在空腔中并加热熔化，并通过沿着壶的轴向设置的柱塞从罐中挤出出来。 面对锅的开口端面的剔除部分的内底部不均匀地形成。
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公开(公告)号：US4386373A
公开(公告)日：1983-05-31
申请号：US282973
申请日：1981-07-13
申请人： Mitsuru Kondo , Akira Konishi
发明人： Mitsuru Kondo , Akira Konishi
CPC分类号： H04N1/411 , H04N1/00095 , H04N1/32
摘要： A predetermined number of plural lines of compressed data are processed as one group before addition of fill bits while a minimum transmission time for each such predetermined number of lines, that is, plural lines having a predetermined length is determined in advance in consideration of a recording speed and other operating factors of a receiver. Necessary fill bits are added to each plural lines only when the actual transmission time of the plural lines of compressed data is shorter than the minimum transmission time. Fill bits may be added to compressed data bits not only for each plural lines but on a line by line basis in combination in accordance with a construction and function of a receiver.
摘要翻译： 在添加填充位之前，将预定数量的多行压缩数据作为一组进行处理，同时考虑到记录来预先确定每个这样的预定数量的行的最小传输时间，即具有预定长度的多行 速度等操作因素的接收机。 只有当多行压缩数据的实际传输时间短于最小传输时间时，必需的填充位被添加到每个多行。 可以根据接收机的结构和功能，将填充位不仅对于每个多行而且逐行地添加到压缩数据位中。
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5.发明申请HIGH Cr Ni-BASED ALLOY WELDING WIRE, SHIELDED METAL ARC WELDING ROD, AND WELD METAL FORMED BY SHIELDED METAL ARC WELDING 审中-公开高铬镍基合金焊丝，屏蔽金属弧焊和屏蔽金属焊接成形焊接金属公开(公告)号：US20140305921A1
公开(公告)日：2014-10-16
申请号：US13982878
申请日：2012-01-27
申请人： Kenji Kawasaki , Seiichi Kawaguchi , Masahiko Toyoda , Seiji Asada , Akira Konishi , Yusuke Sano , Tamao Takatsu , Teiichiro Saito , Tetsuya Sango , Norihito Ogawa
发明人： Kenji Kawasaki , Seiichi Kawaguchi , Masahiko Toyoda , Seiji Asada , Akira Konishi , Yusuke Sano , Tamao Takatsu , Teiichiro Saito , Tetsuya Sango , Norihito Ogawa
摘要： Provided is a high Cr Ni-based alloy welding wire with which tensile strength and weld cracking resistance of a welded portion, the integrity of the microstructure of a welded metal, and inhibition of scale generation are improved. The high Cr Ni-based alloy welding wire is configured to have an alloy composition comprising, by mass, C: 0.04% or less, Mn: 7% or less, Fe: 1 to 12%, Si: 0.75% or less, Al: 0.01 to 0.7%, Ti: 0.01 to 0.7%, Cr: 25.0 to 31.5%, Ta: 1 to 10%, and Mo: 1 to 6%, and as inevitable impurities, Ca+Mg: less than 0.002%, N: 0.1% or less, P: 0.02% or less, O: 0.01% or less, S: 0.0015% or less, H: 0.0015% or less, Cu: 0.08% or less, and Co: 0.05% or less, and the balance: Ni. Then, the high CrNi-based alloy welding wire is configured such that the contents of S, Ta, Al, and Ti satisfy the following relation (1) and the contents of Ta, Mo, and N satisfy the following relation (2): 12000S+0.58Ta−2.6Al−2Ti£19.3 (1) Ta+1.6Mo+187N35.7 (2).
