摘要:
A plasma display panel apparatus includes a pair of discharge sustaining electrodes, a panel capacitor to supply charged voltage alternately to each electrode of the pair of discharge sustaining electrodes, a switching device for discharge that is turned on when the panel capacitor is discharged, to thereby pass through discharged current of the panel capacitor, a current sensing part to sense the current passed through by the switching device for discharge, and an over-current controlling part that turns off the switching device for discharge when the current sensed in the current sensing part is at or above a predetermined reference value. With this configuration, the plasma display panel apparatus protects the switching device from over-current generated during an abnormal driving of the discharge sustaining electrode driving circuit.
摘要:
When high speed memory devices are tested using a tester having a lower operating frequency than the operational speed of the memory device, limit conditions for the tester signals are required to prevent the interference between the tester and device signals. The present invention provides the limit conditions for the shift and strobe signal. The strobe signal is delivered to comparators with a delivery delay time defining the dead time zone. The shift signal controls the data path of the device to and from a driver and a comparator. When the strobe signal is within the present test cycle, the shift signal of a read cycle must be activated at the same time or earlier than the activation time of the WE/ signal of the next write cycle and the shift signal of a write cycle must start at the same time or earlier than the activation time of the OE/ signal of the next read cycle. When the strobe signal is outside of the test cycle, the shift signal must meet prescribed maximum and minimum timing conditions.
摘要:
A test kit for a semiconductor package and a method for testing the semiconductor package using the same are provided. The test kit for a semiconductor package includes a pick-and-place tool for picking up and loading/unloading the semiconductor package, a head assembly having a package guider and a socket guider, and a socket which is positioned under the head assembly. The socket guider performs a pre-alignment function for a correct operation of the package guider, before the package guider starts operating. The package guider aligns the semiconductor package.
摘要:
A loader of semiconductor package burn-in test equipment allows a test socket to be commonly used for semiconductor packages of all sizes. The loader includes a vacuum suction head for picking semiconductor packages to be tested, and a package guider for ensuring that semiconductor packages of any size will be aligned with the test socket. As the semiconductor package is positioned over the test socket by the vacuum suction head of the loader, guide surfaces of the package guider are brought inwardly into guide positions at which the surfaces extend just beneath the vacuum suction head. Any semiconductor package that is not in alignment with the test socket while being held by the vacuum suction head is guided by the guides surfaces into alignment once the vacuum suction is turned off and the package falls from the vacuum suction head. Thus, the package guider serves as an adaptor, eliminating the need for several test sockets having respective adaptors for different sizes of semiconductor packages.
摘要:
A handoff system and method between different kinds of devices, an SIP server and an application method of the SIP server applied thereto. The handoff system between different kinds of devices includes a plurality of devices; a SIP server which requests a routing path update when a handoff request signal is input from a source device among the plurality devices, and getting a target device to participate in a current session; and a gateway which updates a predetermined routing path when a request signal for the routing path update is input, and transmitting data to the source device and the target device via the updated routing path.
摘要:
A fuse box including make-links and a redundancy address decoder including the fuse box are provided. It is preferable that the fuse box includes a plurality of make-links for programming an address of a defective normal memory cell with an address of a corresponding redundant memory cell, and the address is a row address or a column address. The redundant address decoder includes a fuse box having a plurality of make-links for decoding an address of a defect cell and a redundant word line selection circuit for selecting a word line of a redundant cell corresponding to the address of the defect cell in response to a signal output from the fuse box.
摘要:
A handoff system and method between different kinds of devices, an SIP server and an application method of the SIP server applied thereto. The handoff system between different kinds of devices includes a plurality of devices; a SIP server which requests a routing path update when a handoff request signal is input from a source device among the plurality devices, and getting a target device to participate in a current session; and a gateway which updates a predetermined routing path when a request signal for the routing path update is input, and transmitting data to the source device and the target device via the updated routing path.
摘要:
An electrical testing method for a semiconductor package for detecting defects of sockets mounted on a device under test (DUT) board is provided. A tester performs electrical test, accumulates electrical test results, and compares the accumulated results to reference values. The result of the comparison decides whether a plurality of sockets mounted on the DUT board can be used or not. The decision results are transmitted to a handler so that the socket having the defects is not used on the DUT board.
摘要:
A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested. Groups of devices are transferred from the customer tray to buffer trays for testing. The number of devices in the customer tray is checked after each transfer. If the customer tray is empty, the number of semiconductor devices in the buffer trays is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer trays is greater than the tester capacity, the semiconductor devices in at least one buffer tray are tested. If the number of semiconductor devices in the buffer trays is smaller than the tester capacity, semiconductor devices that were determined to be low quality in a prior test are loaded into a buffer tray, thus testing both untested and low quality devices together.
摘要:
A laser link structure used in semiconductor devices and a fuse box using the laser link structure preferably include a plurality of first conductive line patterns positioned in parallel at predetermined intervals, and a second conductive line pattern broadly formed on the plurality of first conductive line patterns for forming hole regions which link the second conductive line pattern to the plurality of first conductive line patterns. Preferably, at least one hole region is formed on each of the plurality of first conductive line patterns, and via holes are formed in the hole regions.