公开(公告)号：US12233411B2

公开(公告)日：2025-02-25

申请号：US17430854

申请日：2021-03-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ruijun Deng ,  Mengjun Hou ,  Zhukai Liu ,  Jing Yu

IPC: B01L3/00 ,  A61L27/16 ,  A61L27/56 ,  B01F23/00 ,  B01F23/41 ,  B01F101/23 ,  B01L7/00 ,  B01L9/00 ,  B23Q17/24 ,  C07K14/705 ,  C08F220/56 ,  C08L33/26 ,  C12M1/34 ,  C12Q1/04 ,  C12Q1/18 ,  C12Q1/686 ,  G01N1/31 ,  G01N21/17 ,  G01N21/3577 ,  G01N21/359 ,  G01N21/39 ,  G01N21/45 ,  G01N21/64 ,  G01N21/77 ,  G01N21/78 ,  G01N27/414 ,  G01N30/12 ,  G01N30/68 ,  G01N30/70 ,  G01N30/72 ,  G01N30/88 ,  G01N33/00 ,  G01N33/18 ,  G01N33/50 ,  G01N33/53 ,  G01N33/543 ,  G01N33/68 ,  G01N33/74 ,  G01N35/00 ,  G01N35/10 ,  G06T7/00 ,  G06T7/90 ,  H10K10/46 ,  H10K85/00 ,  H10K85/20

Abstract: A detection chip, a method of using a detection chip and a reaction system are provided. The detection chip includes a first substrate, a micro-chamber definition layer and a heating electrode. The micro-chamber definition layer is located on the first substrate and defines a plurality of micro-reaction chambers. The heating electrode is located on the first substrate and closer to the first substrate than the micro-chamber definition layer, and configured to release heat after being energized. The heating electrode includes a plurality of sub-electrodes, orthographic projections of the plurality of micro-reaction chambers on the first substrate overlap with orthographic projections of at least two of the plurality of sub-electrodes on the first substrate, and the at least two of the plurality of sub-electrodes have different heating values per unit time after being energized.

公开(公告)号：US20240076725A1

公开(公告)日：2024-03-07

申请号：US18262397

申请日：2022-05-10

Applicant: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhukai Liu ,  Ruijun Deng ,  Kang Peng ,  Ding Ding

IPC: C12Q1/6844 ,  B01L3/00 ,  B01L7/00

CPC classification number: C12Q1/6844 ,  B01L3/502715 ,  B01L7/52 ,  B01L2200/16 ,  B01L2300/0654 ,  B01L2300/0819 ,  B01L2300/1827

Abstract: The present disclosure provides a microfluidic substrate, a microfluidic chip, a method for preparing the microfluidic chip, and a method for using the microfluidic chip. The microfluidic substrate includes a substrate including a plurality of microcavity regions arranged m an array, each of the plurality of microcavity regions includes a first portion and a second portion that are stacked, and the depth of the first portion is x, and the first portion includes a top opening that is circular in shape and has a diameter D, the relationship between the diameter D of the top opening and the depth x is approximately D=2x+y, where the range of x is from 20 microns to 400 microns, and the range of y is from 5 microns to 30 microns.

公开(公告)号：US20240390892A1

公开(公告)日：2024-11-28

申请号：US18043421

申请日：2021-10-28

Applicant: Beijing BOE Technology Development Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhukai Liu ,  Ruijun Deng ,  Ding Ding

IPC: B01L3/00 ,  B01L7/00

Abstract: The present disclosure provides a microfluidic substrate and a microfluidic chip including the microfluidic substrate. The microfluidic substrate includes a plurality of microcavities arranged in an array, at least some of the plurality of microcavities are through holes, and a tangent plane at each of at least some points on a sidewall of each microcavity forms a non-perpendicular angle with a reference plane where the microfluidic substrate is located.