摘要翻译： 提供了一种高Cr Ni基合金焊丝，其焊接部分的拉伸强度和焊接开裂性，焊接金属的微观结构的完整性以及阻止氧化皮的发生得到改善。 高Cr Ni系合金焊丝构造成具有以质量计C：0.04％以下，Mn：7％以下，Fe：1〜12％，Si：0.75％以下的合金成分，Al ：0.01〜0.7％，Ti：0.01〜0.7％，Cr：25.0〜31.5％，Ta：1〜10％，Mo：1〜6％，作为不可避免的杂质，Ca + Mg：小于0.002％ ：0.1％以下，P：0.02％以下，O：0.01％以下，S：0.0015％以下，H：0.0015％以下，Cu：0.08％以下，Co：0.05％以下，Co：0.05％以下， 余额：倪。 然后，高CrNi系合金焊丝被配置为使S，Ta，Al和Ti的含量满足以下关系（1），Ta，Mo和N的含量满足以下关系式（2）： 12000S + 0.58Ta-2.6Al-2Ti£19.3（1）Ta + 1.6Mo + 187N35.7（2）。
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公开(公告)号：US4599062A
公开(公告)日：1986-07-08
申请号：US682471
申请日：1984-12-17
申请人： Akira Konishi
发明人： Akira Konishi
CPC分类号： B29C45/14655 , B29C45/02
摘要： The disclosure is directed to an encapsulation molding apparatus to be used for subjecting small-sized electrical elements to encapsulation molding by a synthetic resin material. The present invention has been presented for the purpose of shortening the cycle time required for the encapsulation molding, and also, reducing cost necessary for molding metal molds, and installation cost for a molding press, etc., with a simultaneous reduction of a loss in the synthetic resin material. More specifically, in the apparatus of the present invention, for subjecting small-sized electrical elements to encapsulation molding by the synthetic resin material, pots (30) for charging the synthetic material thereinto are provided at preferably equal intervals with respect to a plurality of cavities provided in an upper mold (11) and a lower mold (12) for the formation of encapsulation molded portions, while extruding plungers (31) are provided for the respective pots for effecting the encapsulation molding. The apparatus according to the present invention may be advantageously employed as a resin encapsulating apparatus for semi-conductor devices, etc.
摘要翻译： PCT No.PCT / JP82 / 00023 Sec。 371日期：1982年11月9日 102（e）1982年11月9日PCT PCT卷号1982年1月25日PCT公布。 出版物WO82 / 02624 日本1982年8月5日公开。本发明涉及一种封装成型装置，用于使小尺寸电气元件通过合成树脂材料进行包封成型。 已经提出了本发明，目的是缩短封装成型所需的循环时间，并且还降低了模制成型所需的成本，以及成型压机等的安装成本，同时降低了损耗 合成树脂材料。 更具体地，在本发明的装置中，为了使小尺寸的电气元件通过合成树脂材料进行封装成型，用于将合成材料充入其中的盆（30）相对于多个空腔以优选相等的间隔设置 设置在用于形成封装模制部分的上模具（11）和下模具（12）中，同时为相应的罐提供挤出柱塞（31）以实现封装模制。 根据本发明的装置可以有利地用作半导体装置等的树脂封装装置。
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公开(公告)号：US4593407A
公开(公告)日：1986-06-03
申请号：US653271
申请日：1984-09-21
申请人： Akira Konishi , Shigeru Matsuura
发明人： Akira Konishi , Shigeru Matsuura
CPC分类号： G06K15/10
摘要： A pattern storage processing system for use with a page printer has a pattern storage for storing dot matrix patterns representing various characters, etc. Each pattern comprises plural portions called "squares", each of which consists of n.times.n bits. A selected pattern is transferred square by square from the pattern storage to a raster buffer via a rotator which rotates each square according to orientation information. Successive storage locations in the raster buffer which are to receive successive squares are designated by the combination of a base address in a register and offsets in an offset table.
