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公开(公告)号：US20140053774A1
公开(公告)日：2014-02-27
申请号：US13951947
申请日：2013-07-26
CPC分类号： B05C3/09 , B05B16/20 , B05C3/00 , B05C5/002 , B05C11/11 , B08B3/041 , C23C18/1619 , Y10T137/8593
摘要： A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).
摘要翻译： 罐体100包括用于接收施加到板状工件10的处理液Q的液体接收部分2和用于保持施加到板状工件10的液体的液体保持部分4和用于引起 处理液Q从液体保持部分4溢出并朝着板状工件10向下移动，其中液体流出部分6的尖端6a从连接到液体保持部分的液体保持部分 部分4（或液体接收部分2）。
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公开(公告)号：US20190301048A1
公开(公告)日：2019-10-03
申请号：US16252903
申请日：2019-01-21
发明人： Teruyuki HOTTA , Kouji SHIMIZU , Masayuki UTSUMI , Masato ARATANI
摘要： A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath 2 is rotated, parts 20 contact an electrode 50 to be electroplated. In this event, a plating liquid 16 is used as circulated by a pump P. The plating liquid 16 is discharged to the outside through a gap in a side wall 80 for replacement of the plating liquid 16 or the like. During discharge, the plating liquid 16 is not circulated by the pump P. The gap 8 which is formed in the side wall 80 is formed to be smaller than the minimum dimension of the parts 20 on the inner side. The gap 8 is formed to be wider toward the outer side. Thus, water is discharged immediately.
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公开(公告)号：US20140116334A1
公开(公告)日：2014-05-01
申请号：US14038340
申请日：2013-09-26
发明人： Teruyuki HOTTA , Hisamitsu YAMAMOTO , Takahiro ISHIZAKI , Masayuki UTSUMI , Takuya OKAMACHI , Syunsaku HOSHI , Fujio ASA , Junji MIZUMOTO
IPC分类号： C23C18/16
CPC分类号： C23C18/1619 , C23C18/1628 , H05K3/0085 , H05K3/181 , H05K2203/1518
摘要： An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.
摘要翻译： 诸如化学镀铜罐200的罐包括具有喷嘴6的液体喷射部分4，用于将喷嘴6的处理液Q向处理对象倾斜向上喷射到水平面，并且撞击处理溶液Q 在板状工件10的上部区域上，使处理液Q沿板状工件10向下延伸。
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公开(公告)号：US20130295294A1
公开(公告)日：2013-11-07
申请号：US13729721
申请日：2012-12-28
CPC分类号： C23C18/08 , C23C18/1605 , C23C18/1633 , C23C18/1651 , C23C18/166 , C23C18/40
摘要： Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.
摘要翻译： 提供使用化学镀铜浴的无电镀铜浴和化学镀铜方法，不含甲醛的化学镀铜浴; 可在大约中性pH条件下使用; 改善电镀液的稳定性; 并且能够在控制图案之外的沉积的同时形成具有良好厚度的镀膜。 根据本发明的无电解镀铜浴含有水溶性铜盐和胺硼烷或其取代的衍生物作为还原剂; 不含甲醛; 并且其pH为4〜9，其中含有聚氨基多膦酸作为络合剂，阴离子表面活性剂，锑化合物和含氮芳族化合物。
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