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33 条记录 (耗时 0.024 秒)

    System and method for throttling memory power consumption
    1.
    发明申请
    System and method for throttling memory power consumption 失效
    用于节流内存功耗的系统和方法

    公开(公告)号：US20070079152A1

    公开(公告)日：2007-04-05

    申请号：US11242686

    申请日：2005-10-03

    申请人： Bradley Winick ,  Shaun Harris ,  Russ Herrell

    发明人： Bradley Winick ,  Shaun Harris ,  Russ Herrell

    IPC分类号： G06F1/00

    CPC分类号： G11C5/14 ,  G11C5/04

    摘要： A power throttling method and system for a memory controller in a computer system comprising a power supply module including a plurality of bulk power supplies (“BPSs”) are described. In one embodiment, each of the at BPSs provides to a power output monitor a status signal indicative of a status thereof. Responsive to receipt of the status signals, the power output monitor determines whether a bulk power supply capacity is below system power requirements. Responsive to a positive determination, the power output monitor drives a throttle control signal to the memory controller to a level indicative of an over-threshold state.

    摘要翻译： 描述了包括包括多个大容量电源（“BPS”）的电源模块的计算机系统中的存储器控​​制器的功率节流方法和系统。 在一个实施例中，每个BPS向功率输出监视器提供指示其状态的状态信号。 响应于接收状态信号，电源输出监视器确定大容量电源容量是否低于系统电源要求。 响应于肯定确定，功率输出监视器将存储器控制器的油门控制信号驱动到指示过阈值状态的水平。

    Multiplexed dual-purpose magnetoresistive sensor and method of measuring current and temperature
    2.
    发明申请
    Multiplexed dual-purpose magnetoresistive sensor and method of measuring current and temperature 失效
    复用双用磁阻传感器及测量电流和温度的方法

    公开(公告)号：US20050077890A1

    公开(公告)日：2005-04-14

    申请号：US10682344

    申请日：2003-10-09

    申请人： Randy Rannow ,  Bradley Winick ,  Shaun Harris

    发明人： Randy Rannow ,  Bradley Winick ,  Shaun Harris

    IPC分类号： G01K7/20 ,  G01K7/24 ,  G01K7/36 ,  G01R15/20 ,  G01R19/00 ,  G01R33/00 ,  G01R33/09 ,  H01L43/08

    CPC分类号： G01R15/205 ,  G01K7/36

    摘要： The present invention determines temperature and current from resistance measurements of a single magnetoresistive sensor. A dual-purpose sensor includes the magnetoresistive sensor having a single pair of terminals. The sensor is multiplexed under separate current conditions to produce both a temperature measurement and a current measurement in a vicinity of the sensor. A sensor system includes the dual-purpose sensor, a resistance sensing subsystem and a controller that controls the current conditions. A method of measuring temperature and current includes measuring a first resistance of the dual-purpose sensor while a first current is flowing in a conductor adjacent to the sensor, and measuring a second resistance of the sensor while a second current is flowing in the conductor. The first current has a known value while the second current has an unknown value. The temperature and current are determined respectively from the first and second resistance measurements.

    摘要翻译： 本发明通过单个磁阻传感器的电阻测量来确定温度和电流。 双用途传感器包括具有单对端子的磁阻传感器。 传感器在不同的电流条件下进行复用，以在传感器附近产生温度测量和电流测量。 传感器系统包括双用途传感器，电阻感测子系统和控制当前状况的控制器。 测量温度和电流的方法包括在第一电流在与传感器相邻的导体中流动时测量双用途传感器的第一电阻，并且在第二电流在导体中流动时测量传感器的第二电阻。 第一个电流具有已知值，而第二个电流具有未知值。 分别从第一和第二电阻测量值确定温度和电流。

    Power cabling assembly
    3.
    发明申请
    Power cabling assembly 有权
    电力电缆组件

    公开(公告)号：US20050135076A1

    公开(公告)日：2005-06-23

    申请号：US10743611

    申请日：2003-12-22

    申请人： Jeffrey Haselby ,  Eric Peterson ,  Shaun Harris

    发明人： Jeffrey Haselby ,  Eric Peterson ,  Shaun Harris

    IPC分类号： H01R13/68 ,  H05K5/02 ,  H05K7/14 ,  H05K7/18

    CPC分类号： H05K5/0247 ,  H01R13/68 ,  H01R24/76 ,  H01R2103/00

    摘要： A fused power cable assembly and method of integrating a protective device with a power source connector retaining bracket. A bracket assembly having a bulkhead retaining element, a protective device element, and a retaining element operable to couple the protective device to the bracket allows for mounting of protective device(s) to the bracket instead of the bulkhead, thereby saving space. A power cabling assembly having a bracket assembly, a power connector, and a fastening element operable to couple the power connector to the bulkhead and the bulkhead to the bracket assembly, allowing assembly of the power cabling assembly prior to installation into target equipment.

