摘要:
An electrolyte composition (A) containing (i) at least one aprotic organic solvent; (ii) at least one conducting salt; (iii) at least one compound of formula (NC)(A1X1)C═C(X2A2)(CN) wherein X1 and X2 are independently from each other selected from N(R′), P(R1), O, and S, and A1 and A2 are selected from H or organic substituents; and electrochemical cells containing electrolyte composition (A).
摘要:
The present invention relates to new catalysts for curing solventborne or solvent-free coating compositions, such as 2-component polyurethane coating materials or 2-component polyurethane adhesives.
摘要:
An electrolyte composition (A) containing (i) at least one aprotic organic solvent; (ii) at least one conducting salt; (iii) at least one compound of formula (I) wherein X1 and X2 are independently from each other selected from N(R1), P(R1), O, and S, Y1 and Y2 are independently from each other selected from (O), (S), (PR2) and (NR2); and electrochemical cells containing electrolyte composition (A).
摘要:
The present invention relates to A process for the production of a molding, comprising (I) providing a zeolitic material; (II) mixing the zeolitic material provided in step (I) with one or more binders; (III) kneading of the mixture obtained in step (II); (IV) molding of the kneaded mixture obtained in step (III) to obtain one or more moldings; (V) drying of the one or more moldings obtained in step (IV); and (VI) calcining of the dried molding obtained in step (V); wherein the zeolitic material provided in step (I) displays a water adsorption ranging from 1 to 15 wt.-% when exposed to a relative humidity of 85%, as well as to a molding obtainable or obtained according to the inventive process in addition to a molding per se and to their respective use.
摘要:
The present invention relates to electrolyte compositions containing cyclic dinitrile compounds of formula (I) wherein X1, X2, R1, and R2 are defined as described below and to their use in electrochemical cells.
摘要:
The present invention is in the field of processes for the generation of thin inorganic films on substrates, in particular atomic layer deposition processes. It relates to a process for preparing metal films comprising (a) depositing a metal-containing compound from the gaseous state onto a solid substrate and (b) bringing the solid substrate with the deposited metal-containing compound in contact with a reducing agent in the gaseous state, wherein the reducing agent is or at least partially forms at the surface of the solid substrate a carbene, a silylene or a phosphor radical.