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    ULTRASONIC SENSOR
    1.
    发明申请
    ULTRASONIC SENSOR 审中-公开
    超声波传感器

    公开(公告)号：US20130043764A1

    公开(公告)日：2013-02-21

    申请号：US13568635

    申请日：2012-08-07

    申请人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

    发明人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

    IPC分类号： G01H11/08

    CPC分类号： G01H11/08

    摘要： Disclosed herein is an ultrasonic sensor including: a conductive case; a piezoelectric element fixed to a bottom surface of the case through a conductive adhesive; a temperature compensation capacitor positioned on the piezoelectric element; a first lead wire and electrically connected to one surface of the temperature compensation capacitor; a first wire electrically connecting one surface of the temperature compensation capacitor and the case to each other; a second lead wire and electrically connected to the other surface of the temperature compensation capacitor; a second wire electrically connecting the other surface of the temperature compensation capacitor and an upper surface of the piezoelectric element to each other; and a fixing part fixing the first lead wire and the first wire to one surface of the temperature compensation capacitor and fixing the second lead wire and the second wire to the other surface thereof.

    摘要翻译： 本文公开了一种超声波传感器，包括：导电壳体; 通过导电粘合剂固定到壳体的底表面的压电元件; 位于所述压电元件上的温度补偿电容器; 第一引线并且电连接到温度补偿电容器的一个表面; 将温度补偿电容器的一个表面和壳体彼此电连接的第一线; 第二引线并且电连接到温度补偿电容器的另一个表面; 将所述温度补偿电容器的另一表面与所述压电元件的上表面彼此电连接的第二线; 以及固定部件，其将所述第一引线和所述第一引线固定到所述温度补偿电容器的一个表面，并将所述第二引线和所述第二引线固定到所述温度补偿电容器的另一个表面。

    ULTRASONIC SENSOR
    2.
    发明申请
    ULTRASONIC SENSOR 审中-公开
    超声波传感器

    公开(公告)号：US20120313484A1

    公开(公告)日：2012-12-13

    申请号：US13464498

    申请日：2012-05-04

    申请人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

    发明人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

    IPC分类号： H01L41/04

    CPC分类号： H01L41/313 ,  B06B1/0651

    摘要： Disclosed herein is an ultrasonic sensor, including: a conductive case having at least one groove disposed on a bottom surface thereof; a piezoelectric element fixed to the bottom surface of the case through a non-conductive adhesive; a conductive adhesive injected into the groove to electrically connect the case to the piezoelectric element; a temperature compensation capacitor disposed on an upper portion of the piezoelectric element; a first lead wire led-in from the outside of the case and being electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; and a second lead wire led-in from the outside of the case and being electrically connected to the other surface of the temperature compensation capacitor and the case.

    摘要翻译： 本文公开了一种超声波传感器，包括：导电壳体，其具有设置在其底表面上的至少一个凹槽; 通过非导电粘合剂固定到壳体的底表面的压电元件; 注入到所述槽中以将所述壳体电连接到所述压电元件的导电粘合剂; 设置在所述压电元件的上部的温度补偿电容器; 第一引线从壳体的外部引入并且与温度补偿电容器和压电元件的一个表面电连接; 以及从壳体的外部引入并与温度补偿电容器和壳体的另一个表面电连接的第二引线。

    ULTRASONIC SENSOR AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    ULTRASONIC SENSOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
    超声波传感器及其制造方法

    公开(公告)号：US20120326563A1

    公开(公告)日：2012-12-27

    申请号：US13462756

    申请日：2012-05-02

    申请人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

    发明人： Boum Seock Kim ,  Sung Kwon Wi ,  Eun Tae Park

    IPC分类号： H01L41/04 ,  B29C45/14

    CPC分类号： B29C45/1671 ,  B06B1/06 ,  B29C45/14639 ,  G01H11/08 ,  H01L41/042 ,  H01L41/1132 ,  H01L41/25

    摘要： Disclosed herein are an ultrasonic sensor and a method of manufacturing the same. The ultrasonic sensor includes: a conductive case; a piezoelectric element fixed to a bottom. surface of the case through a conductive adhesive; a temperature compensation capacitor positioned over the piezoelectric element; a first lead wire lead from the outside of the case and electrically connected to one surface of the temperature compensation capacitor and the piezoelectric element; a second lead wire lead from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor and the case; and a first molding part closely adhered to outer portions of the temperature compensation capacitor and the first and second lead wires.

