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1.发明公开公开(公告)号：US20240258477A1
公开(公告)日：2024-08-01
申请号：US18017337
申请日：2022-01-28
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L2933/0066
摘要： A display panel includes a backplane including a first surface, a second surface and at least one side surface, at least one connection lead disposed on the backplane, and a first protective layer. The connection lead extends from the first surface to the second surface via a side surface in the at least one side surface. The connection lead includes a first lead segment located on the first surface, a second lead segment located on the second surface, and a third lead segment located on the side surface and connecting the first lead segment and the second lead segment. The first protective layer covers at least the first lead segment and the third lead segment. At least one opening is disposed in the first protective layer, and at least a portion of the second lead segment is exposed by an opening in the at least one opening.
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公开(公告)号：US20240258325A1
公开(公告)日：2024-08-01
申请号：US18016478
申请日：2022-01-29
发明人： Chao LIU , Zhonglan ZHAO , Ming ZHAI , Haiwei SUN , Lingyun SHI , Qibing GU , Lili WANG , Mingming JIA , Sha FENG , Jing WANG
CPC分类号： H01L27/124 , H01L25/167
摘要： A display panel and a display apparatus are provided. The display panel includes: a base substrate having a first face, a second face, and a side face, the first face including a display region and a peripheral region; multiple first bonding electrodes in the peripheral region each being electrically connected to a display signal line on the first face and extending from the display region to the peripheral region; multiple driving signal lines on the second face of the base substrate, wherein at least one driving signal line is a ground line; multiple side wires each electrically connecting one driving signal line to one first bonding electrode via the side face; and an electrostatic protection layer electrically connected to the ground line and having an orthographic projection on the side face that is at least partially overlapped with orthographic projections of the side wires on the side face.
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公开(公告)号：US20240258476A1
公开(公告)日：2024-08-01
申请号：US18007404
申请日：2022-02-25
发明人： Lili WANG , Chao LIU , Ming ZHAI , Jing WANG , Sha FENG , Mingming JIA , Shaofei GUO , Bao FU , Qiuhua MENG , Qi QI , Lingyun SHI , Haiwei SUN
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753
摘要： A display panel includes: a backplane, light-emitting devices, first electrodes, and connection traces. The backplane includes a first surface, a second surface opposite thereto, and side surfaces connecting the two surfaces. At least one of the side surfaces is a selected side surface. The light-emitting devices are disposed on the first surface. The first electrodes are disposed on the first surface and are proximate to the selected side surface. Each connection trace includes a first trace segment, a second trace segment, and a third trace segment that are connected in sequence. The first trace segment is disposed on the first surface, and the first trace segment is electrically connected to a first electrode. The second trace segment is disposed on the selected side surface. The third trace segment is disposed on the second surface, and is configured to be electrically connected to a flexible printed circuit.
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公开(公告)号：US20240186470A1
公开(公告)日：2024-06-06
申请号：US17796091
申请日：2021-08-27
发明人： Chuhang WANG , Sha FENG , Chao LIU , Lili WANG , Mingming JIA , Jing WANG , Ming ZHAI
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L2933/0066
摘要： A display panel includes a display substrate having a display area and at least one wiring area, and a protective film including a first protective portion and at least one second protective portion. The first protective portion is disposed on a display side of the display substrate, and covers the display area. The at least one second protective portion each covers a wiring area in the at least one wiring area, and is bent from the display side of the display substrate to a non-display side of the display substrate, by a side of the display substrate. The at least one second protective portion each includes a main film layer and a wiring layer. The wiring layer includes a plurality of wirings. At least one wiring extends from the display side of the display substrate to the non-display side of the display substrate, by the side of the display substrate.
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5.发明公开公开(公告)号：US20240097085A1
公开(公告)日：2024-03-21
申请号：US18262828
申请日：2022-07-04
发明人： Lili WANG , Sha FENG , Chao LIU , Jing WANG , Mingming JIA , Chuhang WANG , Qi QI
CPC分类号： H01L33/60 , H01L25/167 , H01L2933/0058
摘要： A display panel (10) includes a circuit backplane (1) and a reflective layer (3). The circuit backplane (1) includes a first main surface (11), a second main surface (12), and a plurality of side surfaces (13). The second main surface (12) is disposed opposite to the first main surface (11). The side surfaces (13) each connect the first main surface (11) and the second main surface (12). At least one side surface in the plurality of side surfaces (13) is a selected side surface (13a). The selected side surface (13a) is covered by the reflective layer (3), the reflective layer (3) being configured to be removed under a predetermined process condition.
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公开(公告)号：US20240164022A1
公开(公告)日：2024-05-16
申请号：US17915707
申请日：2021-11-01
发明人： Jing WANG , Mingming JIA , Lili WANG , Sha FENG , Chao LIU , Ming ZHAI , Haiwei SUN , Lingyun SHI , Liqiang WANG , Jingjing ZHANG
IPC分类号： H05K1/18 , H01L23/00 , H01L25/075 , H05K1/11
CPC分类号： H05K1/189 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/83 , H05K1/118 , H01L25/0753 , H01L2224/05573 , H01L2224/06155 , H01L2224/32225 , H01L2224/8313 , H01L2224/83201 , H05K2201/056 , H05K2201/10128
摘要： A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.
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公开(公告)号：US20210296394A1
公开(公告)日：2021-09-23
申请号：US17264036
申请日：2020-06-15
发明人： Ke MENG , Qiangwei CUI , Chao LIU , Lili WANG , Chuhang WANG , Yutian CHU , Linhui GONG
摘要： An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region, a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, m the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
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公开(公告)号：US20210167045A1
公开(公告)日：2021-06-03
申请号：US16862934
申请日：2020-04-30
发明人： Ke MENG , Chao LIU , Qiangwei CUI , Chuhang WANG , Lili WANG , Linhui GONG , Yutian CHU , Fan YANG
IPC分类号： H01L25/075 , H01L27/12 , H01L33/62
摘要： A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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9.发明公开公开(公告)号：US20230207733A1
公开(公告)日：2023-06-29
申请号：US17926791
申请日：2021-08-06
发明人： Linhui GONG , Chao LIU , Haiwei SUN , Chuhang WANG , Lili WANG , Chaoyang WANG , Xue DONG
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/62 , H01L33/005 , G09F9/3026 , G09F9/33 , H01L2933/0016 , H01L2933/0066
摘要： A display panel includes a backplane, a plurality of light-emitting devices, a plurality of first electrodes, and a plurality of connection leads. The backplane includes a first main surface a second main surface and a plurality of side surfaces, and at least one side surface is a selected side surface. The plurality of light-emitting devices and the plurality of first electrodes are disposed on the second main surface. The plurality of connection leads are disposed at least on the first main surface and the selected side surface. Each connection lead includes a first portion on the first main surface and a second portion on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is range in a range of 0.6 and 1.6. Each connection lead is electrically connected to a first electrode.
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公开(公告)号：US20210159208A1
公开(公告)日：2021-05-27
申请号：US16830834
申请日：2020-03-26
发明人： Lili WANG , Haiwei SUN , Zhenxing TANG , Feng QU , Jing LIU , Chao LIU , Chuhang WANG , Qiangwei CUI , Ke MENG , Linhui GONG
摘要： A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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