System for adhesion treatment, coating and curing of wood polymer composites
    1.
    发明申请
    System for adhesion treatment, coating and curing of wood polymer composites 审中-公开
    木材聚合物复合材料的粘合处理,涂层和固化系统

    公开(公告)号:US20090130314A1

    公开(公告)日:2009-05-21

    申请号:US12313416

    申请日:2008-11-19

    IPC分类号: B05D3/10

    摘要: The present invention describes a system for modifying polymer composite surfaces to achieve 100% adhesion to paints, coatings, adhesives, or inks. The adhesion modification technology overcomes the deficiencies of energy-based treatment technologies common with wood-like polymer composites produced using various types of fillers and reinforcements, and specifically those containing cellulose and lignin.

    摘要翻译: 本发明描述了一种用于改进聚合物复合材料表面以实现与油漆,涂料,粘合剂或油墨100%粘附的系统。 粘合改性技术克服了使用各种类型的填料和增强材料生产的木质聚合物复合材料,特别是含有纤维素和木质素的能量基处理技术的缺点。

    Implementing gate within a gate utilizing replacement metal gate process
    2.
    发明授权
    Implementing gate within a gate utilizing replacement metal gate process 有权
    使用替代金属浇口工艺在门内实现门

    公开(公告)号:US09093421B2

    公开(公告)日:2015-07-28

    申请号:US13533484

    申请日:2012-06-26

    摘要: A method and circuit for implementing field effect transistors (FETs) having a gate within a gate utilizing a replacement metal gate process (RMGP), and a design structure on which the subject circuit resides are provided. A field effect transistor utilizing a RMGP includes a sacrificial gate in a generally central metal gate region on a dielectric layer on a substrate, a source and drain formed in the substrate, a pair of dielectric spacers, a first metal gate and a second metal gate replacing the sacrificial gate inside the central metal gate region, and a second gate dielectric layer separating the first metal gate and the second metal gate. A respective electrical contact is formed on opposite sides of the central metal gate region for respectively electrically connecting the first metal gate and the second metal gate to a respective voltage.

    摘要翻译: 一种用于利用替换金属栅极处理(RMGP)来实现在栅极内具有栅极的场效应晶体管(FET)的方法和电路,以及设置有该电路所在的设计结构。 利用RMGP的场效应晶体管包括在衬底上的介电层上的大致中心的金属栅极区域中的牺牲栅极,在衬底中形成的源极和漏极,一对电介质间隔物,第一金属栅极和第二金属栅极 替换中心金属栅极区域内的牺牲栅极,以及分离第一金属栅极和第二金属栅极的第二栅极介电层。 在中心金属栅极区域的相对侧上形成相应的电触点,用于将第一金属栅极和第二金属栅极电连接到相应的电压。

    IMPLEMENTING eFUSE CIRCUIT WITH ENHANCED eFUSE BLOW OPERATION
    5.
    发明申请
    IMPLEMENTING eFUSE CIRCUIT WITH ENHANCED eFUSE BLOW OPERATION 失效
    执行eFUSE电路与增强efuse吹扫操作

    公开(公告)号:US20120268195A1

    公开(公告)日:2012-10-25

    申请号:US13091259

    申请日:2011-04-21

    IPC分类号: H01H37/76 H01L21/76

    摘要: A method and an eFuse circuit for implementing with enhanced eFuse blow operation without requiring a separate high current and high voltage supply to blow the eFuse, and a design structure on which the subject circuit resides are provided. The eFuse circuit includes an eFuse connected to a field effect transistor (FET) operatively controlled during a sense mode and a blow mode for sensing and blowing the eFuse. The eFuse circuit is placed over an independently voltage controlled silicon region. During a sense mode, the independently voltage controlled silicon region is grounded providing an increased threshold voltage of the FET. During a blow mode, the independently voltage controlled silicon region is charged to a voltage supply potential. The threshold voltage of the FET is reduced by the charged independently voltage controlled silicon region for providing enhanced FET blow function.

    摘要翻译: 一种用于在不需要单独的高电流和高电压来吹送eFuse的情况下实现增强的eFuse吹扫操作的方法和eFuse电路,并且提供了主题电路所在的设计结构。 eFuse电路包括连接到在感测模式期间可操作地控制的场效应晶体管(FET)的eFuse和用于感测和吹送eFuse的吹扫模式。 eFuse电路放置在独立的电压控制的硅​​区域上。 在感测模式期间,独立的受电压控制的硅​​区域被接地,从而提供FET增加的阈值电压。 在吹扫模式期间,独立的受控硅区域被充电到电压供应电位。 通过充电的独立电压控制的硅​​区域来降低FET的阈值电压,以提供增强的FET吹扫功能。

    Method for creating 3-D single gate inverter
    7.
    发明授权
    Method for creating 3-D single gate inverter 有权
    创建3-D单门逆变器的方法

    公开(公告)号:US08114747B2

    公开(公告)日:2012-02-14

    申请号:US12943146

    申请日:2010-11-10

    IPC分类号: H01L21/336

    摘要: A 3-D (Three Dimensional) inverter having a single gate electrode. The single gate electrode has a first gate dielectric between the gate electrode and a body of a first FET (Field Effect transistor) of a first doping type, the first FET having first source/drain regions in a semiconductor substrate, or in a well in the semiconductor substrate. The single gate electrode has a second gate dielectric between the gate electrode and a body of a second FET of opposite doping to the first FET. Second source/drain regions of the second FET are formed from epitaxial layers grown over the first source/drain regions.