    摘要翻译： 这里公开了一种超声波传感器及其制造方法。 超声波传感器包括：导电壳体; 固定在底部的压电元件。 表壳通过导电胶粘剂; 位于所述压电元件上方的温度补偿电容器; 第一引线从壳体的外部引出并且电连接到温度补偿电容器和压电元件的一个表面; 第二引线从壳体的外部引出并且电连接到温度补偿电容器和壳体的另一个表面; 以及与温度补偿电容器和第一和第二引线的外部紧密粘合的第一模制部件。

    ULTRASONIC SENSOR
    4.
    发明申请
    ULTRASONIC SENSOR 审中-公开
    超声波传感器

    公开(公告)号：US20120313487A1

    公开(公告)日：2012-12-13

    申请号：US13464491

    申请日：2012-05-04

    申请人： Boum Seock KIM ,  Sung Kwon Wi ,  Eun Tae Park

    发明人： Boum Seock KIM ,  Sung Kwon Wi ,  Eun Tae Park

    IPC分类号： H01L41/08

    CPC分类号： G01B17/00 ,  B06B1/0662

    摘要： Disclosed herein is an ultrasonic sensor, including: a conductive case having a groove disposed at a bottom surface thereof; a piezoelectric element inserted into the groove and fixed to the groove by a conductive adhesive; a temperature compensation capacitor disposed on a top of the piezoelectric element, electrically connected to the piezoelectric element, and fixed to the case by a non-conductive adhesive; a first lead wire led-in from an outside of the case and electrically connected to one surface of the temperature compensation capacitor and the case; and a second lead wire lead-in from the outside of the case and electrically connected to the other surface of the temperature compensation capacitor, whereby the piezoelectric element which is easily damaged can be protected by the temperature compensation capacitor, without using the separate substrate for fixing the temperature compensation capacitor.

    摘要翻译： 本文公开了一种超声波传感器，包括：导电壳体，其具有设置在其底表面处的凹槽; 压电元件插入槽中并通过导电粘合剂固定到凹槽; 温度补偿电容器，设置在压电元件的顶部，电连接到压电元件，并通过非导电粘合剂固定到壳体; 第一引线从壳体的外部引入并且电连接到温度补偿电容器和壳体的一个表面; 以及从外壳的外部导入的第二引线，并且电连接到温度补偿电容器的另一个表面，由此容易损坏的压电元件可以被温度补偿电容器保护，而不使用单独的基板 固定温度补偿电容。

    PIEZOELECTRIC MODULE AND SEAT FOR VEHICLE INCLUDING THE SAME
    5.
    发明申请
    PIEZOELECTRIC MODULE AND SEAT FOR VEHICLE INCLUDING THE SAME 审中-公开
    用于车辆的压电模块和座椅包括它们

    公开(公告)号：US20130020842A1

    公开(公告)日：2013-01-24

    申请号：US13489787

    申请日：2012-06-06

    申请人： Ju Hwan Yang ,  Dong Hyeok Choi ,  Boum Seock Kim ,  Sung Kwon Wi ,  Sung Ho Lee

    发明人： Ju Hwan Yang ,  Dong Hyeok Choi ,  Boum Seock Kim ,  Sung Kwon Wi ,  Sung Ho Lee

    IPC分类号： B60H1/22 ,  B60N2/56

    CPC分类号： B60N2/5692

    摘要： Disclosed herein are a piezoelectric module and a sheet for a vehicle including the same. The sheet includes: a seat board part supporting a passenger's lower body; a backplate part formed to be extended in a direction perpendicular to one side of the seat board part and supporting the passenger's upper body; and a piezoelectric module formed in the seat board part and generating warm air or cold air using a flow of a current generated by vehicle vibration to thereby transfer the generated warm air or cold air to the passenger's body.

    摘要翻译： 这里公开了一种压电模块和一种包括该模块的车辆用片材。 该片材包括：支撑乘客下身的座椅板部分; 形成为沿垂直于所述座椅板部的一侧的方向延伸并支撑乘客的上身的背板部; 以及形成在座椅基板部分中的压电模块，并且使用由车辆振动产生的电流流产生暖空气或冷空气，从而将产生的暖空气或冷空气转移到乘客身体。

    Conductor pattern and coil parts having the same
    6.
    发明授权
    Conductor pattern and coil parts having the same 有权
    导体图案和具有相同的线圈部件

    公开(公告)号：US09236172B2

    公开(公告)日：2016-01-12

    申请号：US13420540

    申请日：2012-03-14

    申请人： Sang Moon Lee ,  Yong Suk Kim ,  Jeong Bok Kwak ,  Young Seuck Yoo ,  Sung Kwon Wi

    发明人： Sang Moon Lee ,  Yong Suk Kim ,  Jeong Bok Kwak ,  Young Seuck Yoo ,  Sung Kwon Wi

    IPC分类号： H01F5/00 ,  H01F27/28

    CPC分类号： H01F5/003

    摘要： A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.

