公开(公告)号：US20080206567A1

公开(公告)日：2008-08-28

申请号：US11794634

申请日：2005-12-28

申请人： Byung Hoon Min ,  Kyung Heum Kim ,  Seung Bum Kim ,  Sung Soo Lee ,  Kyoung Bae Park ,  Nam Gyol Kim ,  Byoung Jae Yoo

发明人： Byung Hoon Min ,  Kyung Heum Kim ,  Seung Bum Kim ,  Sung Soo Lee ,  Kyoung Bae Park ,  Nam Gyol Kim ,  Byoung Jae Yoo

IPC分类号： B05D5/12 ,  B32B15/02 ,  B32B37/02 ,  C25D5/00 ,  C25D3/12 ,  B32B37/24

CPC分类号： H01B1/02 ,  C23C18/1635 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  C23C18/405 ,  C23C28/00 ,  C23C28/021 ,  C23C28/023 ,  C25D3/60 ,  C25D7/00 ,  C25D17/20 ,  H01L23/49816 ,  H01L24/01 ,  H01L24/80 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y02P70/613 ,  Y10T428/2991 ,  Y10T428/2993 ,  H01L2924/00

摘要： Plastic conductive particles having an outer diameter of 2.5 μm˜1 mm obtained by sequentially plating a 0.1˜10 μm thick metal plating layer and a 1˜100 μm thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and a method of manufacturing thereof. The method of manufacturing the plastic conductive particles includes preparing plastic core beads having excellent thermal properties and a high elastic modulus of compression, etching surfaces of the plastic core beads for surface treatment thereof, forming a metal plating layer via electroless plating to improve adhesion between the bead surface and the metal plating layer, and then forming a solder layer such that a sealed hexagonal barrel is immersed in an electroplating solution and then an electroplating process is conducted using a mesh barrel rotating 360° at 6˜10 rpm or a mesh barrel having a structure in which one surface of a conventional sealed hexagonal barrel is open, and rotating 200° in right and left directions at 1˜5 rpm, to manufacture plastic conductive particles having a size of 1 mm or less. The plastic conductive particles of this invention enable the maintenance of packaging gaps, and thus can be applied to IC packaging, LCD packaging and other conductive materials.

摘要翻译： 通过在具有高的塑料芯珠上顺序镀覆0.1〜10μm厚的金属镀层和1〜100μm厚的Pb焊料层或无铅焊料层，得到外径为2.5μm〜1mm的塑料导电性颗粒 弹性模量，及其制造方法。 制造塑料导电颗粒的方法包括制备具有优异的热性能和高弹性模量的塑性芯珠，用于表面处理的塑料芯珠的蚀刻表面，通过无电镀形成金属镀层，以改善 珠表面和金属镀层，然后形成焊接层，使得将密封的六边形圆筒浸入电镀溶液中，然后使用以6〜10rpm旋转360°的网筒进行电镀工艺，或者具有 常规密封六角筒的一个表面打开并以1〜5rpm左右旋转200度左右的结构，制造尺寸为1mm以下的塑料导电性粒子。 本发明的塑料导电颗粒能够保持包装间隙，因此可以应用于IC封装，LCD封装和其他导电材料。