    摘要翻译: 具有单个栅电极的3-D(三维)逆变器。 单栅电极在栅电极和第一掺杂类型的第一FET(场效应晶体管)的主体之间具有第一栅极电介质,第一FET在半导体衬底中具有第一源/漏区,或在第 半导体衬底。 单栅电极在栅电极和与第一FET相反掺杂的第二FET的本体之间具有第二栅极电介质。 第二FET的第二源极/漏极区域由在第一源极/漏极区域上生长的外延层形成。

    Implementing eFuse circuit with enhanced eFuse blow operation
    8.
    发明授权
    Implementing eFuse circuit with enhanced eFuse blow operation 失效
    实现eFuse电路,增强eFuse吹扫操作

    公开(公告)号:US08492207B2

    公开(公告)日:2013-07-23

    申请号:US13091259

    申请日:2011-04-21

    IPC分类号: H01L21/762

    摘要: A method and an eFuse circuit for implementing with enhanced eFuse blow operation without requiring a separate high current and high voltage supply to blow the eFuse, and a design structure on which the subject circuit resides are provided. The eFuse circuit includes an eFuse connected to a field effect transistor (FET) operatively controlled during a sense mode and a blow mode for sensing and blowing the eFuse. The eFuse circuit is placed over an independently voltage controlled silicon region. During a sense mode, the independently voltage controlled silicon region is grounded providing an increased threshold voltage of the FET. During a blow mode, the independently voltage controlled silicon region is charged to a voltage supply potential. The threshold voltage of the FET is reduced by the charged independently voltage controlled silicon region for providing enhanced FET blow function.

    摘要翻译: 一种用于在不需要单独的高电流和高电压来吹送eFuse的情况下实现增强的eFuse吹扫操作的方法和eFuse电路,并且提供了主题电路所在的设计结构。 eFuse电路包括连接到在感测模式期间可操作地控制的场效应晶体管(FET)的eFuse和用于感测和吹送eFuse的吹扫模式。 eFuse电路放置在独立的电压控制的硅​​区域上。 在感测模式期间,独立的受电压控制的硅​​区域被接地,从而提供FET增加的阈值电压。 在吹扫模式期间,独立的受控硅区域被充电到电压供应电位。 通过充电的独立电压控制的硅​​区域来降低FET的阈值电压,以提供增强的FET吹扫功能。

    INDEPENDENTLY VOLTAGE CONTROLLED VOLUME OF SILICON ON A SILICON ON INSULATOR CHIP
    10.
    发明申请
    INDEPENDENTLY VOLTAGE CONTROLLED VOLUME OF SILICON ON A SILICON ON INSULATOR CHIP 有权
    绝缘子芯片上硅的独立电压控制体积

    公开(公告)号:US20120267752A1

    公开(公告)日:2012-10-25

    申请号:US13091275

    申请日:2011-04-21

    IPC分类号: H01L29/06 H01L21/762

    摘要: A semiconductor chip has an independently voltage controlled silicon region that is a circuit element useful for controlling capacitor values of eDRAM trench capacitors and threshold voltages of field effect transistors overlying the independently voltage controlled silicon region. A bottom, or floor, of the independently voltage controlled silicon region is a deep implant of opposite doping to a doping of a substrate of the independently voltage controlled silicon region. A top, or ceiling, of the independently voltage controlled silicon region is a buried oxide implant in the substrate. Sides of the independently voltage controlled silicon region are deep trench isolation. Voltage of the independently voltage controlled silicon region is applied through a contact structure formed through the buried oxide.

    摘要翻译: 半导体芯片具有独立的电压控制硅区域,其是用于控制eDRAM沟槽电容器的电容值和覆盖独立电压控制的硅​​区域的场效应晶体管的阈值电压的电路元件。 独立电压控制的硅​​区域的底部或底部是与独立电压控制的硅​​区域的衬底的掺杂相反掺杂的深度注入。 独立电压控制的硅​​区域的顶部或天花板是衬底中的埋入氧化物植入物。 独立电压控制的硅​​区域的侧面是深沟槽隔离。 独立电压控制的硅​​区域的电压通过埋入氧化物形成的接触结构施加。