公开(公告)号：US20060151858A1

公开(公告)日：2006-07-13

申请号：US11372597

申请日：2006-03-10

申请人： Byung Ahn ,  Jae Ku ,  Young Chung ,  Suk Ko ,  Sung Jang ,  Young Choi ,  Won Do

发明人： Byung Ahn ,  Jae Ku ,  Young Chung ,  Suk Ko ,  Sung Jang ,  Young Choi ,  Won Do

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

公开(公告)号：US20050029638A1

公开(公告)日：2005-02-10

申请号：US09845601

申请日：2001-04-27

申请人： Byung Ahn ,  Jae Ku ,  Young Chung ,  Suk Ko ,  Sung Jang ,  Young Choi ,  Won Do

发明人： Byung Ahn ,  Jae Ku ,  Young Chung ,  Suk Ko ,  Sung Jang ,  Young Choi ,  Won Do

IPC分类号： H01L23/31 ,  H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

摘要翻译： 公开了使用引线框制造的金属引线框，半导体封装以及制造引线框和封装的方法。 在一个实施例中，引线框架包括矩形框架。 芯片焊盘和多个引线在框架内。 芯片焊盘的下侧和引线包括一个或多个垂直凹入的水平表面。 芯片焊盘的上侧可以包括围绕芯片安装区域的凹槽。 在封装中，芯片焊盘支撑与引线电连接的半导体芯片。 芯片焊盘的下侧和引线在封装体的外表面露出。 封装材料底部填充芯片焊盘和引线的凹陷的下表面，从而将它们锁定到密封材料上。 电线可以可靠地结合到在其上侧形成的槽内的芯片焊盘。

公开(公告)号：US20070004069A1

公开(公告)日：2007-01-04

申请号：US11476427

申请日：2006-06-27

申请人： Ki Cho ,  Young Choi ,  Byung Ahn ,  Tae Hwang ,  Dong Min ,  Bo Jung

发明人： Ki Cho ,  Young Choi ,  Byung Ahn ,  Tae Hwang ,  Dong Min ,  Bo Jung

IPC分类号： H01L21/00 ,  H01L31/12

CPC分类号： H01L27/1288 ,  H01L27/1214 ,  Y10S438/95

摘要： A method of fabricating a liquid crystal display device includes performing a first mask process to form a gate line, a gate pad, and a gate electrode on a substrate. The method of fabricating a liquid crystal display device further includes performing a second mask process to form an active layer on the gate electrode, performing a third mask process to form a pixel electrode contacting the active layer, and performing a fourth mask process to form a source electrode and a drain electrode on the active layer.

摘要翻译： 制造液晶显示装置的方法包括：在基板上进行第一掩模处理以形成栅极线，栅极焊盘和栅电极。 制造液晶显示装置的方法还包括执行第二掩模处理以在栅电极上形成有源层，执行第三掩模处理以形成与活性层接触的像素电极，以及执行第四掩模处理以形成 源电极和有源层上的漏电极。

公开(公告)号：US20060023138A1

公开(公告)日：2006-02-02

申请号：US11156476

申请日：2005-06-21

申请人： Young Choi ,  Byung Ahn ,  Hong Yu ,  Ki Cho

发明人： Young Choi ,  Byung Ahn ,  Hong Yu ,  Ki Cho

IPC分类号： G02F1/136

CPC分类号： G02F1/13458 ,  G02F1/1362 ,  G02F1/136213 ,  G02F2001/13629

摘要： Disclosed is an array substrate of an LCD, and a method for fabricating it, which simplifies the fabrication process, thereby reducing fabrication costs. The process is simplified because the array substrate does not have a passivation film. The thin film transistors on the array substrate each have an active layer that is protected from contamination by forming a channel insulation layer on the active layer through a dry-etching process. Further, the gate line, gate pad, and gate electrode may have a two-layer structure having a low-resistance metal layer and a barrier metal layer, or a three-layer structure having a low-resistance metal layer and two barrier metal layers.

