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    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS USING THE SAME
    1.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS USING THE SAME 有权
    使用它的发光装置包装和照明装置

    公开(公告)号：US20100295068A1

    公开(公告)日：2010-11-25

    申请号：US12675582

    申请日：2008-08-27

    申请人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

    发明人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

    IPC分类号： H01L33/52 ,  H01L33/48

    CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2224/48137 ,  H01L2224/48227 ,  H05B33/0821 ,  H05B33/0857 ,  Y02B20/341 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.

    摘要翻译： 在一个实施例中，发光器件封装包括封装主体，附接到封装体的电极以及电连接到电极的至少两个发光器件。 每个发光装置发射与其他发光装置不同颜色的光。 在至少两个发光器件上形成保护层，并且形成在保护层上方的荧光体层。 其他实施例包括其他结构，例如每个发光器件上的各个荧光体层。 并且，包括封装的光装置可以包括驱动封装的发光器件的单个驱动器。

    Light emitting device package and lighting apparatus using the same
    2.
    发明授权
    Light emitting device package and lighting apparatus using the same 有权
    发光装置封装及使用其的照明装置

    公开(公告)号：US08704265B2

    公开(公告)日：2014-04-22

    申请号：US12675582

    申请日：2008-08-27

    申请人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

    发明人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

    IPC分类号： H01L33/00 ,  H01L29/40 ,  H01L29/207 ,  H01L23/48

    CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2224/48137 ,  H01L2224/48227 ,  H05B33/0821 ,  H05B33/0857 ,  Y02B20/341 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.

    摘要翻译： 在一个实施例中，发光器件封装包括封装主体，附接到封装体的电极以及电连接到电极的至少两个发光器件。 每个发光装置发射与其他发光装置不同颜色的光。 在至少两个发光器件上形成保护层，并且形成在保护层上方的荧光体层。 其他实施例包括其他结构，例如每个发光器件上的各个荧光体层。 并且，包括封装的光装置可以包括驱动封装的发光器件的单个驱动器。

    Multilayer ceramic electronic component and method of manufacturing the same
    10.
    发明授权
    Multilayer ceramic electronic component and method of manufacturing the same 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US09324496B2

    公开(公告)日：2016-04-26

    申请号：US13620239

    申请日：2012-09-14

    申请人： Jong Ho Lee ,  Jae Yeol Choi ,  Doo Young Kim ,  Myung Jun Park ,  Yu Na Kim ,  Sung Woo Kim

    发明人： Jong Ho Lee ,  Jae Yeol Choi ,  Doo Young Kim ,  Myung Jun Park ,  Yu Na Kim ,  Sung Woo Kim

    IPC分类号： H01G4/012 ,  H01G4/30 ,  H01G4/008 ,  H01G4/005 ,  H01G4/12

    CPC分类号： H01G4/012 ,  H01G4/005 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/30

    摘要： There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer and having first and third surfaces opposing each other in a length direction of the dielectric layer and second and fourth surfaces opposing each other in a width direction thereof; and a multilayer part including a first internal electrode and a second internal electrode disposed to oppose each other, while having the dielectric layer interposed there between in the ceramic body, and exposed to the first and third surfaces of the ceramic body, respectively; wherein one or more residual carbon removing path parts are formed to be protruded on both side of the first and second internal electrodes in a length direction of the ceramic body.

    摘要翻译： 提供了一种多层陶瓷电子部件，其包括：陶瓷体，其包括电介质层，并且具有在电介质层的长度方向上彼此相对的第一和第三表面以及沿其宽度方向彼此相对的第二和第四表面; 以及包括第一内部电极和第二内部电极的多层部分，其分别在陶瓷体中介于介电层之间并且分别暴露于陶瓷体的第一和第三表面; 其中一个或多个剩余碳去除路径部分形成为在陶瓷体的长度方向上在第一和第二内部电极的两侧上突出。