    摘要翻译： 在磁性基板上形成为螺旋状的线圈部的导体图案，其包括：主导体图案; 以及形成在主导体图案上的次级导体图案。 主导体图案形成为具有电连接到第一水平部分的一个表面的端部的第一水平部分和第一垂直部分的纵向部分。 次级导体图案形成为具有包括对应于第一水平部分的第二水平部分的纵向部分和与第二水平部分的一个表面的端部电连接的第二垂直部分。

    Multilayer chip capacitor with improved equivalent series resistance
    9.
    发明授权
    Multilayer chip capacitor with improved equivalent series resistance 有权
    具有改善等效串联电阻的多层片式电容器

    公开(公告)号：US08315034B2

    公开(公告)日：2012-11-20

    申请号：US12245856

    申请日：2008-10-06

    申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

    发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

    IPC分类号： H01G4/228 ,  H01G4/06 ,  H01G4/38

    CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/232

    摘要： A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side faces of the capacitor body. The first capacitor part includes first and second internal electrodes of opposite polarity, and the second capacitor part includes third and fourth internal electrodes of opposite polarity. The first to fourth internal electrodes each have one lead. The first to fourth external electrodes are respectively connected to the leads of the first to fourth internal electrodes. A series resonance frequency of the first capacitor part is different from that of the second capacitor part. Equivalent series resistance (ESR1) of the first capacitor part and the equivalent series resistance (ESR2) of the second capacitor part satisfy ERS1≧20 mΩ and 0.7(ESR1)≦ESR2≦1.3(ESR1).

    摘要翻译： 多层片状电容器包括电容器本体，其包括第一电容器部分和第二电容器部分，分别形成在电容器主体的第一和第二长侧面上的第一和第二外部电极，以及分别形成在第一和第二电极部分上的第三和第四外部电极 电容器主体的较短侧面。 第一电容器部分包括具有相反极性的第一和第二内部电极，并且第二电容器部分包括具有相反极性的第三和第四内部电极。 第一至第四内部电极各有一个引线。 第一至第四外部电极分别连接到第一至第四内部电极的引线。 第一电容器部分的串联谐振频率与第二电容器部分的串联谐振频率不同。 第一电容器部分的等效串联电阻（ESR1）和第二电容器部分的等效串联电阻（ESR2）满足ERS1≥20m＆OHgr; 和0.7（ESR1）＆nlE; ESR2＆N1; 1.3（ESR1）。

    Multilayer capacitor
    10.
    发明授权
    Multilayer capacitor 有权
    多层电容器

    公开(公告)号：US08184425B2

    公开(公告)日：2012-05-22

    申请号：US12238796

    申请日：2008-09-26

    申请人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

    发明人： Byoung Hwa Lee ,  Sung Kwon Wi ,  Hae Suk Chung ,  Dong Seok Park ,  Sang Soo Park ,  Min Cheol Park

    IPC分类号： H01G4/228 ,  H01G4/005 ,  H01G4/20

    CPC分类号： H01G4/228

    摘要： There is provided a multilayer capacitor including: a capacitor body where a plurality of dielectric layers are laminated, the capacitor body including first and second surfaces opposing each other in a laminated direction, wherein the first surface provides a mounting surface; a plurality of first and second inner electrodes; an inner connecting conductor; and a plurality of first and second outer electrodes formed on an outer surface of the body, wherein a corresponding one of the outer electrodes having identical polarity to the inner connecting conductor includes at least one outer terminal formed on the first surface of the body to connect to the inner connecting conductor, and at least one outer connecting conductor formed on the second surface of the body to connect a corresponding one of the inner electrodes of identical polarity to the inner connecting conductor.

    摘要翻译： 提供了一种层叠电容器，其包括：层叠多个电介质层的电容器体，所述电容器主体包括在层叠方向上彼此相对的第一和第二表面，其中所述第一表面提供安装表面; 多个第一和第二内部电极; 内连接导体; 以及形成在所述主体的外表面上的多个第一外部电极和第二外部电极，其中与所述内部连接导体具有相同极性的相应的外部电极包括形成在所述主体的所述第一表面上的至少一个外部端子，以连接 内部连接导体和形成在主体的第二表面上的至少一个外部连接导体，以将相当极性的相应的一个内部电极与内部连接导体相连接。