摘要翻译： 公开了一种LCD的阵列基板及其制造方法，其简化了制造工艺，从而降低了制造成本。 由于阵列基板不具有钝化膜，所以该过程被简化。 阵列基板上的薄膜晶体管每个都具有通过干蚀刻工艺在有源层上形成沟道绝缘层而防止污染的有源层。 此外，栅极线，栅极焊盘和栅电极可以具有具有低电阻金属层和阻挡金属层的双层结构，或者具有低电阻金属层和两个势垒金属层的三层结构 。

公开(公告)号：US20050285195A1

公开(公告)日：2005-12-29

申请号：US11149689

申请日：2005-06-10

申请人： Young Choi ,  Byung Ahn ,  Ki Cho ,  Hong Yu

发明人： Young Choi ,  Byung Ahn ,  Ki Cho ,  Hong Yu

IPC分类号： G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/00 ,  H01L21/336 ,  H01L21/77 ,  H01L21/84 ,  H01L27/01 ,  H01L27/12 ,  H01L27/146 ,  H01L29/417 ,  H01L29/786

CPC分类号： H01L29/41733 ,  G02F1/136209 ,  G02F2001/136236 ,  G02F2001/13629 ,  H01L27/12 ,  H01L27/1248 ,  H01L27/1288

摘要： A thin film transistor array substrate and a fabricating method thereof are disclosed. The thin film transistor array substrate protects a thin film transistor without a protective film and accordingly reduces the manufacturing cost. In the thin film transistor array substrate, a gate electrode is connected to a gate line. A source electrode is connected to a data line crossing the gate line to define a pixel area. A drain electrode is opposed to the source electrode with a channel therebetween. A semiconductor layer is in the channel. A pixel electrode in the pixel area contacts the drain electrode over substantially the entire overlapping area between the two. A channel protective film is provided on-the semiconductor layer corresponding to the channel to protect the semiconductor layer.

摘要翻译： 公开了薄膜晶体管阵列基板及其制造方法。 薄膜晶体管阵列基板保护薄膜晶体管而没有保护膜，从而降低制造成本。 在薄膜晶体管阵列基板中，栅电极连接到栅极线。 源电极连接到与栅极线交叉的数据线，以限定像素区域。 漏电极与源电极相对，其间具有沟道。 半导体层在通道中。 像素区域中的像素电极在两者之间的整个重叠区域上接触漏电极。 沟道保护膜设置在对应于沟道的半导体层上，以保护半导体层。

公开(公告)号：USD619500S1

公开(公告)日：2010-07-13

申请号：US29346387

申请日：2009-10-30

申请人： Ricky Hsu ,  Young Choi ,  Guillermo A. Gonzalez

设计人： Ricky Hsu ,  Young Choi ,  Guillermo A. Gonzalez

公开(公告)号：USD577320S1

公开(公告)日：2008-09-23

申请号：US29298845

申请日：2007-12-13

申请人： Young Choi ,  Roger Brown

设计人： Young Choi ,  Roger Brown

公开(公告)号：US20080125055A1

公开(公告)日：2008-05-29

申请号：US11643879

申请日：2006-12-22

申请人： Chi Ho Choi ,  Young Choi

发明人： Chi Ho Choi ,  Young Choi

IPC分类号： H04B1/00

CPC分类号： G06F3/04883 ,  G06F3/03547

摘要： An apparatus and method for controlling a mobile communication terminal based on contact that allows input of various user's contact information through a contact sensor are provided, which includes a contact sensor contact sensor that includes a plurality of contact switches arranged in a grid array and sensing the user's contact to produce contact signals. A contact information generator generates contact information using the contact signals. A controller determines whether the contact information is preset contact information, and executes a command that is set corresponding to the contact information if the contact information is preset contact information, or sets a command to be executed corresponding to the contact information if the contact information is not preset contact information. The grid arrangement of the contact switches allows input of contact information using various methods. Accordingly, a user can directly set or modify a method for inputting a command for controlling a function.