摘要翻译： 与页面打印机一起使用的图案存储处理系统具有用于存储表示各种字符等的点阵图案的图案存储器。每个图案包括称为“正方形”的多个部分，每个部分由n×n位组成。 选择的图案通过平方根从图案存储器转移到光栅缓冲器，该旋转器根据取向信息旋转每个正方形。 要接收连续正方形的栅格缓冲器中的连续存储位置由寄存器中的基址和偏移表中的偏移的组合指定。
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公开(公告)号：US10675720B2
公开(公告)日：2020-06-09
申请号：US13982878
申请日：2012-01-27
申请人： Kenji Kawasaki , Seiichi Kawaguchi , Masahiko Toyoda , Seiji Asada , Akira Konishi , Yusuke Sano , Tamao Takatsu , Teiichiro Saito , Tetsuya Sango , Norihito Ogawa
发明人： Kenji Kawasaki , Seiichi Kawaguchi , Masahiko Toyoda , Seiji Asada , Akira Konishi , Yusuke Sano , Tamao Takatsu , Teiichiro Saito , Tetsuya Sango , Norihito Ogawa
摘要： Provided is a high Cr Ni-based alloy welding wire with which tensile strength and weld cracking resistance of a welded portion, the integrity of the microstructure of a welded metal, and inhibition of scale generation are improved. The high Cr Ni-based alloy welding wire is configured to have an alloy composition comprising, by mass, C: 0.04% or less, Mn: 7% or less, Fe: 1 to 12%, Si: 0.75% or less, Al: 0.01 to 0.7%, Ti: 0.01 to 0.7%, Cr: 25.0 to 31.5%, Ta: 1 to 10%, and Mo: 1 to 6%, and as inevitable impurities, Ca+Mg: less than 0.002%, N: 0.1% or less, P: 0.02% or less, O: 0.01% or less, S: 0.0015% or less, H: 0.0015% or less, Cu: 0.08% or less, and Co: 0.05% or less, and the balance: Ni. Then, the high CrNi-based alloy welding wire is configured such that the contents of S, Ta, Al, and Ti satisfy the following relation (1) and the contents of Ta, Mo, and N satisfy the following relation (2): 12000S+0.58Ta−2.6Al−2Ti£19.3 (1) Ta+1.6Mo+187N35.7 (2).
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公开(公告)号：US4823234A
公开(公告)日：1989-04-18
申请号：US880832
申请日：1986-07-01
申请人： Akira Konishi , Teruo Wakano
发明人： Akira Konishi , Teruo Wakano
IPC分类号： H01L21/56 , H01L23/14 , H01L23/373 , H01L25/065 , H02B1/00
CPC分类号： H01L21/565 , H01L21/56 , H01L23/145 , H01L23/3736 , H01L25/0655 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , Y10T29/49146 , Y10T29/49151
摘要： A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.
摘要翻译： 一种半导体器件，其中一个或多个半导体芯片容纳在插入式封装中。 作为封装的组成部分，封装正在模制印刷布线基板，端子头部和用于半导体芯片附接的散热器。 散热器的一个表面从封装的一侧露出，并且半导体芯片被安装在面向基板的开口的散热器的另一个表面上。
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公开(公告)号：US4291339A
公开(公告)日：1981-09-22
申请号：US906013
申请日：1978-05-15
CPC分类号： H04N1/40068 , H04N1/411
摘要： A scanner scans an original document in two orthogonal directions and produces binary data signals representing the document. An extractor combines each two scan lines into one scan line by taking the logical sum of the data signals in corresponding positions in the two original scan lines. Each second data signal is removed. The data signals in even positions in one line are removed and the data signals in odd positions in the succeeding line are removed, thereby removing the data signals in a zig-zag manner. The data signals so processed are subjected to run-length encoding. In a receiver, the data signals are run-length decoded and fed into an interpolator which senses the data signals and inserts data signals into the spaces from which data signals were removed in accordance with a predetermined logical function. The interpolator controls a printer to print each scan lines twice to reproduce the original document.
摘要翻译： 扫描仪在两个正交方向上扫描原始文档，并产生表示文档的二进制数据信号。 提取器通过在两个原始扫描线中的相应位置取数据信号的逻辑和来将每条扫描线组合成一条扫描线。 每个第二数据信号被去除。 去除一行中偶数位置的数据信号，去除后续行中奇数位置的数据信号，从而以锯齿形的方式去除数据信号。 如此处理的数据信号进行游程长度编码。 在接收机中，数据信号被游程长度解码，并被馈送到内插器中，该内插器检测数据信号，并根据预定的逻辑功能将数据信号插入数据信号被去除的空间中。 内插器控制打印机打印每条扫描线两次以再现原始文档。
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