    摘要翻译： 熔接电力电缆组件和将保护装置与电源连接器固定支架集成的方法。 具有隔板保持元件，保护装置元件和可操作以将保护装置联接到支架的保持元件的支架组件允许将保护装置安装到支架而不是隔板，从而节省空间。 一种电力布线组件，其具有支架组件，电源连接器和可操作以将电源连接器耦合到隔板和隔板到支架组件的紧固元件，允许在安装到目标设备之前组装电力电缆组件。

    Stack up assembly
    4.
    发明申请
    Stack up assembly 审中-公开

    公开(公告)号：US20050018406A1

    公开(公告)日：2005-01-27

    申请号：US10923332

    申请日：2004-08-20

    申请人： Shaun Harris

    发明人： Shaun Harris

    IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H05K1/02 ,  H05K1/14 ,  H05K7/20

    CPC分类号： H01L23/433 ,  H01L23/36 ,  H01L23/3675 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/066 ,  H01L2924/00

    摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector. Also optionally, heat-generating devices may be mechanically and electrically coupled with the second printed circuit board through interposers configured (upon assembly) to raise the heat-generating devices through the openings in the first printed circuit board to contact a heat sink.

    Multi-chip module with stacked redundant power
    6.
    发明申请
    Multi-chip module with stacked redundant power 失效

    公开(公告)号：US20060109626A1

    公开(公告)日：2006-05-25

    申请号：US10996478

    申请日：2004-11-24

    申请人： Shaun Harris ,  Steven Belson ,  Eric Peterson ,  Gary Williams ,  Christian Belady

    发明人： Shaun Harris ,  Steven Belson ,  Eric Peterson ,  Gary Williams ,  Christian Belady

    IPC分类号： H05K7/20

    CPC分类号： H05K7/1092 ,  Y10T307/505

    摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.

    Multiple input redundant power system
    8.
    发明申请
    Multiple input redundant power system 审中-公开
    多输入冗余电源系统

    公开(公告)号：US20050134239A1

    公开(公告)日：2005-06-23

    申请号：US10743636

    申请日：2003-12-22

    申请人： Shaun Harris ,  Steven Belson

    发明人： Shaun Harris ,  Steven Belson

    IPC分类号： G05F1/70 ,  H02J1/10 ,  H02M1/10

    CPC分类号： H02M1/10 ,  H02J1/10 ,  H02M2001/008

    摘要： A multiple-input redundant power system accepts both AC and DC power inputs. Redundancy is further provided by the use of converters for the AC input, and converters for the DC input. An output distribution element provides for simple combining of converter outputs, and for more complex load sharing and load control arrangements. Advantages accruing from the AC/DC input approach are savings in facility infrastructure, since existing power sources can be utilized, and high availability and reliability in accordance with certain embodiments. The approach has many applications in computing and telecommunications.

    摘要翻译： 多输入冗余电源系统接受交流和直流电源输入。 通过使用用于AC输入的转换器和用于DC输入的转换器进一步提供冗余。 输出分配元件提供了转换器输出的简单组合，以及更复杂的负载分担和负载控制布置。 由于可以利用现有的电源以及根据某些实施例的高可用性和可靠性，因此AC / DC输入方法所产生的优点是节省设备基础设施。 该方法在计算和电信领域有很多应用。

    Stack up assembly
    9.
    发明申请
    Stack up assembly 失效
    堆叠组装

    公开(公告)号：US20050018407A1

    公开(公告)日：2005-01-27

    申请号：US10923337

    申请日：2004-08-20

    申请人： Shaun Harris

    发明人： Shaun Harris

    IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H05K1/02 ,  H05K1/14 ,  H05K7/20

    CPC分类号： H01L23/433 ,  H01L23/36 ,  H01L23/3675 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/066 ,  H01L2924/00

    摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector. Also optionally, heat-generating devices may be mechanically and electrically coupled with the second printed circuit board through interposers configured (upon assembly) to raise the heat-generating devices through the openings in the first printed circuit board to contact a heat sink.

    摘要翻译： 构建第一印刷电路板，其包括被配置为对应于附接到第二印刷电路板的发热装置的一个或多个开口。 第一和第二印刷电路板彼此对准和散热器，使得散热器与第一和第二印刷电路板上的发热电子器件热耦合。 可选地，第一和第二印刷电路板可以通过电连接器彼此电耦合。 还可选地，发热装置可以通过配置（组装时）的插入件与第二印刷电路板机械地和电气耦合，以通过第一印刷电路板中的开口升高发热装置以接触散热器。