摘要翻译： 提供了一种用于基于允许通过接触传感器输入各种用户的联系信息的接触来控制移动通信终端的装置和方法，其包括接触传感器接触传感器，该接触传感器接触传感器包括布置成格栅阵列的多个接触开关， 用户联系人产生联系信号。 接触信息发生器使用接触信号产生接触信息。 控制器确定联系人信息是否是预置的联系人信息，并且如果联系人信息是预设的联系人信息，则执行与联系人信息相对应的设置的命令，或者如果联系人信息是 不预设联系信息。 接触开关的电网布置允许使用各种方法输入接触信息。 因此，用户可以直接设置或修改用于输入用于控制功能的命令的方法。

公开(公告)号：US20080042885A1

公开(公告)日：2008-02-21

申请号：US11632679

申请日：2006-04-25

申请人： Hisayuki Kunigita ,  Shi Cho ,  Yong Lee ,  Young Choi

发明人： Hisayuki Kunigita ,  Shi Cho ,  Yong Lee ,  Young Choi

IPC分类号： H04B1/40

CPC分类号： G06F3/0236 ,  G06F3/018

摘要： The present invention relates to a Hangeul input keypad and a method using the same. Basic consonants and basic vowels are assigned to the Hangeul input keypad, the number of the basic consonant-assigned keys is less than that of the basic vowel-assigned keys, the consonant keys and the vowel keys are disposed separately, and a shift key converting the basic consonants to extended consonants is disposed adjacent to the consonant keys to which the basic consonants convertible to the extended consonants are assigned. The Hangeul input keypad and method according to the present invention improves speed of Hangeul input, provides convenience in operation of consonant keys and a shift key, and ease of a user's learning of the Hangeul input method by optimizing the disposition of the consonants and vowels.

摘要翻译： 本发明涉及一种韩文输入键盘及其使用方法。 基本辅音和基本元音被分配给汉语输入键盘，基本辅音分配键的数量小于基本元音分配键的数量，辅音键和元音键分开设置，并且转换键转换 扩展辅音的基本辅音位于附属于可扩展辅音的辅音键旁边。 根据本发明的韩文输入键盘和方法提高了韩文输入的速度，提供了辅音键和移位键的操作的便利性，并且通过优化辅音和元音的配置，便于用户学习汉教输入法。

公开(公告)号：US20070209673A1

公开(公告)日：2007-09-13

申请号：US11547991

申请日：2005-01-27

申请人： Young Choi

发明人： Young Choi

IPC分类号： A45D2/40

CPC分类号： A45D1/06

摘要： A portable electric curling iron comprises an upper movable iron body (20) and a lower movable iron body (40), which are connected to an upper stationary iron body (10) and a lower stationary iron body (30), respectively, such that the upper and lower movable iron bodies (20, 40) can be selectively retracted into an extended from the upper and lower stationary iron bodies (10, 30) through openings (11, 31) respectively. The upper and lower movable iron bodies (20, 40) are provided with guide grooves (22, 42), in which guide protrutions (12, 32) formed at the upper and lower stationary iron bodies (10, 30) are engaged, respectively, such that the guide protrutions (12, 32) can be guided along the corresponding guide grooves (22, 42). Heating members (50) are attached to the upper and lower movable iron bodies (20, 40), respectively, while being opposite to each other.

摘要翻译： 便携式电动卷发器包括分别连接到上固定铁体（10）和下固定铁体（30）的上可动铁体（20）和下可动铁体（40），使得 上下可动铁体（20,40）可以分别通过开口（11,31）选择性地缩回到从上下固定铁体（10,30）延伸的延伸。 上下可动铁体（20,40）设有引导槽（22,42），其中形成在上下固定铁体（10,30）处的导向突起（12,32）分别接合 使得引导突起（12,32）能够沿着相应的引导槽（22,42）被引导。 加热构件（50）分别在彼此相对的情况下附接到上下可动铁体（20,40）。