利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

56 条记录 (耗时 0.027 秒)

    METHODS FOR MAKING LARGE DIMENSION, FLEXIBLE PIEZOELECTRIC CERAMIC TAPES
    3.
    发明申请
    METHODS FOR MAKING LARGE DIMENSION, FLEXIBLE PIEZOELECTRIC CERAMIC TAPES 有权
    制造大尺寸，柔性压电陶瓷带的方法

    公开(公告)号：US20060211217A1

    公开(公告)日：2006-09-21

    申请号：US11017470

    申请日：2004-12-20

    申请人： Baomin Xu ,  Steven Buhler ,  William Wong ,  Michael Weisberg ,  Scott Solberg ,  Karl Littau ,  Scott Elrod

    发明人： Baomin Xu ,  Steven Buhler ,  William Wong ,  Michael Weisberg ,  Scott Solberg ,  Karl Littau ,  Scott Elrod

    IPC分类号： H01L21/30

    CPC分类号： G01N29/245 ,  B06B1/0622 ,  G01L1/16 ,  G01N29/2475 ,  G01N2291/02827 ,  G01N2291/2694 ,  H01L27/20 ,  H01L41/313 ,  H01L41/314 ,  H01L41/47

    摘要： A method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.

    摘要翻译： 一种用于制造检测/测试带的方法包括将材料沉积在至少一个第一基底的表面上以形成多个元件结构。 电极沉积在多个元件结构中的每一个的表面上，并且元件结构被结合到第二衬底，其中第二衬底是导电的或具有导电层，并且第二衬底承载在载体板上。 从元件结构中去除至少一个第一衬底，并且将第二侧电极沉积在多个元件结构中的每一个的第二表面上。 绝缘材料插入在元件结构周围以电隔离用于结合元件结构的两个基板。 然后将元件结构的第二面接合到另一个衬底，其中另一个衬底是导电的或具有导电层。 此后，移除携带第二基板的承载板。

    METHOD FOR FORMING CERAMIC THICK FILM ELEMENT ARRAYS
    6.
    发明申请
    METHOD FOR FORMING CERAMIC THICK FILM ELEMENT ARRAYS 失效
    形成陶瓷厚膜元件阵列的方法

    公开(公告)号：US20060130956A1

    公开(公告)日：2006-06-22

    申请号：US11017325

    申请日：2004-12-20

    申请人： Stephen White ,  Baomin Xu

    发明人： Stephen White ,  Baomin Xu

    IPC分类号： C03B29/00 ,  B32B37/00

    CPC分类号： H01L27/20 ,  H01L41/313 ,  H01L41/43

    摘要： An improved process for producing ceramic thick film array elements is provided. In this regard, ceramic elements are formed on a temporary, or printing, substrate by screen printing or other forming methods. The temporary, or printing, substrate is advantageously provided with a release layer. This makes it possible to release the printed and soft-baked ceramic elements from the temporary substrate and transfer the ceramic elements to the sintering substrate. The contemplated release technique takes advantage of the phase transition of a liquid, e.g. water, to transfer the elements to a sintering substrate. After sintering and electrode deposition, the ceramic element array is bonded to a target substrate. Then, the sintering substrate is removed to make the array available for implementation in a variety of suitable environments.

    摘要翻译： 提供了一种制备陶瓷厚膜阵列元件的改进方法。 在这方面，通过丝网印刷或其它成形方法在临时或印刷基板上形成陶瓷元件。 临时或印刷衬底有利地设置有释放层。 这使得可以从临时衬底释放印刷和软烘烤的陶瓷元件并将陶瓷元件转移到烧结衬底。 预期的释放技术利用液体的相变，例如， 水，以将元件转移到烧结基底。 在烧结和电极沉积之后，将陶瓷元件阵列结合到目标衬底。 然后，去除烧结衬底以使阵列可用于在各种合适的环境中实现。

    Traveling wave grids with agitated surface using piezoelectric effect and acoustic traveling waves
    7.
    发明授权
    Traveling wave grids with agitated surface using piezoelectric effect and acoustic traveling waves 有权
    使用压电效应和声波行波，具有搅动表面的行波电网

    公开(公告)号：US07944115B2

    公开(公告)日：2011-05-17

    申请号：US12777402

    申请日：2010-05-11

    申请人： Baomin Xu ,  Meng H. Lean ,  Scott Jong Ho Limb

    发明人： Baomin Xu ,  Meng H. Lean ,  Scott Jong Ho Limb

    IPC分类号： H01L41/04

    CPC分类号： H02N2/08

    摘要： A system for transporting particles includes a substrate and a plurality of spaced electrically conductive electrodes carried by the substrate. Further included is a carrier medium adapted for the retention and migration of particles disposed therein, wherein the carrier medium is in operational contact with the electrodes, and a vibration generator is positioned in relation to the substrate to impart vibrations into the carrier medium. In an alternative embodiment, the vibration generator is configured to generate an acoustic traveling wave, which includes a vibration component and a motivation component.

    摘要翻译： 用于输送颗粒的系统包括基板和由基板承载的多个间隔开的导电电极。 还包括一种载体介质，其适于保持和迁移设置在其中的颗粒，其中载体介质与电极操作接触，并且振动发生器相对于基板定位，以将振动赋予载体介质。 在替代实施例中，振动发生器被配置为产生声波行波，其包括振动分量和激励分量。

    Multi-layer monolithic fluid ejectors using piezoelectric actuation
    8.
    发明授权
    Multi-layer monolithic fluid ejectors using piezoelectric actuation 有权
    使用压电驱动的多层单片液体喷射器

    公开(公告)号：US07905580B2

    公开(公告)日：2011-03-15

    申请号：US12273575

    申请日：2008-11-19

    申请人： Baomin Xu ,  Steven A. Buhler ,  Stephen D. White ,  Scott Jong Ho Limb

    发明人： Baomin Xu ,  Steven A. Buhler ,  Stephen D. White ,  Scott Jong Ho Limb

    IPC分类号： B41J2/045

    CPC分类号： B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/14475 ,  Y10T29/42 ,  Y10T29/49401

    摘要： A fluid ejector including a silicon wafer having a first side and a second side. A multi-layer monolithic structure is formed on the first side of the silicon wafer. The multi-layer monolithic structure includes a first structure layer formed on the first side of the silicon wafer, and the first structure layer has an aperture. A second structure layer has a horizontal portion and closed, filled trenches or vertical sidewalls. The first structure layer, horizontal portion and the closed, filled trenches or vertical sidewalls of the second structure layer define a fluid cavity. An actuator is associated with the horizontal portion of the second structure layer, and an etched portion of the silicon wafer defines an open area which exposes the aperture in the first structure layer.

    摘要翻译： 一种流体喷射器，包括具有第一侧和第二侧的硅晶片。 在硅晶片的第一侧上形成多层整体结构。 多层单片结构包括形成在硅晶片的第一侧上的第一结构层，第一结构层具有孔。 第二结构层具有水平部分和闭合的填充沟槽或垂直侧壁。 第二结构层的第一结构层，水平部分和闭合填充的沟槽或垂直侧壁限定流体腔。 致动器与第二结构层的水平部分相关联，并且硅晶片的蚀刻部分限定露出第一结构层中的孔的开放区域。

    Interdigitated Back Contact Silicon Solar Cells With Laser Ablated Grooves
    9.
    发明申请
    Interdigitated Back Contact Silicon Solar Cells With Laser Ablated Grooves 有权
    带有激光烧蚀槽的硅片太阳能电池

    公开(公告)号：US20100059109A1

    公开(公告)日：2010-03-11

    申请号：US12207446

    申请日：2008-09-09

    申请人： Kenta Nakayashiki ,  Baomin Xu

    发明人： Kenta Nakayashiki ,  Baomin Xu

    IPC分类号： H01L31/00

    CPC分类号： H01L31/022425 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

    摘要： Interdigitated back contact (IBC) solar cells are produced by depositing spaced-apart parallel pads of a first dopant bearing material (e.g., boron) on a substrate, heating the substrate to both diffuse the first dopant into corresponding first (e.g., p+) diffusion regions and to form diffusion barriers (e.g., borosilicate glass) over the first diffusion regions, and then disposing the substrate in an atmosphere containing a second dopant (e.g., phosphorus) such that the second dopant diffuses through exposed surface areas of the substrate to form second (e.g., n+) diffusion regions between the first (p+) diffusion regions (the diffusion barriers prevent the second dopant from diffusion into the first (p+) diffusion regions). The substrate material along each interface between adjacent first (p+) and second (n+) diffusion regions is then removed (e.g., using laser ablation) such that elongated grooves, which extend deeper into the substrate than the diffused dopant, are formed between adjacent diffusion regions.

    摘要翻译： 交叉反向接触（IBC）太阳能电池通过在衬底上沉积具有第一掺杂剂材料（例如，硼）的间隔开的平行焊盘来产生，加热衬底以将第一掺杂剂扩散到相应的第一（例如p +）扩散 并且在第一扩散区上形成扩散阻挡层（例如，硼硅酸盐玻璃），然后将衬底设置在含有第二掺杂剂（例如磷）的气氛中，使得第二掺杂剂通过衬底的暴露表面区域扩散形成 第一（p +）扩散区之间的第二（例如，n +）扩散区（扩散阻挡层防止第二掺杂剂扩散到第一（p +）扩散区）。 然后去除相邻的第一（p +）和第二（n +）扩散区之间的每个界面的衬底材料（例如，使用激光烧蚀），使得在相邻扩散区之间形成延伸到衬底中比扩散掺杂剂更深的细长槽 地区。